• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.4 s.107
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• pp.324-329
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• 2006

In this paper, a resonator with the substrate integrated waveguide(SIW) structure at the satellite communication band is presented. The SIW structure is realized by via-holes on the dielectric substrate and has an advantage of integration with other circuits. For the measurement, a designed back-to-back transition has the insertion loss of 0.4 dB at 18 GHz. Also, the quality factor of the resonator with the SIW structure including back-to-back transition is obtained to be 222. The high-Q resonator with the SIW structure can be used in filter, oscillator, and voltage controlled oscillator.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.4
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• pp.120-126
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• 1989

IC chip layout pattern recognition algorithms using image processing techniques are being developed for the automation of manufacturing and inspecting chips. Recognitioin of chip pattern requires feature extraction from nach rrame of chip image adn needs to match the feature data through all frames. In this paper, vertex position and form having layout information are extracted by the feature straightening algorithm, and global coordinates of layout pattern are extracted by the feature straightening algorithm, and global coordinates of layout pattern are obtainnd by vertex form matching from the overlapped area of neighbour frame.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.1
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• pp.19-25
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• 2002

This paper presents novel architectures for power amplifier (PA) relying on 3rd harmonic-tuning technique and dual feeding antenna structure for the isolation of the Tx and the Rx ports. Active integrated antenna (AIA) with power amplifier makes the problem of the isolation between the Tx and the Rx ports occur So, this paper suggests dual feeding and dual resonant structures of the AIA with PA are possible to obtain the high isolation between the Tx and the Rx signals. Dual resonant triangular microstrip antenna, which can replace power amplifier tuning circuit, with slots-loaded and characteristic of the isolation between the Tx and the Rx ports using inset microstrip line feeding and probe feeding methods is proposed and experimentally studied for the case of thin substrate.

• Journal of the Economic Geographical Society of Korea
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• v.26 no.3
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• pp.202-222
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• 2023

This study traces the growth and changes in the spatial distribution and characteristics of media cluster in Seoul by focusing on the co-evolution of film and TV production. To identify the spatial distribution and aggregation of film and broadcast TV production, we measure their spatial auto-correlation based on Moran's I and LISA, using the data from the Census on Establishments of the National Statistical Office. In addition, the eleven semi-structured interviews conducted with workers in the media industries, such as film crews and TV drama producers, help to clarify the complexity and dynamics of diverse factors that affect spatial distribution of media cluster. This multi-method study shows the increasing polycentricity of media cluster in the last decade. Gangnam, Mapo, Yeouido, Gangseo-Yeongdeungpo, and Seongsu have emerged as key hubs for media industries, particularly in light of changes in the transportation system and the real estate market. The finding indicates the co-evolution of film and broadcast TV production, demonstrating how the characteristics of the creative industry and metropolitan changes are intertwined with each other in shaping the geographical pattern of the media cluster.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2017.04a
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• pp.146-146
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• 2017

현대의 스마트폰 및 태블릿pc등을 가능하게 만든 집적 기술 중의 하나는 3차원 집적 회로(3D-IC)와 같은 패키징 기술이다. 이러한 첨단 3차원 집적 기술은 메모리집적을 통한 대용량 메모리 모듈 개발뿐만 아니라, 메모리와 프로세서의 집적, high-end FPGA, Back side imaging (BSI) 센서 모듈, MEMS 센서와 ASIC 집적, High Bright (HB) LED 모듈 등에 적용되고 있다. 3D-IC의 3차원 모듈 제작 시에는 기존에 발생하지 않았던 여러 가지 파괴 모드들이 발생하고 있는데 Thermal/Photonic Emission 장비 등 기존의 2차원 결함분리 (Fault Isolation) 기술로는 첨단의 3차원 적층 제품들에서 발생하는 불량을 비파괴적으로 혹은 3차원적으로 분리하는 것이 불가능하므로, 비파괴 3차원 결함 분리 기술은 향후 선행 제품 적기 개발에 매우 필수적인 기술이다. 본 연구는 3D-IC 반도체의 비파괴적 내부결함 검사를 위하여 가시광선-근적외선 대역(351nm~1770nm)의 InGaAs (Indium Galium Arsenide) 계열 영상검출기 (imaging detector)를 사용하여 분광 시스템 광학 설계를 통한 초분광 영상 기반 검출 모듈을 제작하였다. 제작된 초분광 영상 기반 검출 모듈을 이용하여 구리 회로 위에 실리콘 웨이퍼가 3단 적층 된 반도체 더미 샘플의 초분광 영상을 촬영하였으며, 촬영된 초분광 영상에 대하여 Chemometrics model 기반의 분석기술을 적용하여 실리콘 웨이퍼 내부의 집적 구조에 대한 검사가 가능함을 확인하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.12
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• pp.2664-2669
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• 2011

