• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.3
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• pp.176-184
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• 2007

The objective of this paper is to suggest a nonlinear analysis process to predict the structural behavior and strength of composite basement wall member combined with H-Pile. Therefore, the structural behavior of composite basement wall is studied and the special nonlinear characteristics of each elements such as H-Pile, concrete wall, and shear connectors are idealized using ATENA program. Finally, the result is compared with previous test result. Research result shows that there is a good co-relation between analysis and test results even if analysis result has little bit higher initial stiffness than test result. It can be concluded that the nonlinear behavior of composite basement wall is suitably predicted by using the contact element model in ATENA program as shear connector element.

• Korean Journal of Materials Research
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• v.7 no.3
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• pp.224-228
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• 1997

Rolling contact fatigue tests were performed for two types silicon nitrides using disk- type specimens. Materials showed a fatigue behaviour similar to that typically found in metallic materials From the fractographic and metallographic observations, it has been found that the crack initation in the silicon nitrides subjected to rolling contact fatigue is to be induced by cyclic subsurface shear stress, as is known in steel bearing. On the mid-sections of the specimens, many subsurface cracks which lay parallel to the contact surface can be found at a depth where fluctuation of the Herzian shear stress was the maximum.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1255-1261
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• 2004

A variational approximation procedure is introduced to study the contact stresses between a representative asperity and a feature generally happening in superfinishing processes such as FAM. After a description of the model under consideration is presented, a system of governing equation for the model is derived fullowed by the assumptions made in order to make progress in model development. Final computation is made to evaluate contact stresses on an elastic asperity tip in small scale in size and a computer simulation is performed for detailed surface profile variations on a representative feature. Numerical results are presented along with a discussion of the conclusions that can be drawn from this analysis.

• Journal of the Korean Institute of Gas
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• v.17 no.1
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• pp.73-80
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• 2013

This study presents sealing behavior and endurance safety of V-grooved o-rings as functions of a strain, compression stress, and contact normal stress using a FEM technique. The FEM results on the sealing behavior and endurance safety show that the maximum strain, maximum compression stress, and maximum contact normal stress of V-grooved o-rings are approximately 1.2 times higher than those of conventional solid o-rings. This is why that an o-ring has a V-groove in the center between two overlapped circles, which is very effective in sealing for ball valves, pressure vessels, and gas equipment. And the extrusion failure in V-grooved o-rings does not take place under an increased gas pressure due to a V-groove. This may extend sealing life compared with that of a conventional solid o-ring.

• Journal of the Korean Society for Nondestructive Testing
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• v.33 no.2
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• pp.154-159
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• 2013

In this paper, the effect of bolt clamping force and form accuray of contact surface between mirror and mount on mirror surface was studied. Normally, mirror used in reflecting optical system was assembled with mount by bolts or adhesive. In this case, the tension caused by bolt clamping force or adhesive force may distort the mirror surface. Also, form accuracy error of the contact surface have a negative impact on wrenched mirror surface which assembled by bolts or adhesive. In this study, stress and distorted displacements on mirror surface were analyzed according to the different contact surface form accuracies and bolt clamping forces by using the finite element analysis method.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.12 no.3
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• pp.363-370
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• 1999

This study presented an modeling method for the connections in mixed structure with reinforced concrete columns and steel beam using finite element method. The contacting surfaces between concrete and steel are modeled using master-slave contact algorithm and the incompatible mode elements were used in the steel tube subjected to bending. The characteristics of mixed structure was that diaphragm was used for transferring force from beam to column. The three dimensional nonlinear analysis was performed and the analytical results compared with experimental results in order to prove modeling method.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.10
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• pp.5974-5979
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• 2014

Lightweight parts with very uniform precision are manufactured by an indent method and the press technique has been improved. Upon assembly with an indent method, a deformation force due to the compressive force occurs between the pin and hole and the contact surface is affected by damage. Therefore, a 3 dimensional model was made using the CATIA program and the damage on the surface contacted with indent was estimated through the ANSYS program in this study. In the analysis result, the maximum load applied at the PCB plate was 21.3 N when the pin goes through the PCB plate. When PCB plate came out of the pin, the maximum load was 19.24 N. As the structural analysis result, the maximum equivalent stress of Pin 1 was 192.96MPa because the maximum stress occurs at Pin 1 among all parts of this study model. By examining the damage property of the contacted indent and applying this study result to the design of real indentation, the damage can be prevented and the durability can be estimated.

• Journal of the Korean Institute of Gas
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• v.18 no.4
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• pp.51-55
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• 2014

This paper was analyzed for a sealing characteristics of single lip contact type o-ring and multiple lip contact type packing for a swivel joint using the finite element method. According to the FE analysis, a conventional o-ring produces a maximum contact normal stress of 2.5MPa for a supplied LP gas pressure of 1.8MPa, which is related to the sealing performance. But, a sealing performance of newly invented multi-lip packing produces a maximum contact normal stress of 3.01MPa, which is 20.4% higher than that of a conventional o-ring. And an extrusion of a conventional o-ring, which is strongly related to the sealing endurance safety, was occurred at a supplied gas pressure of 1.62MPa. But, a multi-lip packing does not produce up to the gas pressure of 1.8MPa. This means that a new type of multi-lip packing may have excellent sealing characteristics because of no extrusion for high gas pressure. Thus, multi-lip packing with multiple lip contacts may be useful for high sealing and endurance safety compared to that of the conventional o-ring with a single lip contact.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.23 no.4
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• pp.403-407
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• 2010

Gecko adhesion system consists of beam-shaped seta and spatula which has the role of adhesive pad. In this paper, adhesion mechanism of gecko adhesion system is performed by using adhesive beam contact model. this model has a feature of non-uniform stress profile on the contact surface and adhesion/detachment mechanism is determined by the tensile stress of the contact region. a spatula tip pad has the role of reduction of maximum tensile stress and adhesive force is increased due to this effect. As for a reverse loading case, maximum compressive stress drops by the spatula effect and this cause unsymmetric loading conditions between adhesion and detachment forces. In this study, finite element method is used for the analysis of adhesive beam contact model and the results for spatula effect are presented.