• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.128-128
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• 2017

무전해 도금이란 외부의 전원을 사용하지 않고 환원제를 이용하여 금속 피막을 석출시키는 방법이다. 이러한 무전해 도금은 최근에 와서 인쇄회로기판(printed circuit board)등 다양한 전자부품에 적용되고 있다. 최근 급격한 금 가격 상승으로 인해 전자부품용에 사용되는 금의 사용량을 감소시키거나 또는 금을 대체할 수 있는 도금 층에 관한 연구가 활발하게 진행되고 있다. 금을 대체할 수 있는 즉 비용 경감의 가능성이 있는 도금 재료로는 팔라듐이 유력하다. 팔라듐은 금의 약 1/2가격으로 우수한 내식성 및 낮은 접촉저항을 가지기 때문에 접점재료로서 오래전부터 사용되어져왔다. 무전해 팔라듐-인 도금의 착화제, 환원제, 경도, 접촉저항에 대한 연구는 많이 있지만 도금속도에 미치는 인자에 대해서는 명확하지 않은 것이 많다. 따라서 본 연구는 무전해 팔라듐-인 도금의 석출석도에 미치는 에틸렌디아민 농도의 영향에 대하여 조사하였다. 실험방법으로는 환원제로 차아인산을 사용하고 착화제로는 에틸렌디아민을 사용하여 문전해 팔라듐-인 도금액을 제조하였다. 에틸렌디아민의 농도는 각각 5ml/L, 7.5ml/L, 10ml/L, 12ml/L로 하였다. pH는 7.5, 온도는 $45^{\circ}C$로 하여 30분 동안 도금을 실시하였다. 무전해 팔라듐-인 도금속도는 정밀저울로 무게를 측정하였고 ICP-OES을 사용하여 도금층의 농도를 분석, XRF를 사용하여 성분분석과 XRD를 사용해 결정회절을 분석하였다. 또한 SEM을 사용하여 단면 관찰을 하였으며 석출속도에 미치는 에틸렌디아민의 영향을 전기화학 분극곡선을 통해서 고찰을 시도해 보았다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.78-78
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• 2018

전기 아연도금은 철강의 내식성을 향상시키기 위한 희생양극으로 사용되어 왔다. 이러한 아연 도금층의 내식성은 그 아연에 의하여 부식으로부터 보호받는 철강 소재의 수명과 직결됨에 따라 아연 도금층의 성능 특히 부식저항성을 높이는 연구는 소재 수명 뿐만이라 성능의 유지하는데 있어서 매우 중요하다. 본 연구에서는 전기 아연 도금층에 표면에너지가 낮은 물질인 테플론을 얇게 코팅함으로써 발수성 표면을 구현하였다. 발수성 표면은 물에 대한 젖음성이 매우 낮기 때문에 부식 저항성이 높은 것으로 알려져 있는데, 이는 표면의 거칠기를 제어함으로써 그 효과를 극대화 할 수 있다. 본 연구에서는 특히 전기 아연 도금의 후처리로 알려진 인산염 처리를 이용하여 전기 아연 도금층의 표면형상 구조를 제어하였다. 그리고 그 표면에 테플론을 코팅함으로써 초발수 성질을 구현하였고, 이를 통해 아연 도금층의 내식성 향상에 대하여 분석하였다. 그 결과, 인산염처리에 의하여 표면형상의 구조가 거칠어질수록 테플론 코팅 후 접촉각과 물방울의 이동성은 증가하였다. 이는 표면형상에 의해서 공기층이 물방울 아래에 고립되어 있다는 것을 의미하고, 이러한 공기층으로 인하여 아연 도금층의 내식성은 크게 증가하였다.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.237-241
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• 2000

The structural, electrical and etching characteristics of Al alloy thin film with low impurity concentrations AlNd deposited by using do magnetron sputtering deposition are investigated for the applications as gate bus line in the TFt-LCD panel. And ITO thin film was deposited on AlNd, then the contact resistance was measured by Kelvin resistor. The deposited thin films show the decrease of resistivity and the increase of grain size after the RTA at $300^{\circ}C$ for 20 min. Moreover, the resistivity of AlNd does not show appreciable grain size dependence after RTA. It is concluded that the decrease of resistivity after RTA is due to the increase of grain size. The annealed AlNd is found to be hillock free. The etching profiles of AlNd was good and the minimun contact resistance was about $110\;{\mu\Omega}cm$. Calculation results reveal that the AlNd (2wt.%) thin film can be applicable to 25" SXGA class TFT-LCD panels.

• Applied Chemistry for Engineering
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• v.32 no.1
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• pp.68-74
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• 2021

Gas diffusion layer (GDL) compression is important parameter of polymer electrolyte membrane fuel cell (PEMFC) performance to have an effect on contact resistance, reactants transfer to electrode, water content in membrane and electrode assembly (MEA). In this study, the effect of GDL compression on fuel cell performance was investigated for commercial products, JNT20-A3. Polarization curve and electrochemical impedance spectroscopy was performed at different relative humidity and compression ratio using electrode area of 25 ㎠ unit cell. The contact resistance was reduced to 8, 30 mΩ·㎠ and membrane hydration was increased as GDL compression increase from 18.6% to 38.1% at relative humidity of 100 and 25%, respectively. It was identified through ohmic resistance change at relative humidity conditions that as GDL compression increased, water back-diffusion from cathode and electrolyte membrane hydration was increased because GDL porosity was decreased.

