• Composites Research
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• v.33 no.3
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• pp.147-152
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• 2020

In this study, void behavior of composite laminate by local internal pressure gradient due to structural geometry and surface film application condition was experimentally evaluated through fabrication of spar/skin integrated structure specimens. Viscosity comparison and thermal analysis for both carbon fiber prepreg and surface film were conducted and cure characteristic and rate difference were analyzed. 2 types of spar/skin integrated structural specimens were prepared based on different application condition of surface film. Subsequently, those specimens were evaluated through visual surface inspection, non-destructive and destructive inspection. In a specimen #1 with full application of surface film, low pressurized area of composite laminate created by pressure gradient of structural geometry had voids. It exhibited that voids could not be evacuated and were locked in cured laminate by the influence of pre-cured surface film with relatively faster cure rate. In a specimen #2 without surface film, it revealed that all internal voids disappeared in the cured laminate. Therefore, it is verified that surface film acts as barrier film preventing void movement and evacuation during autoclave cure.

• Composites Research
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• v.20 no.2
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• pp.27-31
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• 2007

"Structural surface becomes an antenna." This term, CAS, indicates antenna embedding in structural surfaces. The CAS is composed of several composite laminates and Nomex honeycombs, and microstrip antenna elements are inserted between layers with designed configurations. Constituent materials are selected considering electrical contributions as well as mechanical performances. Antenna design with adhesive films are impossible because of their thin and rough distributions between honeycomb and substrate. Therefore, adhesive effects on antenna performances in CAS are experimentally investigated, CAS with targeted impedance and radiation characteristics are designed considering adhesive effects. multilayer

• Composites Research
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• v.30 no.3
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• pp.181-187
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• 2017

The effect of nanoscopic and microscopic Fe, $Fe_3O_4$, and Ni particles and their shapes and substrate materials on the heating behavior of thermoplastic polyurethane (TPU) adhesive films was investigated via induction heating. The heat generation tendency of $Fe_3O_4$ particles was higher than that shown by Fe and Ni particles in the TPU adhesive films. When the Fe and Ni particle size was larger than the penetration skin depth, the initial heating rate and maximum temperature increased with an increase in the particle size. This is attributed to the eddy current heat loss. The heating behavior of the TPU films with Ni particles of different shapes was examined, and different hysteresis heat losses were observed depending on the particle shape. Consequently, the flake-shaped Ni particles showed the most favorable heat generation because of the largest hysteresis loss. The substrate materials also affected the heating behavior of the TPU adhesive films in an induction heating system, and the thermal conductivity of the substrate materials was determined to be the main factor affecting the heating behavior.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.127-127
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• 2000

다이아몬드상 카본(Diamond-like Carbon, DLC) 필름은 비정질 재료로서 다이아몬드와 유사한 높은 경도, 내마모성, 화학적 안정성, 그리고 광학적 특성을 가지고 있으며, 낮은 마찰계수와 높은 탄성률 등으로 인해 많은 분야에서 응용이 연구되고 있는 재료이다. 그러나 DLC 필름이 이러한 우수한 특성이 가지고 있음에도 불구하고 수 GPa에 이르는 높은 압축 잔류 응력으로 인해 응용에 제약을 받고 있다. 이러한 압축 잔류 응력이 상당한 값에 이르게 되면 기판의 구속에서 벗어나게 되어, 기판으로부터 떨어지게 되고 굽힘을 받게 되는 delamination buckling 현상이 일어나기도 한다. 본 연구에서는 높은 잔류 응력으로 인해 자연적으로 발생하는 buckling 현상과 식각 과정을 통해 인위적으로 기판의 제한으로부터 필름을 완화시키는 freehang 방법을 이용하여 필름이 기판에 접착되는데 필요한 에너지를 평가하려고 한다. 본 실험에서는 rf-PACVD 장비를 이용하여 필름을 증착하였다. 이때 전극과 플라즈마 사이의 바이어스 음전압은 -100~700 Vb로 변화를 주었으며, 합성압력은 9mTorr로 고정하였다. 사용한 반응 가스는 메탄(CH4)이고, 아르곤(Ar)을 이용하여 모든 실험에서 동일하게 기판을 전처리 하였다. buckling 현상을 관찰하기 위해 사용된 기판은 slide glass이고, freehang을 제작하기 위해 사용된 기판은 (100) p-type Si wafer 이다. freehang 제작시 사용한 식각 용액은 KOH(5.6mol)이며 외부 요인을 제거하기 위해 7$0^{\circ}C$ 항온조를 사용하였다. Buckling 된 필름과 freehang은 광학 현미경과 전자 주사 현미경에 의해 관찰되었으며, 사인 함수 형태의 곡면을 가지고 있었다. 또한 freehang 제작시 각각의 주기와 진폭을 통해, 필름과 기판사이의 계면에너지와 buckling 되면서 새로 생성된 두 표면에너지 차이를 구할 수 있게 되고, 이를 통해 접착에너지를 평가할 수 있었다.

