• Proceedings of the KWS Conference
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• 2009.11a
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• pp.62-62
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• 2009

석탄화력발전소의 CO2배출량 감소와 고효율, 대용량화로 인해 초초임계압(USC:Ultra Super Critical) 화력발전소의 건설이 증가하고 있다. USC 발전소는 효율향상을 위한 증기온도와 압력의 상승 때문에 보일러 고온고압부에 기존의 소재에 비해 고온강도와 내산화성의 재료물성이 향상된 신소재 적용이 불가피하다. 특히 사용된 신소재 중에서 보일러 본체를 구성하는 수냉벽관(Water wall), 과열기와, 재열기용 튜브 및 후육부인 헤더와 배관재로 기존의 2.25Cr-1Mo강을 개량한 2.25Cr-1.6W계 내열강이 적용되고 있다. 2.25Cr-1.6W강은 SMI와 MHI가 공동개발한 소재로 1995년 튜브제품이, 1999년에 단조, 파이프재, 플레이트제품이 ASME code case로 등재되었고, 2009년 ASME code case 2199-4로 개정되어 사용 중이다. 이 소재는 2.25Cr-1Mo강에 고온강도 개선을 위해 석출강화효과가 있는 V과 Nb을 첨가하였고, 탄화물의 열적안정성과 고용강화효과 증대를 위해 W을 첨가하였다. 그리고 제작성과 용접성 및 재료의 인성 향상을 위해 B첨가와 C함량을 낮추었다. 합금성분의 첨가와 조정에 의해 고온강도는 개선되었지만, 보일러 설치 및 보수를 위한 용접과정에서 용접금속과 CGHAZ(Coarse Grain HAZ)에서 용접균열이 발생하였다. 대부분의 용접균열은 용접결함이나 고온 혹은 저온균열이 아닌 2.25Cr-1.6W계강의 강도 개선을 위해 첨가한 V과 Nb이 용접후열처리 도중 입내에 MX형태의 미세석출로 입내를 강화시킴으로서 발생한 재열균열 민감성 증대에 기인된 것으로 판단된다. 이에 본 연구에서 용접 및 후열처리 과정에서 용접금속과 HAZ에서 발생하는 용접금속의 응력분포를 전산해석을 통해 확인하고 실제 후육파이프 용접부에서 잔류응력을 측정해 비교하였다. 용접부 응력분포는 SYSWELD 프로그램을 사용해 해석을 수행하였고, 발전소 실배관재의 용접부 응력측정은 수평부 측정이 용이하도록 지그를 부착한 Potable 잔류응력측정기를 사용해 Hole Drilling Method(HDM)를 적용하여 잔류응력을 측정하였다. 해석 결과 CGHAZ부위의 잔류응력이 용접금속과 기타 부위에 비해 높은 응력분포를 나타냈으며, 이는 CGHAZ와 용접용융선 부근에서 균열이 발생하는 실제값과 일치하는 결과를 보였다. 실제 배관재 용접부에서 측정한 잔류응력값은 항복응력의 약 50% 이하 응력값을 나타냈다. 배관 구조에 기인한 시스템응력의 영향을 제거하기 위해 배관재 용접부를 중심으로 양끝단을 절단 후 용접부에서 측정한 응력은 항복응력 대비 25%수준의 낮은값을 보였다. 그러나 배관재가 장기간 고온환경에 노출되었고 용접금속 내부의 균열이 발생한 상태에서 측정하였기 때문에 용접잔류응력은 상당부분 해소되어 상대적으로 낮은 응력값이 얻어진 것으로 판단된다.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.1
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• pp.15-19
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• 2005

Conventional eddy current testing has been used for the detection of the defect-like fatigue crack in the conductive materials, such as aluminum, which uses a sinusoidal signal with very narrow frequency bandwidth, Whereas, the pulsed eddy current method uses a pulse signal with a broad bandwidth. This can allow multi-frequency eddy current testing, and the penetration depth is greater than that of the conventional eddy current testing. In this work, a pulsed eddy current instrument was developed for evaluating the metal loss. The developed instrument was composed of the pulse generator generating the maximum square pulse voltage of 40V, an amplifier controlled up to 52dB, an A/D converter of 16 bit and the sampling frequency of 20 MHz, and an industrial personal computer operated by the Windows program. A pulsed eddy current probe was designed as a pancake type in which the sensing roil was located inside the driving roil. The output signals of the sensing roil increased rapidly wich the step pulse driving voltage かn off, and the latter part of the sensing coil output voltage decreased exponentially with time. The decrement value of the output signals increased as the thickness of the aluminum test piece increased.

