• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2022.05a
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• pp.507-509
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• 2022

In order to collect vehicle internal diagnostic data, it is necessary to collect diagnostic data of ECU (Electronic Control Unit) included in various automotive parts. Diagnostic communication can be used to collect diagnostic data of ECU. In this paper, the method of collecting diagnostic data according to ECU function through standard diagnostic communication and the diagnostic communication module were analyzed. Among the standard modules of AUTOSAR, a standard for automotive electronics used by many automobile manufacturers, the diagnostic communication module was studied, and the process of diagnostic data processing through ECU was studied.

• Proceedings of the Korea Information Processing Society Conference
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• 2023.11a
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• pp.1147-1148
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• 2023

상품의 개발을 위해서는 개발과 양산이라 하는 크게 2가지의 단계가 필요하다. 따라서 이에 필요한 부품을 관리하는 것에도 개발과 양산에 따라서 관리되어야 한다. 본 논문은 전자소자 품번 체계를 개발 및 양산 단계에 따라 표준화하고, 이를 기반으로 BOM 시스템을 구축한다. 이후 HL만도 내의 System에 이관하여 표준화된 품번을 활용한 System BOM 및 이력 등을 관리할 수 있을 것이다. 이는 각 연구소에서 공용화 환경을 구축할 수 있고, 구매, 품질 등 부서에서의 체계적인 환경 구축 수립을 통해 업무 수행에 많은 개선이 있을 것으로 예상된다.

• Journal of Welding and Joining
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• v.24 no.6
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.481-484
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• 2011

Recent Automotive technology is driven from mechanical device to the electronic components which improve the vehicle's safety and convenience. The future competitiveness of the car will come from safety issues and energy efficiency, convenience and the application of the technologies. In this study, various techniques for driver drowsiness detection are introduced and compared with each others. The advantages and disadvantages of commercially available technologies and developed technologies are compared. To enhance the detection resolution, multiple sensing technologies are introduced in this paper. The feasibility of two drowsiness detection methods, that is, existing camera image recognition method and bio signal analysis method, are tested. The direct drowsiness detection by the camera image of eyes and driver's vital signs detected indirectly are combined and analyzed by the developed noble algorithm for stress, fatigue, drowsiness detection with a more accurate high-drowsiness detection.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.40 no.4
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• pp.10-20
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• 2017

The proportion of software in the automotive industry is steadily increasing due to the rapid technological development of automobile E/E parts. Because the automotive E/E technology is now on the basis of intelligent automobile and advanced safety automobile technology. The purpose of this study is to investigate the effect of organizational capability (organizational resource capability and management capability), process capability (process capability, customer Requirement management capability), performance dimension (motivation, participation level). In this study, we conducted questionnaires and statistical analysis on engineers (members of the Korea Advanced Automotive Technology Association) who perform research and development activities in the R&D organization of the automotive E/E part in South Korea. ANOVA is applied for the verification of the difference in performance measured by organizational capability, process maturity, and motivation participation level according to company characteristics (level of processing : supply chain configuration, annual sales, total SW development ratio). According to the results of this study, in order to improve the performance of ASPICE or ISO 26262-related consulting project, a different consulting approach strategy considering the characteristics of organization and personnel is needed. In summary, the analysis results for the three main treatment levels are as follows. The difference in organizational capacity, process capability and performance was found to be statistically significant according to supply chain configuration and annual sales, but it was found that the difference of response according to the proportion of total SW was not significant.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.05a
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• pp.175-179
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• 2009

this paper proposes a filter design that makes to be satisfied EMC spec. in reliability test of analogue switch for electronic equipment and air conditioning load unit. A designed electromagnetic wave filter was applied to minimize an mutual interference and surrounding environment and improve the product's quality being satisfied to EMC standard. By simulation, using a spectrum analyzer at the 30MHz~1GHz band, ISO/JASO standard frequency range, and simplified EMI chamber, energy distribution of a specific frequency band was analyzed and the capacity of the element which composed the filter was determined in order to implement the most suitable electromagnetic wave filter.In fact, it was certificated that noise decrease by filter addition to the analogue switch for electronic equipment and air conditioning load unit in Certification Authority, and confirmed that the unit is carried out a normal action without electromagnetic wave interference.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.05a
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• pp.845-848
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• 2009

Power semiconductor devices are semiconductor devices used as switches or rectifiers in power electronics circuits. Theyare also caleed power devices or when used in integrated circuits, called power ICs. Some common power devices are the power diode, thyristor, power MOSFET and IGBT (insulated gate bipolar transistor). A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. With this structure, one of the connections of the device is located on the bottom of the semiconductor.

• Journal of the Korean Electrochemical Society
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• v.25 no.3
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• pp.119-124
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• 2022

Because high power with large size cell is used for the battery pack of hybrid electric vehicles and electric vehicles (HEV and EV), average temperature in a battery cell is the important criteria of the thermal management of the battery pack. Furthermore, fast charging technology is required to reduce battery charging time. Since battery pack performance and lifespan are deteriorated due to the heat of cells and electronic components caused by fast charging, an effective cooling system is required to reduce performance deterioration. In this study, a cooling system and module design applied to a pouch-type for fast charging battery cell are investigated, and the cooling performance that can maximize the efficiency of the battery was analyzed. The result shows that the vapor chamber cooling system has better cooling performance, the temperature drop in the module was 5.82 ℃ compared with aluminum cooling plates.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.6
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• pp.44-52
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• 2017

In this paper, we propose a DFD (Digital Frequency Discriminator) design that has better frequency discrimination and a smaller size. Electronic warfare equipment can analyze different types of radar signal such as those based on Frequency, Pulse Width, Time Of Arrival, Pulse Amplitude, Angle Of Arrival and Modulation On Pulse. In order for electronic warfare equipment to analyze radar signals with a narrow pulse width (less than 100ns), they need to have a special receiver structure called IFM (Instantaneous Frequency Measurement). The DFD (Digital Frequency Discriminator) is usually used for the IFM. Because the existing DFDs are composed of separate circuit devices, they are bulky, heavy, and expensive. To remedy these shortcomings, we use a three delay line ($1{\lambda}$, $4{\lambda}$, $16{\lambda}$) in the DFD, instead of the four delay line ($1{\lambda}$, $4{\lambda}$, $16{\lambda}$, $64{\lambda}$) generally used in the existing DFDs, and apply the microwave integrated circuit method. To enhance the frequency discrimination, we detect the pulse amplitude and perform temperature correction. The proposed DFD has a frequency discrimination error of less than 1.5MHz, affording it better performance than imported DFDs.