We proposed a new method to improve the resolution of far object image in curving effective integral imaging system. Basically, the curving effective integral imaging(CEII) system can improve the resolution of the reconstructed images with an increased sampling rate of elemental images. However, in the case when an object located far from the lenslet array is picked up, the low resolution of the reconstructed images of the far object has been a primary problem because the sampling rate is very low. In order to solve this drawback, by using the direct pixel mapping(DPM) method the EIA picked up from a far object is transformed into a new EIA that virtually looks like the EIA picked up from the object originally located close to the lenslet array. From this new EIA, highly resolution-enhanced images of far object could be reconstructed in the CEII system. To show the feasibility of the proposed method, simulation results are compared with the conventional method.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.110-120
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• 2010

In this paper, we propose a tunable SIW(Substrate Integrated Waveguide) using dielectric screws for eliminating the phase imbalance of large size power distribution networks(PDN). Alumina screws partially inserted into several through holes of the tunable SIW section effectively change the phase shift without S-parameter degradation. ${\pm}33.9^{\circ}$ measured phase imbalance of a large conventional 9 GHz SIW-PDN of $370\;mm{\times}195\;mm$ size has been greatly reduced to ${\pm}4.65^{\circ}$. We expect that the proposed tunable SIW plays an important role for a light-weight, high performance substrate integrated phased array system(Si-PAS) and large size SIW circuit applications.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.12
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• pp.1093-1098
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• 2012

Commercial Off the Shelf(COTS) Integrated circuits(ICs) are being increasingly considered for use in space and military applications. Therefore, There is a need to implement standard tests and requirements to ensure reliability of COTS ICs. This paper presents an overview of the ICs screen procedure and methods under the European Cooperation for Space Standardization (ECSS) and Tests Method Standard Microcircuits (MIL-STD-883). We describes the COTS ICs screen test guidelines that are mainly focused after encapsulating. In addition, COTS linear bipolar IC is investigated to evaluate the reliability requirements. The experiment results showed that COTS IC is satisfied with high reliability requirements.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.2
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• pp.95-103
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• 2019

In this paper, we present a microstrip-to-substrate integrated waveguide(SIW) transition and microstrip-to-hollow SIW(HSIW) transition for Ku-band satellite communication systems. For the complete utilization of the HSIW, a structure filled with air instead of a dielectric material, a microstrip-to-HSIW transition is designed, fabricated, and compared with a microstrip-to-SIW transition. A back-to-back microstrip-to-SIW transition is measured in the range 12~18 GHz; it exhibits a return loss ${\geq}20dB$ and an insertion loss of $1.5{\pm}0.2dB$. In contrast, a back-to-back microstrip-to-HSIW transition exhibits a return loss of at least 15 dB and an insertion loss of $0.55{\pm}0.2dB$ in the same frequency range.

• The Journal of the Korea Contents Association
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• v.21 no.3
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• pp.375-389
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• 2021

Recent years have seen a rapid boom of the 4th industry and relevant policies in regions. However there are only a few studies about the impact of the 4th industry on the local economy. This study examines the agglomeration effects of the 4th industry on regional economy by using a spatial statistical models. As a result, it was found that the agglomeration of the 4th industry had a positive effect on the productivity of the local economy, while there is not good enough evidence to prove the relationship between the 4th industry and the income of the region. These findings indicate that the impact of the agglomeration of the fourth industry on the local economy is limited. In addition, the impact on the local economy was different by the type of the fourth industry, and the manufacturing industry and financial and insurance industries had a positive impact on the growth of the local economy.