• Journal of the Korea institute for structural maintenance and inspection
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• v.19 no.4
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• pp.18-24
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• 2015

Non-destructive testing (NDT) methods are widely used in the construction industry to diagnose the defects/strength of the concrete structure. However, it has been reported that the results obtained from NDT are having low reliability. In order to resolve this issue, four kinds of NDT test (ultrasonic velocity measurements by P-wave and S-wave and the impact resonance methods by longitudinal vibration and deformation vibration) were carried out on 180 concrete cylinders made with two kinds of mix proportions. The reliability of the NDT results was analyzed and compared through the measurement of the actual compressive strength of the concrete cylinders. The statistical analysis of the results was revealed that the ultrasonic velocity method by S-wave is having lowest coefficient of variation and also most capable of stable observation. Analytical equations were established to estimate the compressive strength of the concrete from the obtained NDT results by relating the actual compressive strength. Moreover the equation established by the ultrasonic velocity method by S-wave had the highest coefficient of determination. Further studies on the stability of non-destructive testing depending on various mixing conditions will be necessary in the future.

• 대한공업교육학회지
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• v.31 no.1
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• pp.200-210
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• 2006

This C-ring test, normally employed for evaluating susceptibility to stress-corrosion cracking, was determined to be a suitable small scale test to evaluate PWHT(Post-Weld Heat Treatment) cracking susceptibility. This test is possible to incorporate an actual weld, to introduce a notch into the coarse grained HAZ(Heat Affected Zone), to load the coarse grained HAZ any level of stress ad, most importantly, since the C-ring is an approximately constant strain type test, the stress decreases with time at temperature in a manner similar to that of an actual steel weldment. The procedure employed in making the C-ring was presented in the experimental procedure section, however, several points deserve further discussion. The walls of the weld groove are made along radial lines form the center of th var in order to obtain an HAZ which is oriented perpendicular to the walls of the machined C-ring. Therefore, the plane of maximum stress will be aligned through the HAZ and, therefore, crack propagation will not be forced to deviate form the plane of maximum stress in order to remain in the coarse grained HAZ as is the case with the Y groove test.

• Solar Energy
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• v.17 no.4
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• pp.3-11
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• 1997

Because grain boundaries in polycrystalline silicon act as potential barriers and recombination centers for the photo-generated charge carriers, these defects degrade conversion effiency of solar cell. To reduce these effects of grain boundaries, we investigated various influencing factors such as thermal treatment, various grid pattern, selective wet etching for grain boundaries, buried contact metallization along grain boundaries, grid on metallic thin film. Pretreatment above $900^{\circ}C$ in $N_2$ atmosphere, gettering by $POCl_3$ and Al treatment for back surface field contributed to obtain a high quality poly-Si. To prevent carrier losses at the grain boundaries, we carried out surface treatment using Schimmel etchant. This etchant delineated grain boundaries of $10{\mu}m$ depth as well as surface texturing effect. A metal AI diffusion into grain boundaries on rear side reduced back surface recombination effects at grain boundaries. A combination of fine grid with finger spacing of 0.4mm and buried electrode along grain boundaries improved short circuit current density of solar cell. A ultra-thin Chromium layer of 20nm with transmittance of 80% reduced series resistance. This paper focused on the grain boundary effect for terrestrial applications of solar cells with low cost, large area, and high efficiency.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.40 no.2
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• pp.1-9
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• 2003

We develop an experimental system to inspect a metal mask and, in this paper, introduce its inspection algorithm. This system is composed of an ASC(Area Scan Camera) and a belt type xy-table. The whole area of the metal mask is divided into several inspection blocks. The area of each block is equal to FOV(Field of View). For each block, the camera image is compared to the reference image. The reference image is made by gerber file. The rotation angle of the metal mask is calculated through the linear equation that is substituted two end points of horizontal boundary of a specific hole in a camera image. To calculate the position error caused by the belt type xy-table, HT(Hough-Transform) using distances among the holes in two images is used. The center of the reference image is moved as much as the calculated Position error to be coincided with the camera image. The information of holes in each image, such as centroid, size, width and height, are calculated through labeling. Whether a holes is mado correctly by laser machine or not, is judged by comparing the centroid and the size of hole in each image. Finally, we build the experimental system and apply this algorithm.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.394-400
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• 2014

In this study, we fabricated ITZO thin films on glass substrates with various RF power from 30 to 60W and investigated the electrical, optical and structural properties. ITZO thin film deposited at 50W exhibited the largest figure of merit ($10.52{\times}10^{-3}{\Omega}^{-1}$) and then its resistivity and sheet resistance were $3.08{\times}10^{-4}{\Omega}-cm$ and $11.41{\Omega}/sq.$, respectively. As results of optical characterization, average transmittance of all ITZO thin films were over 80%. ITZO thin films had amorphous structure regardless of the RF power. The FESEM and AFM results showed that all ITZO thin films have a very smooth surface having no cracks and defects and the film deposited at 50W exhibit the smallest surface roughness of 0.254nm. We found that a amorphous ITZO thin film is a very promising material for replacing ITO in the next display device such as OLED.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.7
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• pp.2541-2548
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• 2010

