• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.112.2-112.2
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• 2012

고투과도, 고전도성을 갖는 탄소나노튜브 기반의 투명 전도성 필름은 분산조건의 최적화에 의해 제조하였다. 탄소나노튜브간의 응집현상은 탄소나노튜브간의 접촉저항의 증가를 야기하여 탄소나노튜브가 갖고 있는 고유의 우수한 전기적 특성을 감소시킨다. 이에 대해 본 연구에서는 분산제 농도, 분산 시간, 기판 표면처리에 따른 특성 변화 및 이에 따른 탄소나노튜브간의 응집이 최소화된 용액을 제조하였다. 또한, 이를 기반으로 연속공정이 가능한 탄소나노튜브 용액을 제조하고 평가하였다.

• Composites Research
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• v.26 no.1
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• pp.14-20
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• 2013

The electrospun PVDF containing CNT was made for fabricating materials of the actuator. The electrochemical and their actuating movement were evaluated for the actuator performance in the electrochemical environment. The actuator (which was fabricated by electrospinning) had some advantages, i.e., good dispersion and flexible properties. In the electrospinning process, the final product would have different forms based on different essential factors. In this work, electrospun nanofibers were aligned by using the drum-type collector, and the morphology was identified via the field emission-scanning electron microscope (FE-SEM). The uniform dispersion of CNT in PVDF nanofiber was observed by electron probe X-ray micro-analysis (EPMA) test. The results of tensile strength and electrical resistivity provided the aligned state. The electrospun CNT/PVDF nanofiber sheet on the aligned direction showed better mechanical and electrical properties than the case of the vertically-aligned direction. The efficiency and electrical capacities of electrospun CNT/PVDF nanofiber sheets were compared with the cast PVDF sheet for actuator application. Electrospun CNT/PVDF nanofiber sheet exhibited much better the case of actuator performance than cast neat PVDF actuator, due to the excellent electrical connecting areas.

• Electrical & Electronic Materials
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• v.3 no.4
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• pp.325-331
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• 1990

본 연구는 텅스텐 소결에 저온 활성제로 작용하는 Ni-P 공정합금을 미량첨가하여 제조공정의 간단화를 통한 새로운 W-Cu계 전기접점제조를 목표로 하였다. 이를 위해 1회 용침공정을 통해 제조한 W(Ni-P)-Cu 합금에 대한 전기접점특성을 조사하여 접점의 미세구조 관점에서 논의하였다. Ni-P 합금첨가한 접점은 기존의 순수 W-Cu 합금에 비해 낮은 접촉저항 및 낮은 아크소모를 나타내는 우수한 접점성능을 보여주었다. 이것은 Ni-P합금이 Cu용침이 개시되기전 짧은 승온단계에서 분말간의 강한 결합과 Cu용침에 유리한 기공통로를 갖는 W 분말 골격체의 형성을 유도하기 때문인 것으로 판단된다.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.83.2-83.2
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• 2010

평판형 고체산화물 연료전지(planar SOFC : Solid oxide Fuelcell)는 높은 전류 효율 및 출력밀도를 가지는 중,대형 발전용 전기소자이다. SOFC 스택을 600~800도에서 작동할 경우, 금속 분리판에서 휘발된 크롬에 의한 열화현상과 금속의 산화에 의한 표면 저항의 증가가 큰 문제점으로 알려져 있으며, 이를 개선하기 위한 많은 연구가 진행되고 있다. 본 연구에서는 금속 분리판의 열화를 억제하기 위한 여러 보호코팅의 특성을 밝히고, 특성차이의 원인을 분석하고자 하였다. 모재는 상용 STS444합금 (Nisshin steel 생산) 2.0mmt 박판을 사용하였으며, 표면 상태를 균일하게 하기 위하여 표면은 동일한 #1200 번 사포로 연마후 코팅하였다. 적용한 코팅은 전기도금 Ni 코팅, (MnCo)3O4 wet powder spray 코팅, (MnCo)3O4 ADM코팅 3종이었으며, 코팅층의 두께는 최적 공정조건에 따라 달리 하였다. 산화후 형성되는 표면 산화물의 전기적 특성을 평가하기 위하여 시험편의 비면적 저항 (ASR : area specific resistance)을 장시간 측정하였다. 측정편의 크기는 가로 4cm ${\times}$ 세로 4cm였으며, 100시간 공기중 산화후 측정하였다. 표면 접촉을 높이기 위하여 Pt paste를 40~50um도포하였으며, 1~0.1A인가된 전류에 대한 저항을 4전극법 (4-probe)으로 측정하였다. 표면 코팅층이 크롬 휘발을 억제하는 정도를 평가하기 위하여 크롬 휘발량을 측정하였다. 시편은 가로 1.5cm ${\times}$ 세로 1cm 였으며, 공급된 공기와 수분의 혼합가스와 응축기 표면에 흡착된 크롬의 양을 ICP-MASS법으로 측정하였다.

• Electrical & Electronic Materials
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• v.10 no.1
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• pp.39-44
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• 1997

Bulk type radiation detector of Au/Cd$_{1-x}$ Zn$_{x}$Te(x=20%)/Au structure using Cd$_{1-x}$ Zn$_{x}$Te(x=20%) wafer(3x4xl mm$^{3}$) grown by high pressure Bridgman method has been developed. We etched wafer surfaces with 2% Br-methanol solution and coated gold thin film on the surfaces by electroless deposition method for 5 min. in 49/o HAuCI$_{3}$ 4H20 solution. Initial etch rates of Cd, Zn and Te were 46%, 12% and 42% respectively. After etched, the surface of wafer was slightly revealed to Te rich condition. The leakage current was increased with etch time, but it didn't exceed 3nA at 50volt. The thickness of Au film was about 100nm by Rutherford Backscattering Spectroscopy(RBS). The resolution were 6.7% for 22.1 keV photon from 109 $^{109}$ Cd and 8.2% for 59.5 keV photon from $^{241}$ Am. The radiation detector such as Au/Cd$_{1-x}$ Zn$_{x}$Te(x=20%)/Au structure was more effective to monitor the low energy gamma radiation.iation.

