• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.49.1-49.1
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• 2011

태양전지 모듈의 25년 이상 보증을 위해 태양전지 모듈을 구성하는 부품 소재의 신뢰성이 부각되고 있다. 현재까지 알려진 태양전지 모듈용 에틸렌 아세테이트 비닐(ethylene Vinyl Acetate, EVA)의 주요 열화 메카니즘은 황변(yellowing)과 박리(delaminaation)이다. 따라서 본 연구에서는 태양전지 모듈을 구성하는 재료 중 EVA 소재의 열화 메커니즘을 도출하기 위해 이미 알려진 스트레스 인자를 이용한 가속 열화시험을 설계한 후 가속열화시험을 실시하였으며, 이로부터 EVA의 열화 메카니즘을 규명하였다. 열화모드 재현을 위해 소형 태양광 모듈을 제작하였으며, Weather-Ometer를 이용하여 열화시험을 수행하였다. 시험조건은 4종 Phase가 1 사이클이 되도록 실험하였으며, Dark 조건 1 Phase 및 Light 조건 3 Phase 조건으로 실시하였다. 태양전지 모듈의 열화량은 매 500 사이클 마다 Light I-V 변화량을 측정하여 분석하였다. EVA의 물리 화학적 열화분석을 위해 단면분석, 적외선분광기(Fourier Transform-Infra Red, FT-IR) 및 주사전자현미경을 이용하여 열화 특성에 대한 분석을 실시하였고, 이를 근거로 EVA의 열화 메커니즘을 규명하였다.

• Proceedings of the Korean Information Science Society Conference
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• 2003.04a
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• pp.497-499
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• 2003

PKI(Public Hey Infrastructure)기반의 공인인증서가 활성화됨에 따라 인터넷뱅킹, 증권거래시스템. 전자입찰, 전자민원 등 신원확인이 요구되는 어플리케이션에 전자서명이 적용되고 있다. 다수의 사용자가 인증서로 로그인과 부인방지를 위한 전자서명을 전송함으로써 서버는 상대적으로 많은 전자서명과 인증서검증을 수행해야 한다. 프로그램 단계에서 검증을 수행하기 위해서는 검증모듈의 API(Application Programming Interface)를 호출해야 하며, 이는 프로그램의 복잡도를 증가시킨다. 이러한 문제는 어플리케이션과 검증이 독립적이지 않기 때문에 검증에 관련된 장애가 발생하면 어플리케이션은 검증모듈에 종속적으로 장애가 발생하게 된다. 본 논문의 검증 에이전트는 서버환경이 서버-클라이언트 또는 웹 어플리케이션에 독립적으로 전자서명 검증을 담당한다. 따라서 어플리케이션은 검증이 필요한 시점에 검증 에이전트를 호출하게 됨으로써 프로그램의 복잡도를 줄이고 서버의 안정성을 향상시킨다.

• Proceedings of the KIPE Conference
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• 2020.08a
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• pp.300-301
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• 2020

본 논문은 GaN(Gallium Nitride)전력모듈과 GaN IPM(Intelligent Power Module)의 DPT(Double Pulse Test)를 통한 스위칭 특성 분석에 대해 다룬다. GaN 소자는 낮은 스위칭 손실로 인하여 고속 스위칭이 가능하여 최근 각광받는 소자 중 하나이다. 본 논문에서는 GaN 소자의 DPT를 위한 테스터를 설계/제작하고, 이를 활용하여 전압/전류 별 스위칭 특성을 실험적으로 확인하였다.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.2
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• pp.50-54
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• 2015

In this paper, we report on a high performance 94 GHz MMIC mixer module using 0.1-um metamorphic high electron mobility transistors (MHEMTs). A modified resistive mixer with a RF amplifier was proposed in this work for low conversion loss and high LO-RF isolation. The MMIC mixer module was fabricated using a MMIC chip and CPW-waveguide transitions. The fabricated mixer chip and module showed a low conversion loss of 6.3 dB and 9.5 dB, and LO-RF isolations of 24.8 and 30.4 dB at 94 GHz, respectively. This results are superior to those of previously W-band (75-110 GHz) MMIC mixers.