This paper describes the calculation for characteristic impedance of transmission line with periodic structures such as defected ground structure (DGS) and photonic bandgap (PBG). The previous method which uses the ${\lambda}$/4 transmission line model is reviewed and its disadvantage that the calculated characteristic impedance is strongly dependent on the frequency is discussed. The characteristic impedance of transmission lines with periodic structures are calculated using the ${\lambda}$/4 transmission line model and analytic method. The calculated characteristic impedance by the latter method is an almost constant value while that from the first method depends on the frequency strongly. In addition, the characteristic impedance of the transmission line with PBG is calculated and proposed, while it has been rarely studied ever. S-parameters are obtained from the measurement using the fabricated sample as well as simulation, and used for calculating the characteristic impedances and comparison. The characteristic impedances calculated from the measured S-parameters agree well with the simulated results. It is well described that the analytic method to calculate the characteristic impedance of transmission lines on uniform dielectric structures can be applied successfully to the transmission lines with periodic structures such as DGS and PBG.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.225-232
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• 2011

Reactive ion etching (RIE) technique for maskless surface texturing of mc-silicon solar wafers has been applied and succeed in fabricating a grass-like black-silicon with an average reflectance of $4{\pm}1%$ in a wavelength range of 300~1,200 nm. In order to investigate the optimized texturing conditions for mass production of high quantum efficiency solar cell Surface characteristics such as the spatial distribution of average reflectance, micrscopic surface morphology and minority carrier lifetime were monitored for samples from saw-damaged $15.6{\times}15.6\;cm^2$ bare wafer to key-processed wafers as well as the mc-Si solar cells. We observed that RIE textured wafers reveal lower average reflectance along from center to edges by 1% and referred the origin to the non-uniform surface structures with a depth of 2 times deeper and half-maximum width of 3 times. Samples with anti-reflection coating after forming emitter layer also revealed longer minority carrier lifetime by 40% for the edge compared to wafer center due to size effects. As results, mc-Si solar cells with RIE-textured surface also revealed higher efficiency by 2% and better external quantum efficiency by 15% for edge positions with higher height.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.456-456
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• 2010

CMOS 소자가 서브마이크론($0.1\;{\mu}m$) 이하로 스케일다운 되면서 단채널 효과(short channel effect), 게이트 산화막(gate oxide)의 누설전류(leakage current)의 증가와 높은 직렬저항(series resistance) 등의 문제가 발생한다. CMOS 소자의 구동전류(drive current)를 높이고, 단채널 효과를 줄이기 위한 가장 효율적인 방법은 소스 및 드레인의 얕은 접합(shallow junction) 형성과 직렬 저항을 줄이는 것이다. 플라즈마 도핑 방법은 플라즈마 밀도 컨트롤, 주입 바이어스 전압 조절 등을 통해 저 에너지 이온주입법보다 기판 손상 및 표면 결함의 생성을 억제하면서 고농도로 얕은 접합을 형성할 수 있다. 그리고 얕은 접합을 형성하기 위해 주입된 불순물의 활성화와 확산을 위해 후속 열처리 공정은 높은 온도에서 짧은 시간 열처리하여 불순물 물질의 활성화를 높여주면서 열처리로 인한 접합 깊이를 얕게 해야 한다. 그러나 접합의 깊이가 줄어듦에 따라서 소스 및 드레인의 표면 저항(sheet resistance)과 접촉저항(contact resistance)이 급격하게 증가하는 문제점이 있다. 이러한 표면저항과 접촉저항을 줄이기 위한 방안으로 실리사이드 박막(silicide thin film)을 형성하는 방법이 사용되고 있다. 본 논문에서는 (100) p-type 웨이퍼 He(90 %) 가스로 희석된 $PH_3$(10 %) 가스를 사용하여 플라즈마 도핑을 실시하였다. 10 mTorr의 압력에서 200 W RF 파워를 인가하여 플라즈마를 생성하였고 도핑은 바이어스 전압 -1 kV에서 60 초 동안 실시하였다. 얕은 접합을 형성하기 위한 불순물의 활성화는 ArF(193 nm) excimer laser를 통해 $460\;mJ/cm^2$의 에니지로 열처리를 실시하였다. 그리고 낮은 접촉비저항과 표면저항을 얻기 위해 metal sputter를 통해 TiN/Ti를 $800/400\;{\AA}$ 증착하고 metal RTP를 사용하여 실리사이드 형성 온도를 $650{\sim}800^{\circ}C$까지 60 초 동안 열처리를 실시하여 $TiSi_2$ 박막을 형성하였다. 그리고 $TiSi_2$의 두께를 측정하기 위해 TEM(Transmission Electron Microscopy)을 측정하였다. 화학적 결합상태를 분석하기 위해 XPS(X-ray photoelectronic)와 XRD(X-ray diffraction)를 측정하였다. 접촉비저항, 접촉저항과 표면저항을 분석하기 위해 TLM(Transfer Length Method) 패턴을 제작하여 I-V 특성을 측정하였다. TEM 측정결과 $TiSi_2$의 두께는 약 $580{\AA}$ 정도이고 morphology는 안정적이고 실리사이드 집괴 현상은 발견되지 않았다. XPS와 XRD 분석결과 실리사이드 형성 온도가 $700^{\circ}C$에서 C54 형태의 $TiSi_2$ 박막이 형성되었고 가장 낮은 접촉비저항과 접촉저항 값을 가진다.