• 제목/요약/키워드: 초음파접합

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초음파 적외선 열화상을 이용한 접합부의 미세균열 검출 연구 (Study on the Micro Crack Detection in Joints by Using Ultrasound Infrared Thermography)

  • 박희상;최만용;박정학;이승석;허용학;이보영;김재성
    • 비파괴검사학회지
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    • 제32권2호
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    • pp.162-169
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    • 2012
  • 본 논문은 초음파 적외선 열화상과 위상잠금 방법을 이용하여 이종금속용접(STS304 and SA106 Gr. b)된 파이프의 응력부식균열 결함을 검출하였다. 초음파 가진장치는 출력 250 Watt, 주파수 20 kHz이었다. 실험 결과 이종금속용접부의 파이프 내부에 위치한 균열을 적외선 열화상을 이용하여 검출할 수 있었다. 실제 PT검사를 통하여 배관 내부의 균열이 하나가 아닌 일정한 범위 안에 하나 이상의 크랙이 존재하여 열화상 이미지 상에 넓은 범위의 hot spot 이미지를 만들어 냈음을 파악할 수 있었다. 또한 기존 기술로 검출이 용이하지 못한 마이크로 폭의 미세균열을 검출할 수 있었다. 또한, 초음파탐상기술은 $10\;{\mu}m$ 미세크랙의 폭을 갖은 균열을 쉽게 검출하지 못하였다. 그러나 초음파 적외선 열화상 기술은 결함 검출하였다.

공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화 (Manufacturing Cost Optimization of Ultrasonic Horn for Flip-chip Bonding using Tolerance Design)

  • 김종혁;권원태;이수일
    • 한국정밀공학회지
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    • 제29권8호
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    • pp.879-886
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    • 2012
  • The ultrasonic horn used for bonding of flip chip has been designed to vibrate at a natural frequency. The ultrasonic horn must be manufactured accurately in physical terms, because the small change of mechanical properties may result in the significant change of natural frequency. Therefore, tight tolerance is inevitable to keep the natural frequency in acceptable range. However, since tightening of the tolerance increases the manufacturing cost significantly, trade-off between the cost and accuracy is necessary. In this research, an attempt was made to design the ultra sonic horn within acceptable natural frequency while the manufacturing cost was kept as low as possible. For this purpose, among the 18 tolerances of physical terms of the ultrasonic horn, the most important 4 factors were selected using Taguchi method. The equation to relate those main factors and the natural frequency was made using response surface method. Finally, optimal design scheme for minimum manufacturing cost without a loss of performance was determined using SQP method.

오스테나이트계 스테인리스강 304 용접부의 초음파 형상 인식 평가를 위한 카오스 시뮬레이터의 구축 (Construction fo chaos simulator for ultrasonic pattern recognition evaluation of weld zone in austenitic stainless steel 304)

  • 이원;윤인식;장영권
    • Journal of Welding and Joining
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    • 제16권5호
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    • pp.108-118
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    • 1998
  • This study proposes th analysis and evaluation method of time series ultrasonic signal using the chaos feature extraction for ultrasonic pattern recognition. Features extracted from time series data using the chaos time series signal analyze quantitatively weld defects. For this purpose, analysis objective in this study is fractal dimension and Lyapunov exponent. Trajectory changes in the strange attractor indicated that even same type of defects carried substantial difference in chaosity resulting from distance shifts such as 0.5 and 1.0 skip distance. Such differences in chaosity enables the evaluation of unique features of defects in the weld zone. In quantitative chaos feature extraction, feature values of 4.511 and 0.091 in the case of side hole and 4.539 and 0.115 in the case of vertical hole were proposed on the basis of fractal dimension and Lyapunov exponent. Proposed chaos feature extraction in this study can enhances ultrasonic pattern recognition results from defect signals of weld zone such as side hole and vertical hole.

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플립칩 접합용 초음파 혼의 목표 주파수와 모드를 고려한 2차원 및 3차원 위상최적화 설계 (2D and 3D Topology Optimization with Target Frequency and Modes of Ultrasonic Horn for Flip-chip Bonding)

  • 하창용;이수일
    • 한국소음진동공학회논문집
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    • 제23권1호
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    • pp.84-91
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    • 2013
  • Ultrasonic flip-chip bonding needs a precise bonding tool which delivers ultrasonic energy into chip bumps effectively to use the selected resonance mode and frequency of the horn structure. The bonding tool is excited at the resonance frequency and the input and output ports should locate at the anti-nodal points of the resonance mode. In this study, we propose new design method with topology optimization for ultrasonic bonding tools. The SIMP(solid isotropic material with penalization) method is used to formulate topology optimization and OC(optimal criteria) algorithm is adopted for the update scheme. MAC(modal assurance criterion) tracking is used for the target frequency and mode. We fabricate two prototypes of ultrasonic tools which are based on 3D optimization models after reviewing 2D and 3D topology optimization results. The prototypes are satisfied with the ultrasonic frequency and vibration amplitude as the ultrasonic bonding tools.