• The Transactions of the Korean Institute of Power Electronics
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• v.14 no.6
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• pp.504-513
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• 2009

This paper proposes the new type LED driver modularization for illumination LED driver. The proposed LED driver circuit insulates a hot GND of AC input power and a cold GND of LED driver part by using a fly-back converter. In order to control easily the current of the LED, the fly-back converter is operated in the discontinuous mode with excellent dynamic characteristics, and the characteristics of the LED are verified after the closed loop control is performed using a KIA2431. The LED driver module allows the wide AC power input ranges and realizes the burst dimming function which directly regulates a PWM control IC. This paper describes the operation principle of the LED driver module and it is proved the usefulness through the real model with experimentation. Besides, this paper proposes the multi-channel LED driver which the miniaturized and modularized LED driver module are connected by parallel, and verified its propriety by experiments.

• Journal of IKEEE
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• v.23 no.4
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• pp.1218-1223
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• 2019

In HVDC systems, the full-bridge submodule increases the number of components compared to the half-bridge submodule, but the failure-rate can be reduced by securing 100 % redundancy. However, full-bridge submodules require more complex control algorithms to ensure the redundancy and to prevent arm-short with sufficient dead-time. To solve this problem, we analyse the failure-rate of the paralleled half-bridge configuration with the same number of components and 100 % redundancy as the full-bridge submodule. The fault tree analysis (FTA) method is applied to the conventional part failure analysis to reflect the operation risk of the submodule, thereby predicting the life-cycle of the submodule more accurately. To verify the validity, the failure-rate results of the proposed FTA based analysis method are compared with the failure rate obtained by the part failure method.

• Journal of IKEEE
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• v.14 no.2
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• pp.58-63
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• 2010

In this paper, design and implementation of multi-modular robots of similar structure to the arthropods for rock path driving. Each module corresponds to an arthropod joint, which has an independent power supply and control equipment including drive and short-range Zigbee wireless communication that were implemented. On various directions and paths each module has the same driving direction and each module is controlled to operate or not by wireless communication. Depending on path condition, each module calculate the speed and torque and depending on the slope of a rough path, the number of active modules can be changed for the efficient driving on a variety of roads conditions. Experimental driving through rough road model, variable multi-module robot is implemented.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.11
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• pp.1311-1316
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• 2014

To be used in a transmitter of a satellite transponder of this paper, X band 25W power amplifier module, a part constituting of high-power amplifier is transmitted to the equipment for transmitting to geostationary communications satellites(36,000Km distance). PAM consisted a total of four power amplifier module has a high output characteristic of the high-output amplifier is used in the ground station. Used in conjunction with the structured type power amplifier module is composed of Serial Combining Structure. This PAM(Power Amplifier Module) configured by combining the circuit with the power amplifier, 10 MMIC chips and the Al2O3 thin film substrate using a Hybrid Technique of power amplifier module, was implemented at X band PAM(Power Amplifier Module) of 25W grade.

• Journal of IKEEE
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• v.23 no.3
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• pp.1092-1095
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• 2019

In this paper, we propose the development of an embedded board for construction of smart factory. The proposed embedded board for construction of smart factory consists of main module, ADC module, I/O module. Main module is a main calculating device which includes communication pard that allows interface with external device with using industrial protocol and is ported operating system makes board operating into. ADC module takes part in transferring digital signal has converted from electrical signal to the main module from the external sensor which is installed on the field. I/O module is an input and output module which transfers to the main module about a status, alarm, command signal of field device and it has a function that blocks external noises from field device with isolation circuit into it. In order to evaluate the performance of the proposed embedded board for construction of smart factory, it has been tested by an authorized testing institute. As a result, quantity of interacting protocol was 5, speed of hardware clock synchronization was under 10us and operating time of battery without source power was over 8 hours. It produced the same result as the world's highest level.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.3
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• pp.447-452
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• 2013

In this paper, the leakage current detection and auto shut-off module for a concent has been developed. Existing leakage current detection modules are detecting resistive leakage current, using a resistive leakage current detection chip but the proposed leakage current detection module separates and detects resistive leakage current in the synthesis leakage current by only programming in a power processor MCU(MSP430). The module implemented by proposed method has early detection and auto shut-off feature at more than resistive leakage current 5mA, and has the advantage of easily adjusting resistive leakage current less or more than 5mA, because of resistive leakage current detection function being implemented by a program in MCU.