• Title/Summary/Keyword: 초음파접합

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A Study on the Detection of Interfacial Defect to Boundary Surface in Semiconductor Package by Ultrasonic Signal Processing (초음파 신호처리에 의한 반도체 패키지의 접합경계면 결함 검출에 관한 연구)

  • Kim, Jae-Yeol;Hong, Won;Han, Jae-Ho
    • Journal of the Korean Society for Nondestructive Testing
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    • v.19 no.5
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    • pp.369-377
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    • 1999
  • Recently, it is gradually raised necessity that thickness of thin film is measured accuracy and managed in industrial circles and medical world. Ultrasonic signal processing method is likely to become a very powerful method for NDE method of detection of microdefects and thickness measurement of thin film below the limit of ultrasonic distance resolution in the opaque materials, provides useful information that cannot be obtained by a conventional measuring system. In the present research. considering a thin film below the limit of ultrasonic distance resolution sandwiched between three substances as acoustical analysis model, demonstrated the usefulness of ultrasonic signal processing technique using information of ultrasonic frequency for NDE of measurements of thin film thickness. Accordingly, for the detection of delamination between the junction condition of boundary microdefect of thin film sandwiched between three substances the results from digital image processing.

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Thickness Assessment of Adhesive Layer in Inhomogeneous Layer by Guided Wave (유도초음파에 의한 비균질 적층의 접합층두께 평가)

  • Cho, Youn-Ho;Ham, Hyo-Sik;Choi, Heung-Ho
    • Journal of the Korean Society for Nondestructive Testing
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    • v.21 no.4
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    • pp.391-397
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    • 2001
  • The guided wave propagation in inhomogeneous multi-layered structures is experimentally explored based on theoretical dispersion curves. It turns out that proper selection of incident angel and frequency is critical for guided wave generation in multi-layered structures. Theoretical dispersion curves greatly depend on adhesive zone thickness, layer thickness and material properties. It was possible to determine the adhesive zone thickness of an inhomogeneous multi-layered structure by monitoring experimentally the change of dispersion curves.

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Vibration Analysis of ultrasonic Horn for Flip-Chip Bonding (플립칩 접합용 초음파 혼의 진동해석)

  • Kim, Il-Kwang;Hong, Sang-Hyuk;Lee, Soo-Il
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2008.11a
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    • pp.364-367
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    • 2008
  • Finite element model and the basic experimental method have been developed to help the design of the transverse ultrasonic horn for flip-chip bonding. With two types of design the horn performance and ultrasonic characteristics are verified by using laser vibrometer. These analysis and experiment results can be the fundamental data for ultrasonic horn design considering the vibration modes and performance.

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Ultrasonic testing technique for defects of weldment (용접결함의 초음파 탐상 기술)

  • 김동조
    • Journal of Welding and Joining
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    • v.8 no.1
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    • pp.12-22
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    • 1990
  • 우리나라와 선진 각국에서는 구체적인 부분까지 상당량을 규격(standard)으로 제정해 놓고 있다. 규격의 내용을 전반적으로 언급하기는 어렵기 때문에, 여기서는 범위를 좁혀 한 분야의 계통을 선택하여 설명하고자 한다. 즉, 강재의 맞대기 용접부에대하여, 사각탐촉자에 의한 탐상법을 예시적으로 선택하고 KS B 0896 규격을 중심으로 설명하는 내용이다. 이와 관련한 내용들은, 탐상장치의 성능시험, 거리진폭 특성곡선, 결함 및 탐상에 관한 사전준지, 결함의 탐상방법 등이며, 참고로 한국 일본 미국의 초음파 탐상시험에 관련된 규격명을 열거한다.

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A Study for Automotive Lamp Manufacturing System Control Composing Ultra melting Process (초음파 접합 공정을 합성한 자동차용 램프 생산시스템 제어에 관한 연구)

  • Lee, Il-Kwon;Kook, Chang-Ho;Kim, Seung-Chul;Kim, Ki-Jin;Han, Ki-Bong
    • Journal of the Korean Institute of Gas
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    • v.18 no.1
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    • pp.46-51
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    • 2014
  • The purpose of this paper is to study of the vehicle lamp manufacturing system composing ultrasonic waves connection process. Making lamp assembly plant, it was produced in the separate process as the injection molding, ultrasonic waves bonding, annealing in the constant temperature, lamp assembling and packing. But the improvement method producing the lamp was added with one-step process by one automation technique. As a result, welding with ultrasonic waves process, the method decreased the energy consumption and noise during ultrasonic waves welding. Therefore, this method used the mathematics modeling for checking validity, it selected the stability and suitable controller using transfer function of plant and bode chart. In this study, the $180^{\circ}$ revolution control system to turn injection part upside down was $M_{eq}\;lcos{\theta}(t)$ because of gravity influence. It effected to unstable condition a system. For solving this problem, it aimed the linearization and stabilization of system by elimination $M_{eq}\;lcos{\theta}(t)$ as applying Free-forward control technique.

Development of Automated Ultrasonic Testing Program for Piping Holdings (배관 용접부 자동 초음파검사 프로그램 개발)

  • Choe, Seong-Nam;Yu, Hyeon-Ju;Kim, Hyeong-Nam;Hwang, Won-Geol
    • Proceedings of the KWS Conference
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    • 2006.10a
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    • pp.283-285
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    • 2006
  • Non Destructive Examination for welds is one of the most important processes to ensure the integrity of facilities of Nuclear power plants. An automated ultrasonic testing program is developed for welding inspection. A test block with side EDM notch is inspected with this program. This paper shows that the developed automated ultrasonic testing program is quite effective.

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Round robin test for flaw sizing of piping weld (배관 용접부 결함 평가에 대한 round robin test)

  • 윤병식;김용식;양승한;김영호;이희종
    • Proceedings of the KWS Conference
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    • 2004.05a
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    • pp.308-310
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    • 2004
  • 1980년대 초 미국의 비등형 경수로(Boiling Water Reactor : BWR) 원자력발전소 배관계통의 입계 응력 부식 균열(Inter-Granular Stress Corrosion Crack) 검사 결과 및 미국 EPRI(Electric Power Research Institute)에서 실시한 round robin test 결과에서 기존 초음파 검사 방법의 실효성에 많은 문제점이 제기 되었다. (중략)

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Development of bonding processes for micro-optical and thermo-fluidic components (광/열유체 부품의 접합공정 개발)

  • 김정호;이지혜;유중돈;최두선
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.137-140
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    • 2002
  • The main objectives in the first year include selection of the MEMS bonding methods and feasibility study of selected methods. The ultrasonic bonding method is chosen for MEMS packaging, and the processes to provide localized heating are proposed. The ultrasonic bonding process is analyzed using a lumped model. Preliminary experiments using the eutectic solder and copper pin were performed to verify possibility to MEMS packaging. The preliminary results show possibility of the ultrasonic bonding method for MEMS packaging.

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