중수로핵연료 봉단마개 용접부의 기계적 특성과 초음파 시험 (Mechanical Strength and Ultransonic Testing of End Cap Welds in Pressurized Heavy Water Reactor Fuel)

  • 이정원;최명선;정성훈;고진현
    • Journal of Welding and Joining
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    • 제9권4호
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    • pp.60-68
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    • 1991
  • The weld quality of end cap welds in Pressurized Heavy Water Reactor (PHWR) Fuel is extremely important for the fuel performance in the nuclear reactor. The quality of resistance upset welds is currently evaluated mainly by the metallographic examination although it reveals only two weld cross-sections in a circumference welds. This investigation was, firstly, carried out to determine whether the ultrasonic examination would be applied to detect weld defects in the end cap welds and, secondly, to measure the mechanical strength of upset butt welds as a function of phase shift percentage. The major results obtained in this study are as follows: 1. The weld current and amount of upset shrinkage linearly increased with increasing the phase shift percentage. 2. Above the phase shift 55%, the defects in the welds were completely eliminated with increasing the phase of sound weld was over the thickness of cladding tube. 3. The ultrasonic testing well detected such defects in the end cap welds as upset external crack, upset split, corner crack and irregular weld flash comparing with the results of metallography. 4. The micro-fissure in the corner of the end cap welds was reliably detected by ultrasonic testing. 5. The mechanical strength in the welds increased with increasing phase shift percentage but the fracture did't occur in the welds above 55%.

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폴리에틸렌 배관의 전기융착부 비파괴검사기술에 관한 연구 (Study for Non-Destructive Testing of Polyethylene Electrofusion Joints - Ultrasonic Imaging test)

  • 길성희;권정락
    • 한국가스학회지
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    • 제8권3호
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    • pp.31-36
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    • 2004
  • 본 연구에서는 PE배관 연결망에 있어 취약 부위인 두 개의 배관이 연결되는 부분 즉, 전기응착부에 대한 검사방법을 살펴보고 그 중에서도 위상배열 초음파를 이용한 비파괴 탐상방법에 대하여 고찰하였다. 그리고 정상 및 비정상 전기응착 시험편을 설계 및 제작하여 위상배열 초음파를 이용하여 PE배관 전기응착부에 대한 비파괴 탐상을 실시하였다. 마지막으로 현장에서 발생하는 전기융착 접합 실태를 조사한 후 원인을 분석하고 결함 유형을 분류하였다. 즉 융합 불량, 모래 섞임, 기포, 삽입 불량, 용입 과다의 5가지로 분류를 하였다.

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플립칩 접합용 초음파 혼의 CFD 열유동 해석 (Heat transfer analysis of CFD at the Ultrasonic horn bonding flip chip)

  • 심현석;리광훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2750-2753
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    • 2008
  • This paper introduce the CFD analysis for predicting the heat transfer at the Ultrasonic horn. Approximately Ultrasonic horn separates two part. One is preheating part and the other is cooling part. Temperature of preheating part rise up by $260^{\circ}C$ that make it possible to attach a chip to a semiconductor. Also there is a piezo material in the cooling part. When piezo work, it generates heat of $100^{\circ}C$. It can stand by $150^{\circ}C$. But the high temperature conducted from the preheating part has a bad affect on the piezo. These situation make it necessary cooling at piezo. Previously except of the piezo, all of them are composed of the SUS440c that has good thermal conductivity. This study shows way that not only cooling the piezo but also cutting off the conduction between preheating part and cooling part by using the Ti and Duralumin that have low thermal conductivity compare with the SUS440c. Conclusion of CFD analysis that the heat coming from the piezo can't be transferred the horn cause of the Ti and Duralumin.

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초음파와 신경망을 이용한 오스테나이트계 스테인리스강 304 용접부의 결함 검출 및 평가 (The Defect Detection and Evaluation of Austenitic Stainless Steel 304 Weld Zone using Ultrasonic Wave and Neuro)

  • 이원;윤인식
    • Journal of Welding and Joining
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    • 제16권3호
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    • pp.64-73
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    • 1998
  • This paper is concerned with defects detection and evaluation of heat affected zone (HAZ) in austenitic stainless steel type 304 by ultrasonic wave and neural network. In experiment, the reflected ultrasonic defect signals from artificial defects (side hole, vertical hole, notch) of HAZ appears as beam distance of prove-defect, distance of probe-surface, depth of defect-surface on CRT. For defect classification simulation, neural network system was organized using total results of ultrasonic experiment. The organized neural network system was learned with the accuracy of 99%. Also it could be classified with the accuracy of 80% in side hole, and 100% in vertical hole, 90% in notch about ultrasonic pattern recognition. Simulation results of neural network agree fairly well with results of ultrasonic experiment. Thus were think that the constructed system (ultrasonic wave - neural network) in this work is useful for defects dection and classification such as holes and notches in HAZ of austenitic stainless steel 304.

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초음파 플립칩 접합 모듈의 위상최적화 설계 및 성능 실험 (Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging)

  • 김지수;김종민;이수일
    • Journal of Welding and Joining
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    • 제30권6호
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    • pp.113-119
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    • 2012
  • Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

초음파 신호분석을 이용한 접착접합 이음의 결함평가 (Evaluation of Flaws in Adhesively Bonded Joint using Ultrasonic Signal Analysis)

  • 황영택;오승규;한준영;장철섭;윤송남;이원;김환태
    • Journal of Welding and Joining
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    • 제22권2호
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    • pp.38-45
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    • 2004
  • Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And ultrasonic diagnosis was evaluated by p-wave sensor of 10MHz. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of A16061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.