• Composites Research
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• v.29 no.5
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• pp.262-268
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• 2016

In this work, the pitch-based carbon paper (P-CP) was prepared by re-impregnating of binder pitches and PAN-based milled carbon fibers (MCF) at low temperature carbonization process. The influence of MCF content on physicochemical properties of MCF/P-CP was investigated. As a result, the tensile strength of MCF/P-CP was increased sharply from 10 wt.% to 20 wt.% of MCF. Also, the increase of MCF content led to the decrease of interfacial contact resistivity and the improvement of electrical and thermal conductivity of MCF/P-CP. These results were probably due to the increase of density of MCF/P-CP, resulting in the formation of electrically and thermally conductive paths of the carbon paper.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.12
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• pp.42-49
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• 2017

The application of electro-coagulation has been attempted to control the membrane fouling problem in a MBR (Membrane Bio-Reactor). This study examined the effects of the operating parameters (current density and contact time) of the electro-coagulation process on the change in the characteristics of activated sludge. The current density changed from 2.5 to 12, $24A/m^2$, and the contact time was varied from 0 to 2 and 6 hr, respectively. At a current density of $24A/m^2$ and 6 hr of operation, the MLSS changed from 6,800 to 7,000 mg/L (3% increase), but the MLVSS did not increase significantly. After 6 hr of operation, the soluble COD decreased from 71 to 37 mg/L under the $24A/m^2$ condition, from 113 to 67 mg/L under the $12A/m^2$ condition, and from 84 to 80 mg/L under the $2.5A/m^2$ condition. On the other hand, soluble-TN and -TP concentration showed slight changes. The soluble-EPS and Bound-EPS concentration decreased slightly with increasing current density. The membrane filtration performance of activated sludge before and after electro-coagulation was compared. The filtration resistances after electro-coagulation decreased from 6 to 61 %, particularly as the current density and contact time were increased. This indicates that electro-coagulation can be used to control membrane fouling in the MBR process.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.11
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• pp.1-5
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• 2010

We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

• Applied Chemistry for Engineering
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• v.32 no.6
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• pp.664-670
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• 2021

Stainless steel was applied as bipolar plate (BP) of polymer electrolyte membrane fuel cell (PEMFC) due to high mechanical strength, electrical conductivity, and good machinability. However, stainless steel was corroded and increased contact resistance resulting PEMFC performance decrease. Although the corrosion resistance could be improved by surface treatment such as noble metal coating, there is a disadvantage of cost increase. The stainless steel corrosion behavior and passive layer influence on PEMFC performance should be studied to improve durability and economics of metal bipolar plate. In this study, SUS316L bipolar plate of 25 cm² active area was manufactured, and experiments were conducted for corrosion behavior at an anode and cathode. The influence of SUS316L BP corrosion on fuel cell performance was measured using the polarization curve, impedance, and contact resistance. The metal ion concentration in drained water was analyzed during fuel cell operation with SUS316L BP. It was confirmed that the corrosion occurs more severely at the anode than at the cathode for SUS316L BP. The contact resistance was increased due to the passivation of SUS316L during fuel cell operation, and metal ions continuously dissolved even after the passive layer formation.

• Fire Science and Engineering
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• v.18 no.4
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• pp.57-63
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• 2004

We investigated heat properties of connection terminal in residual current protective devices(RCD) according to contact pressure for low voltage appliance. And we analyzed voltage and current waveform and oxide propagation when the poor-contact happened between terminal and wire. When contact pressure between terminal and connection wire was not applied, the heat was generated and an oxide was formed on the surface of the wire. The temperature of the insulation surrounding terminal was ascended sharply by poor-contact, micro-sparks and continuous arc sound happened in interior terminal. When the poor-contact by vibration occurred inner conductor of terminal and wire, an oxide was propagated on contact surface and the temperature was increased at 869℃. Thus, we found that the risk of electrical disaster is high in terminal and connection wire parts.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2003.05a
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• pp.655-660
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• 2003

MCCB (Molded Case Circuit Breaker)는 절연 용기 (molded case) 내에 개폐기구, 트립(trip)장치 등을 일체로 조립한 것으로, 과부하 및 단로 등의 이상 상태시 자동적으로 전류를 차단하는 기기이다. 오늘날 고도 정보화 사회에서는 안정된 전력공급이 요구되고 있으며, 기술의 고도화를 배경으로 소형화, 신뢰도 및 경제성 향상이 도모되고 있다. 이와 함께, MCCB는 전력 공급장치분야 뿐만 아니라, 산업분야 전반에 걸쳐 매우 광범위하게 적용되고 있다.(중략)