• Laser Solutions
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• v.16 no.2
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• pp.12-15
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• 2013

In this paper, we controlled the edge angle of fiber by using $CO_2$ laser. In order to control the angle, tilting angle of fiber on stage and the number of scan repetition are adjusted, and laser power is fixed at 30 W in the experiment. In the polishing result, the edge angle of fiber can be changed from $4^{\circ}$ to $8^{\circ}$, as changing the tilting angle and the number of scan repetition. This $CO_2$ laser polishing can fabricate ball lenses with various curvatures and a sharp probe as well as the edge angled fiber.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.3
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• pp.324-330
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• 2013

This paper describes a novel method to surface large optics mirror with an extremely high hardness, which could replace the high cost of the repetitive off-line measurement steps and the large ultra-precision grinding machine with ultra-positioning control of 10 nm resolution. A lot of diamond pellet to be attached on the convex aluminum base consists of a grinding tool for the concave large mirror, and the tool was pressured down on the large mirror blank. The tool motion at an interval on the spiral path was controlled with each feed rate as the dwell time in the conventional computer-controlled polishing. The shape to be surfaced was measured directly by a touch probe on the machine without any separation of the mirror blank. Total 40 iterative steps of the surfacing and measurement could demonstrate the form error of RMS $7.8{\mu}m$, surface roughness of Ra $0.2{\mu}m$ for the mirror blank with diameter of 1 m and spherical radius of curvature of 5400 mm.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.

• Journal of the Korean Society of Safety
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• v.17 no.3
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• pp.30-35
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• 2002

The magnetic abrasive polishing is the useful method to finish using magnetic power of a magnet. It's not a long time this method was introduced to korea as one of precision finishing techniques. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. The are rarely researcher in this field because of no-effectiveness of magnetic abrasive. The mechanism of this R&D is dealing with the dynamic state of magnet-abusive. This paper deals with mediocritizing magnetic polishing device into regular lathe and this experiment was conducted in order to get the best surface roughness at low cost. We need to continue the research on it. This paper contains the result of experiment to acquire the best surface roughness, not using the high-cost polishing material in processing. The average diameters of magnetic abrasive are the particles of 150$\mu\textrm{m}$, 250$\mu\textrm{m}$.

• The Optical Journal
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• s.105
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• pp.49-56
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• 2006

한국광학기기협회에서는‘한·일 광산업 기술협력’을 보다 효율적으로 추진하기 위하여 해마다 일본 연수기관 및 기업에 대한 현장연수를 실시하고 있는 가운데, 올해는 처음으로 지난 8월에 일본정밀공학회(JSPE)에서 주최하는‘차세대 초정밀광학부품 나노가공기술연수’를 실시했다. 연수기관은 일본 센다이 소재의 동북대학(Tohoku University)으로 구리야가와 츠네모토 교수가 교육을 담당했다. 주요 연수 내용으로는 마이크로 광학부품가공/초정밀 비구면 렌즈 가공/전기점성유체를 이용한 비구면 렌즈 코아 연마/특수광학렌즈 SPDT 가공/초고속 가공/마이크로 AJM 가공/마이크로 초음파가공이며 본 고에서는 직접 연수에 참가 못한 독자들을 위해 연수내용을 번역 게재하고자 한다. 이달에는 제1장 연삭가공의 기초 게재를 시작으로 11월호에 이어서 나머지 2,3,4장 교육과정내용을 게재할 예정이다.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.1-12
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• 2009

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.100-103
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• 2005

In this study, tool path control algorithm for aspherical surface grinding was derived and discussed. The aspherical surface actually means contact points between lens and tool. Tool positions are generally defined at the center of a tool, so there is difference between tool path and lens surface. The path was obtained from contact angle and relative position from the contact point. The angle could be calculated after differentiating an aspheric equation and complex algebraic operations. The assumption of the control algorithm was that x moves by constant velocity while z velocity varies. X was normal to the radial direction of lens, but z was tangential. The z velocities and accelerations were determined from current error and next position in each step. In the experiment, accuracy of the control algorithm was checked on a micro-precision machine. The result showed that the control error tended to be diminished when the tool diameter increased, and the error was under sub-micro level.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.690-693
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• 2003

