• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.78-83
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• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

• Transactions of the Korean Society of Automotive Engineers
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• v.1 no.2
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• pp.125-133
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• 1993

Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.29-33
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,000$^{\circ}C$. Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 800$^{\circ}C$. There needs to measure the data up to 800$^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000$^{\circ}C$. In previous studies related to thermal strain analysis, the quantitative results are not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,000$^{\circ}C$and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1％ blow 600$^{\circ}C$ however, there is some difference up to 600$^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 800$^{\circ}C$. The reason is the phase transformation of STS430 probably begins at 800$^{\circ}C$.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.7 s.196
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• pp.69-74
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• 2007

The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1433-1437
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• 2005

Until now, strain gage technique and accelerometer for the diagnosis safety of constructions are used widely. However, the limits of these methods are revealed. But Electronic Speckle Pattern Interferometry(ESPI) that uses Pulse Laser is noncontact, whole-field, real-time measuring method also dull to disturbance and can achieve test result in a very short time. It has various strong point in spot application, swift establishment, and dynamic conduct analysis for the entire field of Laser illuminate. This author analyzed vibration characteristic of using the Pulse ESPI System, the diagnosis safety of bridges, to simplify the analysis of the dynamic conduct of a large construction.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.388-392
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• 1995

The Electronic Speckle Pattern Interferometry(ESPI) has been applied to many technical problems such as deformation and displacement measurement, strain visualization and surface roughness monitoring. Composite materials have various complicated characteristics depending on the ply materials,ply orientations,ply stacking sequences and boundary conditions. Therefore, it is difficult to analyze composite material. For efficient use of composit materials in engineering applications, the dynamic behavior such as, natural frequencies and modal patterns should be identified. This studying presents FEM results for the free vibration of symmetrically laminated composite as [30/-30/90] $_{s}$. The natural frequencies of laminated composite rectangular plates having the boundary condition(:2-edge clamped) are experimentally obtained. In order to demonstrate the validity of the experiment,FEM analysis using ANSYS was performed and natural frequencies experimentally obtained is compared with calculated by FEM analysis. The results obtained from both experiment and FEM analysis show a good agreement.t.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.298-303
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• 2003

In recent years, shearogrpahy has significantly improved capabilities in the areas of unbond and separation detection in tires. Although shearography has many advantages for qualitative evaluation, the technique remains the problem of quantitative analysis of inside defects, because shearography needs several effective factors including the amount of shearing, shearing direction and induced load, which exist as barrier for the quantitative analysis of inside defects. Since the factors are highly dependent on inspectors skill and also affect the in-situ workability. The factors were optimized and the size of cracks inside of pipeline and tire has been quantitatively determined.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1059-1062
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• 2003

Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.630-633
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• 2001

This paper propose electronic speckle pattern interferometry(ESPI) for reliability evaluation of electronic device. Especially, vibration problem in a fan of air conditioner, motor of washing machine and etc. is important factor to design the devices. But, it is difficult to apply previous method, accelerometer to the devices with complex geometry. ESPI, non-contact measurement technique applies a commercial fan of air conditioner to vibration analysis. Vibration mode shapes, natural frequency and the range of the frequency are decided and compared with that of FEM analysis. In mechanical deign of new product, ESPI adds weak point of previous method to supply effective design information.