• Title/Summary/Keyword: 접착층

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複合構造의 結合

  • 홍창선
    • Journal of the KSME
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    • v.22 no.1
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    • pp.9-14
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    • 1982
  • 복합재료를 이용하여 부품제작을 한 후 어떠한 결합방법을 채택할 것인가를 결정할 때 고려해 야할 점을 기계적 결합법과 접착결합법을 비교하여 검토하였다. 기계적 결합은 하중을 많이 받고 분해 및 결합이 자주 예상되는 부품에 채택해야 할 것이며 복합재료의 특성을 고려하여 보강 시에 부착하는 평판의 섬유방향은 가급적 드릴구멍주위를 부드럽게 하여 응력집중을 낮출 수 있으며 하중의 종류에 따라 적층의 섬유방향을 조절함으로서 응력집중을 조절할 수 있다. 드릴 구멍 주위인 파손은 평판의 폭과 구멍의 직경등이 크게 작용함으로 강도해석을 할 경우에 응력 해석을 한 후 허용응력등을 결정해야할 것이다. 접착졀합법은 작업이 간단하나 신뢰도가 떨어지 므로 하중을 많이 받는 구조물에의 사용에 주의를 요하며 설계방법도 매우 다양하게 제안되어 있어 선택함에 있어 하중 환경조건등을 점검해야할 것이다. 접착결합법은 드릴구멍같은 불연속 성을 갖지 않기 때문에 응력집중이 생기지 않으나 접착층의 길이등 기하학적 형상에 따라 다르게 나타남으로 잡착층의 분리가 일어나지 않도록 설계되어야 한다. 특히 복합재료의 이방성인 성 질을 감안하여 접착층에 이웃하는 피접착층의 섬유방향에 주의해야 하며 층간응력이 파손에 미 치는 영향을 고려하여 설계에 임해야 한다.

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Thickness Assessment of Adhesive Layer in Inhomogeneous Layer by Guided Wave (유도초음파에 의한 비균질 적층의 접합층두께 평가)

  • Cho, Youn-Ho;Ham, Hyo-Sik;Choi, Heung-Ho
    • Journal of the Korean Society for Nondestructive Testing
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    • v.21 no.4
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    • pp.391-397
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    • 2001
  • The guided wave propagation in inhomogeneous multi-layered structures is experimentally explored based on theoretical dispersion curves. It turns out that proper selection of incident angel and frequency is critical for guided wave generation in multi-layered structures. Theoretical dispersion curves greatly depend on adhesive zone thickness, layer thickness and material properties. It was possible to determine the adhesive zone thickness of an inhomogeneous multi-layered structure by monitoring experimentally the change of dispersion curves.

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Influence of Rheological Properties of Adhesive Polymer on Strain Energy Release Rate of Mode I and Adhesive Tensile Strength (모드I의 변형 에너지 해방율과 인장 접착강도에 미치는 접착제 고분자의 유변특성의 영향)

  • H. Mizumachi
    • The Korean Journal of Rheology
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    • v.8 no.2
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    • pp.129-138
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    • 1996
  • 접착강도는 접착제의 점탄성을 반영한 온도·속도 의존성을 나타낸다는 것이 잘 알 려져있다. 특히 유리전이온도(Tg)에서의 역학적 완화기구가 접착층의 변형을 수반하는 접착 층의 변형을 수반하는 접착강도에 크게 영향을 미치고 있다. 또한 접착계의 모드I의 변형에 너지 해방율(GIC)를 측정할때에도 접착제의 변형과 파괴가 발생하기 접착제의 점탄성이 그 값에 어떠한 영향을 미치는 지에 흥미가 깊다. 본 연구에서는 2종류의 에폭시 수지를 블랜 드한 접착제를 이용하여 일정한 측정조건에서 인장 접착강도와 GIC의 상관관계에 대하여서 도 토론하였다.

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Changes in Adhesion Interface between Rubber and Steel Cord with Aging Treatment (열화처리에 따른 고무와 강선코드간 접착계면의 변화)

  • Seo, Gon;Sohn, Bongyoung
    • Applied Chemistry for Engineering
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    • v.5 no.4
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    • pp.630-636
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    • 1994
  • The changes in adhesion interface between rubber compound and brass plated steel cord after various aging treatments were studied by using an Auger electron spectrometer and a scanning electron microscope. After thermal aging, partial oxidation and additional growth of adhesion layer were observed. The adhesion layer and brass were partially removed after humid aging. With dynamic aging the adhesion layer was destroyed and the corrosion of steel core was proceeded. The changes in adhesion interface were discussed in terms of the adhesion properties determined from the stress-strain experiments.