Soft x-ray microscopy provides a unique set of capabilities in-between those of visible light and electron microscopy. It has long been recognized that nature provides a 'water window' spectral region between the K shell x-ray absorption edges of carbon (~290eV) and oxygen (~540eV), where organic materials show strong absorption and phase contrast, while water is relatively non-absorbing. This enables imaging of hydrated biological specimens that are several microns thick with high intrinsic contrast using x-rays with a wavelength of 2.3~4.4nm. Soft X-ray microscopy is therefore well suited to the study of specimens like single biological cells. The most direct advantage of X-ray microscope is their high spatial resolution when compared with visible light microscopes, combined with an ability to image hydrated specimens that are several microns with a minimum of preparation. Our study describes the conceptual design of soft x-ray microscope system based on a laser-based source for biomedical application with high resolution ($\leq$50nm) and short exposure time ($\leq$30sec).

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.257-257
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• 2010

디스플레이 산업의 발달로 화상 영상폰, 디지털 카메라, MP4, PMP, 네비게이션, LCD TV등의 가전 제품의 수요증가에 따라 이에 장착되는 LCD 패널의 생산력 향상과 원가 절감을 위한 검사 기술이 요구되고 있다. LCD 검사를 위한 Probe unit은 미세전기기계시스템(MEMS) 공정을 이용하여 제작된다. LCD 검사용 Probe unit는 LCD 가장자리 부분에 전기적 신호(영상신호, 등 기신호, 색상신호)가 인가되도록 하는 수 십 내지 수 백개의 접속 단자가 고밀도로 배치되는데, 이러한 LCD는 제품에 장착되기 전에 시험신호를 인가하여 화면의 불량여부를 검사하기 위한 점등용 부품으로 50 um 이하의 Pin간 거리를 유지하면서 정확한 Pin Alignment를 요구하는 초정밀 부품이다. 본 연구에서는 반도체용 Si wafer에 마스크 공정 및 slit etching 공정을 적용하여 목표인 30 um pitch의 Probe unit을 개발하기 위해 Deep Si Etching(DRIE) 장비를 이용하여 식각 공정에 따른 특성을 평가하였다. 마스크 공정은 500 um 두께의 양면 연마된 반도체용 Si wafer를 이용하였으며, thick PR을 사용하여 마스킹하여 식각공정을 수행하였다. Si 깊은 식각은 $SF_6$ 가스와 Passivation용으로 $C_4F_8$ 가스를 교대로 사용하여 수직방향으로 깊은 식각이 이루어지는 원리이다. SEM 측정 결과 30 um pitch의 공정 목표에 도달하였으며, 식각공정 결과 식각율 6.2 um/min, profile angle $89.1^{\circ}$로 측정되었다. 또한 상부 에칭공정과 이면 에칭공정에서 폭과 wall의 간격이 동일하였으며, 완전히 관통된 양면식각이 이루어졌음을 확인하였다. 또한 실제 사용되는 probe unit의 조립에 적합한 slit 공정을 위한 에칭특성을 조사하였다.

• Design & Manufacturing
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• v.11 no.2
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• pp.20-24
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• 2017

Recent industrial developments are constantly advancing, and rapid technological development is demanding high technology level in related fields. The need for polishing is increasing even more to improve quality. In order to improve the surface quality, the final finishing process or polishing process is a very important part. Research on super precise polishing method using MR fluid is actively being carried out in domestic and foreign countries. Fine magnetic abrasive grains are aligned in the direction of a magnetic force line formed by a magnetic field and serve as a brush to polish a metal surface. This method has the advantage that the shape of the tool is not fixed and is not affected by the shape of the workpiece or the machining area. We will design the electromagnets for the MR polish polishing system and apply the magnetic field analysis using the magnetic field analysis program (ANSYS). The data obtained through this process suggests an efficient method to increase the magnetic flux density important for polishing. We will investigate the influence of the Al6061-T6 specimen on the surface of the MR polishing machine based on the optimized design.