• Journal of the KSME
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• v.57 no.1
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• pp.32-36
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• 2017

이 글에서는 전자빔 리소그래피 오버레이 공정과 이를 이용해 제작된 3차원 나노구조 및 하이브리드 2차원 나노구조에 대해서 소개하고자 한다.

• Journal of the Korean Vacuum Society
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• v.12 no.3
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• pp.182-192
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• 2003

A new Monte Carlo (MC) simulator for electron beam lithography process in the multi-layer resists and compound semiconductor substrates has been developed in order to fabricate and develop the high-speed PHEMT devices for millimeter-wave frequencies. For the accurate and efficient calculation of the transferred and deposited energy distribution to the multi-component and multi-layer targets by electron beams, we newly modeled for the multi-layer resists and heterogeneous multi-layer substrates. By this model, the T-shaped gate fabrication process by electron beam lithography in the PHEMT device has been simulated and analyzed. The simulation results are shown along with the SEM observations in the T-gate formation process, which verifies the new model in this paper.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.5
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• pp.23-36
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• 2004

A computationally efficient and accurate Monte Carlo (MC) simulator of electron beam lithography process has been developed for sub-0.l${\mu}{\textrm}{m}$ T-shaped gate formation in the HEMT devices for millimeter-wave frequencies. For the exposure process by electron to we newly and efficiently modeled the inner-shell electron scattering and its discrete energy loss with an incident electron for multi-layer resists and heterogeneous multi-layer targets in the MC simulation. In order to form the T-gate shape in resist layers, we usually use the different developer for each resist layer to obtain good reproducibility in the fabrication of HEMT devices. To model accurately the real fabrication process of electron beam lithography, we have applied the different developers in trilayer resist system By using this model we have simulated and analyzed 0.l${\mu}{\textrm}{m}$ T-gate fabrication process in the HEMT devices, and showed our simulation results with the SEM observations of the T-shaped gate process.

• Journal of the Korean Magnetics Society
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• v.17 no.4
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• pp.178-181
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• 2007

Electron beam lithography has been studied as a next-generation lithography technology instead of photo lithography for ULSI semiconductor devices. In this work, we have made a low-energy electron beam lithography system based on the microcolumn and investigated the dependence of the pattern thickness on the energies and dose concentration of the electron beam. We have also demonstrated the potential of low-energy lithography by achieving 100 nm-$SiO_2$ thin film patterning.

• Electrical & Electronic Materials
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• v.17 no.6
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• pp.11-16
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• 2004

지난 40여년간의 반도체 집적 공정의 발전에 있어서 무어(Moore)의 법칙에 의한 소자의 미세화를 달성하기 위하여, 광리소그래피(optical lithography) 기술은 꾸준히 발전하여 왔으며, 소자의 선폭이 나노스케일인 공정에서 역시, 소자 제조의 핵심기술은 리소그래피 기술을 이용한 회로의 패터닝(patterning) 기술에 달려 있다고 해도 과언이 아니다. 그러나 현재 사용되고 있는 광리소그래피는 사용하는 파장의 길이에 따른 분해능(resolution)의 한계로 인하여, 이러한 나노 스케일의 소자를 제작하기 위해서는 새로운 리소그래피 기술이 필요하다는 것이 일반적으로 인정이되고 있다.(중략)

• Korean Journal of Materials Research
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• v.5 no.1
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• pp.96-103
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• 1995

This art~cle reports on the formation of T - Gate with O.1$\mu$m foot and 0.4$\mu$m head width at PMMA/P( MMA/MAA) resist structure using a 30KV electron beam lithography system. From the result of Monte Carlo simulation on PMMA/P( MMA/MAA)/GaAs, we obtain the dissipation energy ratio of forwardscattered electron and backscattered electron within 0.1$\mu$m scattering radius is 19.5 : 1 0.1$\mu$m T - gate has been formed with 30KV gaussian electron beam at a 440$\mu C/\textrm{cm}^2$ dosage. The gamma value of PMMA and P(MMA/MAA) at MIBK : IPA=l : 1 developer was 2.3. The overlay accuracy(3$\sigma$) from mix-andmatch of optical stepper and Ekeam lithography system for fabricating HEMT device is accomplished below 0.1$\mu$m.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.6
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• pp.7-13
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.25 no.3
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• pp.7-14
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.13-13
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• 2004

나노테크놀러지 중의 한 가지인 나노임프린트 리소그래피 기술은 수 ∼ 수십 나노 급의 선폭을 가지는 스탬프(stamp)를 전자빔 리소그래피(electron beam lithography)를 이용하여 제작한 후 스탬프에 형성된 패턴과 동일한 형상을 원하는 곳에 모사하는 기술이다. 이 기술은 크게 열을 가하는 방식과 UV 경화성 수지를 이용한 방식으로 나뉜다. 열을 가하는 나노임프린트 리소그래피 방식의 경우는 열 경화성 수지를 이용하여 고온 조건에서 스탬프를 고압으로 눌러 원래의 형상을 모사하며, UV 나노임프린트는 광경화 반응을 이용하여 수지를 경화 시켜 모사하는 차이점이 있다.(중략)

• Proceedings of the Optical Society of Korea Conference
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• 2009.02a
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• pp.237-238
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• 2009