• Journal of Korean Tunnelling and Underground Space Association
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• v.16 no.6
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• pp.599-614
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• 2014

When tunnelling with TBM (Tunnel Boring Machine), accessibility to tunnel face is very limited because tunnel face is mostly occupied by a bunch of machines. Existing techniques that can predict ground condition ahead of TBM tunnel are extremely limited. In this study, the TBM Resistivity Prediction (TRP) system has been developed for predicting anomalous zone ahead of tunnel face utilizing electrical resistivity. The applicability and prediction accuracy of the developed system has been verified by performing field tests at subway tunnel construction site in which an EPB (Earth Pressure Balanced) shield TBM was used for tunnelling work. The TRP system is able to predicts the location, thickness and electrical properties of anomalous zone by performing inverse analysis using measured resistivity of the ground. To make field tests possible, an apparatus was devised to attach electrode to tunnel face through the chamber. The electrode can be advanced from the chamber to the tunnel face to fully touch the ground in front of the tunnel face. In the 1st field test, none of the anomalous zone was predicted, because the rock around the tunnel face has the same resistivity and permittivity with the rock ahead of tunnel face. In the 2nd field test, 5 m thick anomalous zone was predicted with lower permittivity than that of the rock around the tunnel face. The test results match well with the ground condition predicted, respectively, from geophysical exploration, or directly obtained either from drilling boreholes or from daily observed muck condition.

• Tribology and Lubricants
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• v.12 no.4
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• pp.52-59
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• 1996

The results of the electrical contact conductivity of multi-contact spots accounting the surface roughness and the non-conductive films of different origins such as air, water, cutting oil, and machining oil are presented. The array of metal spheres compressed between two flat plates has been used for simulation of the contact behavior of multiple contact of solids, under normal loading. Measurement of electrical contact resistance has been made using the equipment providing the adequate accuracy in the range of micro Ohms. The data on electrical contact resistance have been compared with theoretical predictions using the multiple contact model of constriction resistance. The effect of single spot number and array on conductivity of contact has been evaluated. The results of the experiments show that the contact resistance are closely related to the number of loading cycles, form of surface roughness, and presence of non-conductive films that reduce the size of the real electrical contact spots.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.68-72
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• 1992

자동차 및 각종 판재 성형시 성형율을 향상시키는 방법에는 신소재 개발, 금형기술개발, 접촉부의 마찰을 줄여 주기 위한 윤활 등등이 있겠으나 손쉽게 공구다이 상하에 비드를 설치하여 판재를 성형할 경우 미끄럼 저항의 균형을 이루어 주름 억제와 두께분포가 보다 균일해지며 스프링백 현상 등으로 인한 성형 후 치수 불량 등을 주어 판재성형율을 향상시키는데 기여할 수 있다. 본 연구에서는 펀치가 판재를 성형하기 위해 진행됨에 따라 공구다이와 펀치간의 접촉각도가 변하게 되는 점을 고려하여 인출 각도변화에 따른 인출특성 및 마찰계수 변화등을 알아보고자 하며 원형 형태의 환저비드, 단일원형비드, 이중원형 비드의 종류와 크기변화 및 비드좌우 모서리 변화, 공구다이모서리변화, 블랭크가압력 변화, 비드 전진깊이 변화, 비드통 과 후 재료의 기계적 성질 변화등 인출 특성에 영향을 미치는 인자들을 변화시켜나가며 이에 따르는 인출특성을 Data Bank화 시켜 비드 종류나 형상에 따른 금형설계의 기초자료를 제공하고자 한다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.8
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• pp.1-6
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• 2010

We report on the electrical properties of Ti/Al/Ni/Au (20 nm/ 150 nm/ 30 nm/ 100 nm) Ohmic contacts and the anisotropic conductivity of n-type ${\alpha}$-plane ([11-20]) GaN grown on $\gamma$-plane ([1-102]) sapphire substrates. The Ti/Al/Ni/Au Ohmic contacts and their sheet resistances are characterized by using the transfer length method (TLM) as a function of azimuthal angles. It is found that the specific contact resistance does not depend on the axis orientation and there are significant electrical anisotropy in ${\alpha}$-plane GaN films on $\gamma$-plane sapphire substrates, and the sheet resistance varies with azimuthal angles. The sheet resistance values in the direction parallel to m-axis [1-100] are 25% ~ 75% lower than those parallel to c-axis [0001] directions. Thus, Basal stacking faults (BSFs) are offered as a feasible source of the anisotropic mobility in defected m-axis direction because the band-edge discontinuities owing to the differential band gap structure.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.54 no.1
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• pp.27-32
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• 2005

This study presents an analysis technique that can consider all variables which are needed in the design of short circuit current capability of electrical contacts. Required variables in the design are material of contact, contacting area, applied force, asperity of surface, current and so on. Short circuit current capability test was carried out for the interrelation of design variables and the verification of analysis technique. Temperature rise equation of the contacts was obtained from the test results, and also, a standard that is criterion of the occurrence availability of melting or spot of contact surface from test results was established.