• Title/Summary/Keyword: 진공 브레이징

Search Result 45, Processing Time 0.02 seconds

Evaluation of the STS303-Cu vacuum-brazed by Ni-based alloy (Ni기 삽입금속에 의해 진공 브레이징된 STS303-Cu의 특성평가)

  • Chang, Se-Hun;Hong, Ji-Min;Choi, Se-Weon;Kang, Chang-Seog;Kim, Ho-Sung;Oh, Ik-Hyun
    • Korean Journal of Materials Research
    • /
    • v.17 no.6
    • /
    • pp.293-297
    • /
    • 2007
  • Microstructure and tensile strength of the vacuum brazed stainless steel(STS303) and Cu were investigated. For brazing, the BNi-2, 3, 4, 6 and 7 (A.W.S standard) were used as filler metals. The Oxides such as $Cr_2O_3$ and $SiO_2$ were observed at brazed layers between STS303 and Cu matrix. Also, the intermetallic compounds of Cr-B and Ni-P were observed at brazed layers. Brazed STS303-Cu specimens with BNi-2, 3, 4 filler metals showed almost elastic deformation followed by plastic yielding and strain hardening up to a peak stress. On the other hand, it is likely that the fracture of the brazed specimens with BNi-6 and 7 was occurred in elastic range without plastic yielding up to a peak stress. Among these filler metals, the BNi-2 brazed at $1050^{\circ}C$ showed excellent wettability and the highest tensile strength (101.6MPa).

A Characteristic of Microstructures in Bonding Interlayer of Brazed Titanium to Copper (브레이징한 Ti/Cu 접합계면부의 미세조직 특성)

  • 김우열;정병호;이성렬
    • Journal of Welding and Joining
    • /
    • v.13 no.3
    • /
    • pp.106-115
    • /
    • 1995
  • To know the bonding phenomena of Ti/Cu brazed joint, a characteristic of microstructures in bonding interlayer of vacuum brazed pure Ti to Cu has been studied in the temperature range from 1088 to 1133K for various bonding times using Ag-28wt%Cu filler metal. Also intermediate phases formed in bonded interlayer and behavior of layer growth have been investigated. The obtained results in this study are as follows: 1) Liquid insert metal width at the each brazing temperature was proportional to the square root of brazing time, and it was considered that the liquid insert metal width was controlled by the diffusion rate process of primary .alpha.-Cu formed at the Ti side. 2) Intermediate phases formed near the Ti interface were .betha.-Ti and intermetallic compounds TiCu, Ti$_{2}$Cu, Ti$_{3}$Cu, and TiCu. 3) .betha.-Ti formed in Ti base metal durig brazing transformed to lamellar structure, .alpha.-Ti + Ti$_{2}$Cu. The structure came from the eutectoil decomposition reaction in cooling. And the width of .betha.-Ti layer was proportional to the square root of brazing time, and it was considered that the growth of .betha.-Ti layer was controlled by interdiffusion rate process in .betha.-Ti. 4) The layer growth of TiCu, Ti$_{3}$Cu$_{4}$ and TiCu, phases formed near the Ti interface was linerface was linearly proportional to the brazing time, and it was considered that the layer growth of these phases was controlled by the chemical reaction rate at the interface.

  • PDF

Waveguide Broad-wall Slot Array Antenna Study for Millimeter-Wave Seeker Using Cross Monopulse Axes (십자형 모노펄스 축을 적용한 밀리미터파 탐색기용 도파관 광벽 슬롯 배열 안테나 조립체 연구)

  • Jung, Chae-Hyun;Baek, Jong-Gyun;Lee, Kook-Joo;Park, Chang-Hyun;Kwon, Jun-Beom
    • The Journal of the Institute of Internet, Broadcasting and Communication
    • /
    • v.17 no.5
    • /
    • pp.209-215
    • /
    • 2017
  • In this paper, an antenna having 2-axes cross monopulse for Ka band millimeter-wave seeker is designed and antenna performance is verified through vacuum-brazing method for fabrication and measurement. Also, by designing and manufacturing a waveguide circulator the antenna including the circulator is measured. Radiating part of the antenna takes optimized slot lengths and offsets from Elliot's array synthesis procedure using the generic algorithm and feeding part for cross monopulse axes uses the folded waveguide to optimize the S-parameter result. Based on this method, the antenna has 33.3 dBi gain, $3.5^{\circ}{\pm}0.5^{\circ}$ beamwidth, below -23 dB SLL through fabricating and measuring. It is found that antenna characteristics is similar to design results.

The wetting and interfacial reaction of vacuum brazed junction between diamond grit(graphite) and Cu-13Sn-12Ti filler alloy (다이아몬드 Grit(흑연)/ Cu-13Sn-12Ti 필러합금 진공 브레이징 접합체의 젖음성 및 계면반응)

  • Ham, Jong-Oh;Lee, Chang-Hun;Lee, Chi-Hwan
    • Proceedings of the KWS Conference
    • /
    • 2009.11a
    • /
    • pp.66-66
    • /
    • 2009
  • Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

  • PDF

The Wetting and Interfacial Reaction of Vacuum Brazed Joint between Diamond Grit(graphite) and Cu-13Sn-12Ti Filler Alloy (다이아몬드 grit(흑연) / Cu-13Sn-12Ti 삽입금속 진공 브레이징 접합체의 젖음성 및 계면반응)

  • Ham, Jong-Oh;Lee, Chi-Hwan
    • Journal of Welding and Joining
    • /
    • v.28 no.3
    • /
    • pp.49-58
    • /
    • 2010
  • Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.