• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.246-251
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• 2012

Pulse electrochemical polishing process has been used to improve mechanical properties such as surface roughness and corrosion resistance on conductive metallic materials. In addition, pulse electrochemical polishing process with various frequency may produce a lustrous, smoother, deburred and cleaned surface on workpiece. The aim of this paper is to study surface characteristics of pulse electrochemical polishing for various frequency conditions using AFM to verify localized surface variation in nanometer scale.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.2
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• pp.148-153
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• 2013

This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.949-950
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.239-240
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• 2013

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.41-48
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• 2015

Stainless steel mesh has been used as a filter in various fields, including domestic, medical, etc. However, the surface before machining may have an adverse effect the product quality and performance because it is not smooth. Especially, adsorbed impurities in the surface result in difficulty in cleaning. Therefore, in this paper, we propose an improved surface quality through electrochemical polishing (ECP). Two electrodes, composed of STS304 (anode) and copper (cathode) underwent machining with two conditions according to polishing time and current density. As the polishing time and current density increase, the surface of curvature decreases, and roughness and material removal rate (MRR) improves. The machined surface roughness and image were obtained through the atomic force microscope (AFM) and stereoscopic microscope. The study also analyzed hydrophilic effect through contact angles. This obtains corrosion resistance, smoothness, hydrophilic property, etc.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.5
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• pp.795-799
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• 2013

This paper describes a novel hybrid surface polishing process combining non-traditional electrochemical polishing (ECP) with external artificial ultrasonic vibration. The purpose of this study is to develop an easier method for improving stainless steel surfaces. To this end, vibration electrochemical polishing (VECP), a novel ultrasonic manufacturing process, for enhancing electrochemical reaction and surface quality compared with that achieved using conventional ECP is suggested. In addition, for finding the optimized experimental conditions, the two methods are compared under various current densities. Localized roughness of the work material is measured with atomic force microscopy (AFM) and scanning electron microscopy (SEM) for obtaining detailed surface information.

• Journal of Sensor Science and Technology
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• v.11 no.1
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• pp.54-59
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• 2002

This paper describes a new process technique for batch process of SOI(Si-on-Insulator) structures with buried cavities for MEMS(Micro Electro Mechanical System) applications by SDB(Si-wafer Direct Bonding) technology and electrochemical etch-stop. A low-cost electrochemical etch-stop method is used to control accurately the thickness of SOI. The cavities were made on the upper handling wafer by Si anisotropic etching. Two wafers are bonded with an intermediate insulating oxide layer. After high-temperature annealing($1000^{\circ}C$, 60 min), the SDB SOI structure with buried cavities was thinned by electrochemical etch-stop. The surface of the fabricated SDB SOI structure have more roughness that of lapping and polishing by mechanical method. This SDB SOI structure with buried cavities will provide a powerful and versatile substrate for novel microsensors arid microactuators.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.338-338
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• 2012

사파이어 ($Al_2O_3$)는 높은 밴드갭 에너지 (~19.5 eV)를 가진 물질로서 우수한 내마모성, 강도, 전기 절연성 및 안정한 화학적 특성을 갖고 발광다이오드 기판, 보석재료 등 각종 산업 및 기술적 분야에서 널리 사용되고 있다. 특히, 플립칩 발광다이오드 구조의 경우 광추출효율을 향상시키기 위해 높은 투과도를 갖는 사파이어 기판이 요구되어 왔으며, 지금까지 건식/습식식각방법을 이용한 사파이어 표면에 마이크로 크기의 심한 거칠기 또는 요철이 형성된 나노크기의 격자구조를 형성시키는 연구가 진행되어 오고 있다. 그 중, 나노 크기의 격자구조는 공기에서 반도체 기판까지 선형적인 유효굴절률 분포를 갖기 때문에 표면에서 생기는 Fresnel 반사 손실을 줄일 수 있다. 이러한 구조를 형성하기 위해서는 식각 마스크가 필요한데, 형성 방법으로 레이저 간섭 리소그래피, 전자빔 리소그래피, 나노임프린트 리소그래피 등이 있으나, 비싼 가격과 복잡한 공정 절차 등의 단점을 지니고 있다. 따라서 본 연구에서는 식각 마스크 패턴을 위해, 보다 저렴하고 간단한 실리카 나노구 및 열적응집 금 나노 입자를 이용하였다. 양면 폴리싱 c-plane 사파이어 기판을 사용하였고, 단일 층의 주기적인 실리카 나노구를 기판 표면에 스핀코팅에 의해 도포한 후 유도결합플라즈마 식각 장비를 이용하여 식각하여 주기적인 패턴을 갖는 렌즈모양의 격자구조를 형성하였다. 그리고 주기적으로 형성된 격자 위에 열 증착기를 이용하여 금 박막을 증착한 후 급속열적어닐닝(rapid thermal annealing)을 이용하여 열처리함으로써 비주기적인 금 나노입자를 형성시켰다. 형성된 금 나노패턴을 이용하여 동일한 조건으로 식각함으로써 광대역 및 전방향성 높은 투과도를 갖는 원뿔 모양의 사파이어 나노구조를 제작하였다. 제작된 샘플의 패턴 및 식각 형상은 전자현미경을 사용하여 관찰하였으며, UV-vis-NIR 분광광도계 (spectrophotometer)를 사용하여 투과율을 측정하였다. 렌즈 모양 표면 위에 원뿔모양의 나노구조를 갖는 사파이어 기판은 일반적인 사파이어 기판보다 향상된 투과율 특성을 보였다.