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Field Emission Properties of Carbon Nanotubes on Metal Binder/Glass Substrate

  • Jo, Ju-Mi;Lee, Seung-Yeop;Kim, Yu-Seok;Park, Jong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.386-386
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    • 2011
  • 탄소나노튜브는 큰 길이 대 직경 비와 뛰어난 전기적 특성으로 인해 차세대 전계 방출 소자로 주목 받고 있다. 실질적인 전계방출 디스플레이로의 응용을 위한 대면적 제작과 유리 기판 사용을 위해 이용되었던 페이스트(paste)법은 높은 전기장 하에서 장시간 전계방출시 탄소나노튜브 전계방출원과 페이스트(paste)간의 낮은 접착력 때문에 발생하는 탄소나노튜브의 탈루현상(omission)과 유기물질(organic paste)에서 발생하는 탈기체(out-gassing) 문제점이 있었다. 최근 이런 문제점을 개선하기 위해 유기물질(organic paste)를 대체하여 금속바인더(metal binder) 물질을 사용한 결과들이 보고되고 있다. 본 연구에서는 유리기판 위에 제작된 탄소나노튜브 전계방출원의 수명 향상을 위하여 금속바인더와 후속 열처리법의 변화에 따른 전계방출 안정성을 분석하였다. 금속바인더는 접합층/ 접착층(soldering layer/ adhesive layer)으로 구성되어 있으며, 일반적인 소다석회유리(soda-lime glass)에 스퍼터(DC magnetron sputtering system)를 이용하여 증착하였다. 접착층은 유리기판과 접합층의 접착력 향상을 위해 사용되며, 접합층은 기판과 탄소나노튜브 전계방출원을 접합하는 역할과 전계방출 측정시 전극이 되기 때문에 우수한 전기 전도성과 내산화성을 필요로 한다. 본 실험에서는 일반적으로 유리기판과 접착력이 좋다고 알려진 Cr, Ti, Ni, Mo을 접착층으로 사용하였으며, 접합성과 전기전도성, 내산화성이 뛰어난 귀금속 계열의 금속을 접합층으로 사용하였다. 탄소나노튜브를 1,2-디클로로에탄(1,2-dichloroethane, DCE)에 분산시킨 용액을 스프레이방법을 이용하여 증착시켰으며, 후속 열처리 방법을 통하여 접합층과 결합시켰다. 금속바인더와 후속 열처리법의 변화에 따른 접착력과 표면형상(morphology)의 변화를 주사전자현미경(scanning electron microscopy)를 이용하여 분석하였으며, 다이오드 타입에 디씨 바이어스(DC bias)를 사용하여 전계방출특성을 측정하였다[1,2].

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Visibility Enhancement of the Ultrasonic Signal Reflected from Adhesive Layers (접착층에서 반사된 초음파 신호의 가시도 개선)

  • Shin, Jin Seob;Lee, Jeong-Ihll
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.8 no.6
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    • pp.153-157
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    • 2008
  • Recently, electronic devices is produced by multilayer structure, therefore analysis for hidden layers is important nondestructive inspection. This paper presents visibility enhancement methods for the ultrasonic multiple echoes reflected from adhesive layer in the multilayers using digital signal processing. The reflected signals from the multilayers come out interval of the peaks in the power cepstrum. In the experiment, the adhesive layers of settled thickness using epoxy were formed. The reflected signals from the multilayer is detected by pulse-echo method and power cepstrum is processed for enhancement of visibility.

