• Korean Journal of Fisheries and Aquatic Sciences
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• v.10 no.1
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• pp.1-9
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• 1977

The purpose of this study is to complish a method of fish glue malting with residual products such as fish head and skin discarded from sea food processing. Using the skins of Alaska pollack and file fish from fillet packers, the optimum conditions of skin glue processing were investigated and physical and chemical properties of the product were also determined. The yields of Alaska pollack, Thelagra calcogramma, skin and file fish, Novodon modestus, skin to the total body weight were $4.6\%\;and\;5.0\%$ respectively. The optimum conditions for a $49.3\%$n yield Alaska pollack skin glue processing were considered the extraction of previously tinted in $0.1\%$ calcium hydroxide solution for 3 hours with the additional water as much as 3 times of sample weight at $70^{\circ}C$ for 3 hours under the controlled pH 5.0. The conditions for file fish skin glue were similar to those of Alaska pollack except the addition of five times of water to the weight of sample skin needed for extraction. The content of crude protein of Alaska pollack and file fish skin glue were $98.0\%\;and\;96.0\%$ respectively. The contents of crude ash and crude lipid were not different from that of chemical grade gelatin. Relative viscosity, melting point, gelation temperature and jelly strength of Alaska pollack skin glue marked 5.84, $21.8^{\circ}C,\;7.1^{\circ}C\;and\;10.0g$ respectively and those of file fish skin glue showed $5.79,\;25.0^{\circ}C,\;7.4^{\circ}C\;and\;11.6g$ respectively.The color and turbidity of Alaska pollack skin glue are slightly superior to those of file fish skin glue. It is supposed that the extract residue of skin glue is valuable for use the animal feeds by the results of amino acid composition. And the ratio of each amino acid content to the total amino acid of Alaska pollack and file fish skin glue is similar to that of chemical grade gelatin.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• The Korean Journal of Rheology
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• v.8 no.1
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• pp.58-68
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• 1996

고분자 가공에서 가장널리 사용되고 있는 사출공정은 비등온의 싸이클 공정이므로 사출조건에 따라 성형품은 다양한 형태의 열이력과 변형이력을 받게 되고 그 결과 최종성형 품의 기계적 물성이 현저히 달라지게 된다. 그러므로 우수한 물성을 갖는 성형품을 얻기위 해서는 열이력과 변형이력에 연관되어 나타나는 미세구조의 변화와 잔류응력을 최소화할수 있는 최적 성형조건의 선정이 대단히 중요하게 된다. 본 연구에서는 수치모사실험을 기초로 설정한 성형조건의 범위에서 다양한 사출성형실험을 수행하여 얻은 시편을 대상으로 미세구 조의 변화와 잔류응력에 미치는 성형조건의 영향을 조사함으로써 최적성형조건을 선정하기 위한 방안을 찾고자 하였다. 편광현미경을 사용하여 관찰한 결정성 고분자수지 시편의 내부 구조는 전형적인 skin-core 구조를 보일뿐만아니라 충전속도, 사출온도, 금형온도, 및 gate로 부터의 위치 변화에 따라 미세구조가 현저히 변함을 알수 있었으며 광탄성법과 layer removal method를 이용하여 조사한 무정형 고분지수 시편의 잔류응력은 금형온도와 사출압 에 가장 영향을 많이 받으며 두께 방향으로 parabola한 분포를 가짐을 알수 있었다. 이상의 결과로부터 사출조건의 변화에 따라 잔류응력과 내부구조가 현저히 변하게 되며 이는 성형 품의 물성에 직접적인 영향을 미치고 있음을 알수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.275-276
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.443-444
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.207-208
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.465-466
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.243-244
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.245-246
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• 2009