• Journal of Adhesion and Interface
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• v.3 no.3
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• pp.15-21
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• 2002

The modified polyethylene(m-PE) films were prepared from aqueous dispersions which were synthesized by reacting poly(ethylene-co-methylacrylate) with aqueous KOH and ammonia solution to attach -COOK, $CONH_2$, and COOH as pendent groups in the polyethylene backbones. Thermal, tensile and heat-seal properties were measured to investigate the effect of the pendent groups. Endothermic peaks on DSC curves were affected by the thermal history of the samples and a melting peak was observed at around $86^{\circ}C$ on the second heating curve while three melting peaks were shown on the first heating curve. A minimum value of tensile strength was shown at 70 mole% of COOK based on pendent groups. Tensile modulus increased with increasing the amide content in pendent groups. The m-PE films were heat-sealed at lower temperature than LDPE films and showed a minimum heat seal strength at around 70 mole% COOK content in pendent groups.

• Composites Research
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• v.34 no.2
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• pp.108-114
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• 2021

Graphene flakes are generally mass-produced by converting graphene oxide into reduced graphene oxide using chemical or thermal reduction. These graphene flakes can be stacked to form a free-standing graphene paper, which can be used for various applications. However, a graphene paper lacks stretchability, which hinders its application in stretchable devices. In this work, we introduced wrinkles in a graphene paper to make it stretchable. A graphene paper fabricated by vacuum-filtering a graphene dispersion was placed on a pre-stretched adhesive film. When the pre-stretched adhesive film returned to the original state, the graphene paper was wrinkled. The effect of the pre-stretching and wet condition of the graphene papers was experimentally investigated by using scanning electron microscopy. In addition, we observed the change of the period of the wrinkles in the graphene paper depending on the pre-stretching.

• Journal of Adhesion and Interface
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• v.19 no.4
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• pp.145-153
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• 2018

In this study, adhesion promoters with acrylate and carboxylic acid moiety were synthesized from malenized polybutadiene and 2-hydroxyethyl acrylate for producing adhesive film with low water absorption and high adhesion. The surface properties, adhesion strength, mechanical properties and water absorption of adhesive films were characterized according to the amount of acrylate and carboxylic acid in the synthesized adhesion promoters. As the carboxylic acid in the adhesion promoters increased, the adhesion strength showed a tendency to increase and the mechanical properties also improved compared to the commercial adhesion promoter. The compatibility of adhesion promoters improved remarkably due to the presence of polybutadiene (hydrophobic nature), maleic anhydride (hydrophilic nature) and carboxylic acid (hydrophilic nature).

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.1
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• pp.15-22
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• 2002

We received 2 types flexible packaging films from two companies that laminated PET $16{\mu}m/dry$ lamination/aluminium foil $7{\mu}m/dry$ lamination/CPP $80{\mu}m$ films. For the reason of hot sealing's trouble through filling process, We separated each layer and compared thicks, film types and tested IR, DSC and sensory test. At the result, one sample's thick is different but film types is same between samples. Optimum hot-sealing conditions between two samples is $195^{\circ}C\;and\;210^{\circ}C$. The difference is $15^{\circ}C$. According to test of direct filling packaging process by four face fluid filling machine, two sample's sealing strength of hot-sealing is $4.76kg/cm2/15mm$(sample of optimum hot-sealing condition is $195^{\circ}C$) and $3.84kg/cm2/15mm(210^{\circ}C)$.

• Journal of Adhesion and Interface
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• v.22 no.1
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• pp.29-29
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• 2021

• Proceedings of the KAIS Fall Conference
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• 2010.05b
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• pp.981-984
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• 2010

생산성 증가 및 비용 절감을 위해 반도체 공정 기술을 단순화 시키는 것이 필요하다. WBL(Wafer Backside Lamination) 기술을 이용해 필름(film) 형태로 얇은 다이접착제를 웨이퍼(wafer)에 접착하여 반도체 칩과 PCB를 붙이는 방법과 직접 PCB에 다이접착제를 붙이는 방법을 사용하면 획기적으로 공정을 단순화 시킬 수 있다. 하지만 Lamination 기법은 고온을 이용하여 모듈화된 PCB에 접착하므로 전도와 복사에 의해 주변 접착제 필름이 녹아 버리는 문제점이 발생한다. 본 연구에서는 고온으로 인한 필름 융해 현상을 방지하기 위하여 배크라이트를 설치하였으며 CFD 해석을 통해 PCB와 반도체 칩을 접착시킬 때 열이 PCB에 미치는 영향을 살펴보았다.