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Measuring Method of Formaldehyde Emission for Plywood (합판의 포름알데히드방산량 측정방법)

  • Lee, Sang-Min;Park, Jong-Young;Kang, Eun-Chang;Kim, Su-Woun;Han, Seung-Tak
    • Journal of the Korean Wood Science and Technology
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    • v.38 no.1
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    • pp.11-16
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    • 2010
  • Unlike other composites boards such as fiberboard and particleboard, plywood is manufactured with sheets of veneers. When the plywood manufactured, the adhesive is spreaded through gluelines on each surface of veneers. For that reason, formaldehyde emission of plywood can be considered as different way. Therefore, this research was conducted to understand the formaldehyde emission pattern of plywood. To measure formaldehyde emission, four different specimen preparing methods were used. The test specimen taken by a total surface area, a given number and a total side area showed inconsistent results. On the other hand, the result of formaldehyde emission showed consistency when considered only the length of adhesive layers.

Density, Bonding Strength, Bending strength and Decay Resistance of Radiata Pine Laminated Veneer Lumber (라디에타소나무 단판적층재의 밀도·접착·강도성능 및 내부후성)

  • Suh, Jin-Suk;Lee, Dong-Heub;Hwang, Won-Joung;Oh, Hyung-Min;Park, Young-Ran;Kang, Sung-Mo
    • Journal of the Korean Wood Science and Technology
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    • v.39 no.4
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    • pp.344-350
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    • 2011
  • In this study, LVLs of radiata pine were fabricated with non-preservative treated veneers, CuAz treated veneers, and ACQ treated veneers, using aqueous vinyl urethane adhesive and phenol modified resorcinol resin adhesive. Then density gradient, bonding strength, bending properties and decay resistance of LVLs were evaluated. As results, the cone-shaped and higher density gradient pattern was found in layer close to glueline. After cyclic water boiled test, the LVL bonded with aqueous vinyl urethane resin adhesive was delaminated in all layers or partly delaminated including check, chasm in glueline layer. In the case of LVL bonded with phenol modified resorcinol resin adhesive, despite slight cupping due to great glueline stress and vertical check between glueline layers, it was observed that the bonding strength to delamination was higher, owing to most absence of delamination through overall glueline. On the other hand, in the decay test, mass loss by brown rot fungi was greater than white rot fungi in LVL bonded with aqueous vinyl urethane resin adhesive. However, in LVL bonded with phenol modified resorcinol resin adhesive, the mass loss by brown rot fungi was slight and non-preservative treated LVL was low. The mass loss of preservative-treated LVL was 0 (zero), showing the high decay resistance effect.

Thickness Measurement of Adhesive Layer of Multilayer Using Power Cepstrum Technique (전력 켑스트럼 기법을 이용한 다층구조물 접착면의 두께측정)

  • Shin, Jin-Seob;Jun, Kye-Suk
    • The Journal of the Acoustical Society of Korea
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    • v.16 no.2
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    • pp.26-30
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    • 1997
  • In this paper, the thickness measurement method of adhesive layers of multilayers using power cepstrum signal processing technique has been proposed. The peak values for reflected signal from each layer have been separated by power cepstrum technique. Therefore, thickness of adhesive layers have been measured by the intervals of peak signal. In the experiment, the adhesive layers of 0.5mm-0.75mm thickness using epoxy(2-Ton and Plastic Steel Putty(A)) between the aluminum and the brass were formed. The adhesive layer thickness which is calculated with data of reflected signal by ultrasonic pulse-echo method was within error 1.34% of the measured values.

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Bending Fatigue Reliability Improvements of Cu Interconnects on Flexible Substrates through Mo-Ti Alloy Adhesion Layer (Mo-Ti 합금 접착층을 통한 유연 기판 위 구리 배선의 기계적 신뢰성 향상 연구)

  • Lee, Young-Joo;Shin, Hae-A-Seul;Nam, Dae-Hyun;Yeon, Han-Wool;Nam, Boae;Woo, Kyoohee;Joo, Young-Chang
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.1
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    • pp.21-25
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    • 2015
  • Bending fatigue characteristics of Cu films and $8{\mu}m$ width Cu interconnects on flexible substrates were investigated, and fatigue reliability improvement was achieved through Mo-Ti alloy adhesion layer. Tensile bending fatigue reliability of Cu interconnects is 3 times lower than that of Cu films, and even compressive bending fatigue reliability of Cu interconnects is 6 times lower than that of Cu films. From these results, mechanical crack formation could be fatal in Cu interconnects. With Mo-Ti adhesion layer, fatigue reliability of Cu films and interconnects were enhanced due to the increase of adhesion strength and the suppression of slip induced crack initiation.