• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.315-318
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• 2003

Recently, condenser tube which is used for a cooling system of automobiles is mainly manufactured by the conform extrusion but this method is inferior as compared with direct extrusion in productivity per the unit time and in the equipment investment. Therefore, it is essential for the conversion of direct extrusion with porthole die. The direct extrusion with porthole die can produce condenser tube which has the competitive power in costs and qualities compared with the existing conform extrusion. This study is designed to evaluate metal flow, welding pressure, extrusion load tendency of mandrel deflection that is affected by variation of porthole shape in porthole die. Estimation is carried out using finite element method under the non-steady state. Also this study was examined into the cause of mandrel fracture through investigating elastic deformation of mandrel during the extrusion.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.415-417
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• 2009

A low temperature decal (LTD) transfer method is tried to fabricated hydrocarbon (HC) membrane based MEA. Sandwiched structures of outer ionomer/catalyst/carbon coating/substrate, which had been developed for Nafion membrane, are used for transfer of catalyst to the HC membrane. Performances of the HC MEA before and after 500hr continuous operation are compared and it is found that a severe delamination occurs at the interface between the HC membrane and the catalyst layer, which is the main reason of the low performance and its degradation. The delamination is due probably to the different nature of HC membrane to the Nafion ionomer. A substitutional method, therefore, is suggested to overcome this. In such a way, the outer ionomer process is removed and the low transfer rate of catalyst by skipping the ionomer process is compensated with optimization of other process variables such as transfer time or temperature. The resulting performance is superior to the original LTD method, which can be explained in terms of low resistive components both in ohmic and kinetic.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.188-190
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• 2007

The MEA with the catalyst layer containing PtRu black and 60 wt. %Pt/C as their anode and cathode catalysts. For find to effect of carbon support, the MEA with platinum black for cathode catalyst was fabricated. The performance of the MEA with the catalyst layer containing (PtRu black:60 wt.% Pt/C) as their anode and cathode catalyst has shown competitively higher value than the performance of the MEA with the catalyst layer containing (PtRu black:Pt black) as their anode and cathode catalyst.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.883-888
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.

• Journal of the Korean Ceramic Society
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• v.18 no.2
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• pp.99-104
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• 1981

Glass-ceramics possessed a number of characteristics which suggested their suggested their use for sealing to metals. The choice of particular glass-ceramics compositions for this application is governed by various factors, including workability of the glasses, thermal expansion characteristics and the matching of these to appropriate metals. Other properties, such as mechanical strength, determined the performance of glass-ceramics to metal seals. The purpose of the present study was to investigate direct sealing behaviour of copper to $Li_2O-ZnO-SiO_2$ system glass-ceramics. The design of the seal was a concentric seal which might contribute to the strong bond formation by providing compressive stress during thermal excursions. Tensile strengths of sealing layers were measured by Instron test machine. The layers were examined by electron probe microanalyzer. Crsystallization rate was increased with the amount of ZnO or $Li_2O$, and ZnO increased the sealing strength, but $Li_2O$ lowered it. Sealing mechanism was due to the formation of metal oxides, which acted as binder between copper and glass-ceramics. The nickle-plated copper seal with 10% $Li_2O$ and 30% ZnO was the most strong seal, and its sealing strength was more than 56kg/$\textrm{cm}^2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.10
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• pp.615-624
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• 2017

This study investigated the various physical and electrical effects of silicon direct bonding. Direct bonding means the joining of two wafers together without an intermediate layer. If the surfaces are flat, and made clean and smooth using HF treatment to remove the native oxide layer, they can stick together when brought into contact and form a weak bond depending on the physical forces at room temperature. An IR camera and acoustic systems were used to analyze the voids and bonding conditions in an interface layer during bonding experiments. The I-V and C-V characteristics are also reported herein. The capacitance values for a range of frequencies were measured using a LCR meter. Direct wafer bonding of silicon is a simple method to fuse two wafers together; however, it is difficult to achieve perfect bonding of the two wafers. The direct bonding technology can be used for MEMS and other applications in three-dimensional integrated circuits and special devices.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.1-10
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• 1994

