• 한국주조공학회지
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• 제15권4호
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• pp.360-367
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• 1995

Effects of metal coating treatment on SiC particle on wetting behavior and interfacial strength were studied. Experimental variables are included types of coated metallic films such as Cu and Ni-P, and temperatures of heat-treatment under vacuum. The experimental results concerning wetting phenomena of liquid Al on SiC, showed that coating treatment of metallic film on SiC particles remarkably improves the wetting behavior of liquid Al on SiC, especially in the case of Ni-P coating. The interfacial strength of Al/SiC composites made of coated SiC plate was higher than that of the composite with non-coated SiC plate although the coating treatment was not perfect.

• 한국재료학회지
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• 제10권1호
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• pp.3-6
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• 2000

지상에서는 과편정 합금의 응고시 일반적으로 조성과 밀도가 크게 다른 두 액상의 분리가 일어난다. 이외에 선택적 젖음성과 합체와 같은 인자들이 과편정 합금의 일방향응고시에 균일한 결정 성장을 어렵게 만든다. 그래서 이러한 불균일성을 제거하는 여러 가지 응고 방법들을 검토하고 일방향 응고와 더불어 초음파 에너지를 이용한 새로운 실험 결과를 제시하였다. 20kHz의 초음파를 진폭 및 합금 조성과 같은 변수들을 변화시켜 투명한 유기 과편정 Succinonitrile-Glycerol계에 적용하여 균일한 응고 조직을 얻었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.175-177
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• 2006

Electrically Conductive Adhesives(ECAs) with solderable particles have been developed as an alternative to Pb-free solders. Our previous study proved that good wettability of solder particle is a prerequisite for the establishment of conduction paths. In this paper, two types of ECAs were formulated and the wetting characteristic low-melting-point Sn-In solder on Cu and Ni/Au pads was investigated. It was found that Sn-In solder in the developed resin material with reduction capability shows good wettability, especially on Cu pad.

• 한국분무공학회지
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• 제20권3호
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• pp.181-186
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• 2015

This study presents the dynamic wetting characteristics of an impact droplet on hole-patterned textured surfaces. The flat surfaces were manufactured by a drilling machine to generate the micro-order holes, leading to make the surface hydrophobic. Other flat surfaces were fabricated by the anodizing technique to make hydrophilic texture surfaces with a nanometer order. For hydrophilic and hydrophobic textured surfaces with similar texture area fractions, the impinging droplet experiments were conducted and compared with flat surface cases. As results, an anodized textured surface decreases apparent equilibrium contact angle and increases contact diameters, because of increase in contact area and surface energy. This is attributed to more penetration inside holes from larger capillary pressure on nanometer-order holes. On the other hand, temporal evolution of the contact diameter is smaller for the hydrophobic textured surface from less penetration on the micro-order holes.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2008년도 추계학술발표논문집
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• pp.368-370
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• 2008

대한민국 대표 축제로 자리 잡은 보령머드축제의 핵심 프로그램인 머드 셀프마사지 행사의 재미와 다양성을 부여하기 위하여, 색상이 함유된 머드에 관한 연구를 수행하였다. 머드 고유의 낮은 명도를 조절하고자 이산화티탄을 첨가하여 머드의 질감을 유지하면서 색상이 발현되는 이산화티탄의 함량을 실험하고, 결정된 혼합비율에 황색산화철을 첨가하여 색상의 발현도를 색차계, 육안검사, 사용감 등으로 판단하였다. 결정된 색상은 물에 젖음 시 발색정도와 세척상태를 검토하여 보령머드 축제 프로그램인 머드 셀프마사지 행사에 사용하여 축제의 다양성을 높이고 또한 한국의 고유색인 오방색을 나타낼 수 있는 유색머드를 개발하고자 하였다.

• 한국세라믹학회지
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• 제37권12호
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• pp.1172-1177
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• 2000

최근 콘크리트 보호 재료는 코팅을 이용하는 과거의 방법에서 함침을 이용하는 기법으로 전환하였다. 이중 발수제는 콘크리트의 표면의 특성을 변화시키는 것으로 친수성의 콘크리트를 소수성 물질을 결합시켜 물에 의한 젖음을 방어하는 것으로 콘크리트에 사용하였을 경우 콘크리트의 고유한 표면 장력을 작게 변화시키고 장력이 큰 물질 중의 하나인 물의 흡수를 방어하게 한다. 본 실험은 발수제의 성능 평가를 위하여 다공질의 재료인 콘크리트의 접촉각을 측정하여 그 변화를 관찰하였으며, 발수제들의 우수한 기능 중의 하나인 통기성을 시편의 중량 감소로 측정하였다. 발수제로 n-octyl ethoxy silane을 사용한 콘크리트 시편의 흡수 능력은 사용하지 않은 것의 약 10% 정도로 측정되었으며 시편의 수분 중량 감소는 7일 동안 90~130%로 관찰되어 통기성이 유지되어 콘크리트의 강도 유지에 효과적임을 알 수 있었다. 또한 겉보기 접촉각은 처리하지 않은 시편에서 24~33$^{\circ}$로 측정되었으나 처리된 시편의 최초면에서 130~141$^{\circ}$이었으며 2mm의 연마면에서는 127~132$^{\circ}$로 측정되어 콘크리트 표면 장력 변화가 유지되고 있음을 알 수 있었다.

• Journal of Welding and Joining
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• 제20권5호
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• Journal of Welding and Joining
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• 제18권6호
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• 한국표면공학회지
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• 제35권1호
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• 한국분무공학회지
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• 제17권1호
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• pp.9-13
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• 2012

This study investigates experimentally evaporation characteristics of nanofluid droplets containing 50 nm alumina($Al_2O_3$) particles and the wettability changes on a hydrophilic glass surfaces. From the captured digital images by using a CMOS camera and a magnifying lens, we examined the effect of particle concentration on droplet evaporation rate which can be indirectly deduced from the measured droplet volumes varying with time. In particular, with the use of a digital image analysis technique, the present study measured droplet perimeters and the contact angles to study the wetting dynamics during evaporating process. In addition, we compared the measured total evaporation time with theoretically estimated values. It was found that as the volume fractions of nanofluid increased, the total evaporation time and the initial contact angles decreased, while the droplet perimeters increased.