이 글에서는 비파괴검사개론에 관하여 알아보았다. 1. 비파괴검사의 의의 1.1 비파괴검사의 역사 1.2 비파괴검사의 원리 1.3 비파괴검사의 목적과 역할 1.3.1 품질관리 1.3.2 생산원가의 절감 1.3.3 품질의 평가 1.3.4 점검 1.4 비파괴검사자의 역할 2. 비파괴검사자의 방법 2.1 방사선투과시험 2.1.1 직접촬영법 2.1.2 투시법 2.1.3 전자사진법 2.1.4 계기법 2.2 초음파탐상시험 2.2.1 음향검사와 초음파탐상 2.2.2 초음파의 성질과 종류 2.2.3 접촉매질 2.2.4 초음파 탐상 방법 2.2.5 초음파 탐촉자 2.3 자기탐상시험 2.3.1 자기탐상 원리 2.3.2 자기탐상 방법 1) 자장측정 탐상법 2) 자기기록 탐상법 3) 탐사 코일법 4) 자분탐상시험 2.3.3 자분탐상시험 2.4 침투탐상시험 2.4.1 침투탐상시험의 원리 2.4.2 침투탐상시험법의 기본 1) 침투탐상시험의 종류 2) 현상체의 종류 2.4.3 침투탐상시험의 장단점 2.5 전자유도시험 (와전류탐상법) 2.5.1 와전류의 발생과 탐지 2.5.2 와전류의 탐지 2.5.3 와전류 탐촉자 2.5.4 와전류 탐상시험의 적용과 장단점.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1988-1990
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• 1996

In this work, we have grown or evaporated thermal oxide and E-beam oxide on the (100) oriented n-type silicon wafers, respectively and they were directly bonded with another silicon wafer after hydrophilization using solutions of three types of $HNO_3$, $H_{2}SO_{4}$ and $NH_{4}OH$. Changes of average surface roughness after hydrophilizations of the single crystalline silicon wafer, thermal oxide and E-beam evaporated silicon oxide were studied using atomic force microscope. Bonding interfaces of the bonded pairs were inspected using scanning electron microscope. Void and non-contact area of the bonded pairs were also inspected using infrared transmission microscope.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.436-437
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• 2008

초기투자비용의 과다 발생으로 제한적으로 시공되고 있는 지중송전케이블의 역사는 1971년 154kV급 OF케이블이 처음으로 한국전력에 의해 상용운전후 현재에 이르고 있으며, 최근들어 지중케이블에서 발생된 송전선로 고장은 대부분 대형화되고 있어 초창기 시공된 케이블 종류의 대부분을 차지하고 있는 OF 케이블의 현상태를 정확하게 진단하고 각종 현상들을 분석하여 결론을 도출하지 않으면 안된다. 실제 계통에서 운전되고 있는 설비를 철거하여 상태를 판정할 수 있는 여건이 아니기 때문에 케이블의 현상태를 정확하게 분석하기 위해서는 절연유의 분석 등 간접적인 방법을 택하지 않을 수 없다. OF 케이블에 있어서 급유조는 케이블의 성능에 가장 직접적인 영향을 미치는 구성요소이며, 급유조에서 기준치보다 $2{\sim}5$배에 해당되는 이상가스의 발생원인을 파악하여 예방대책을 수립할 수 있게 되었다. 분리기의 용접부분 또는 접합부분에 틈이 생기지 않도록 하고 틈 부위에는 세라믹이나 폴리머등으로 코팅하여 $H_2$가스의 과다 발생을 방지할 수 있었다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.10
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• pp.1541-1550
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• 2001

This paper describes experimental investigations in the direct extrusion of copper clad aluminum rods through conical dies. Composite materials consist of two or more different material layers. Copper clad aluminum composite materials are being used fur economic and structural purposes and the development of an efficient production method of copper clad aluminum composite material rods by extrusion is very important, It is necessary to know the conditions in which successful uniform extrusion ,and sound cladding may be carried out without any defects in the direct extrusion. There are several variables that have an influence on determining a sound clad extrusion. In order to investigate the influence of these parameters on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with various extrusion temperatures, extrusion ratios and semi-cone angles of die. Subsequently, the microscopic inspection of interface bonding is carried out for extruded products. By measuring hardness, along extrusion way of products, a variation of hardness has been discussed. Proportional flow state has been considered by measuring radius ratio of Cu sleeve and Al core before and after extrusion.