• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.149-154
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• 2005

We fabricated Ni/Co(or Co/Ni) composite silicide layers on the non-patterned wafers from Ni(20 nm)/Co(20 nm)/poly-Si(70 nm) structure by rapid thermal annealing of $700{\~}1100^{\circ}C$ for 40 seconds. The sheet resistance, cross-sectional microstructure, and surface roughness were investigated by a four point probe, a field emission scanning electron microscope, and a scanning probe microscope, respectively. The sheet resistance increased abruptly while thickness decreased as silicidation temperature increased. We propose that the poly silicon inversion due to fast metal diffusion lead to decrease silicide thickness. Our results imply that we should consider the serious inversion and fast transformation in designing and process f3r the nano-height fully cobalt nickel composite silicide gates.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.118-118
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• 2010

유리 기판 상에 system on panel (SOP) 구현을 위한 비휘발성 메모리 (NVM)를 제작하였다. 기존에 사용되던 charge storage layer인 SiNx 대신에 a-Si를 사용하여 전하 저장량 증가 및 전하유지 특성 향상시켰다. 그 결과 bandgap이 작아 band edge 저장 가능하였으며, SiNx 와 마찬가지로 a-Si 내 트랩에 저장되었다. $SiO_2$/a-Si와 a-Si/SiON 계면의 결함 사이트에 전하 저장되었으며, 또한 bandgap이 작아 트랩 또는 band edge에 위치한 전하들이 높은 bandgap을 가지는 blocking 또는 tunneling layer를 통하여 빠져 나오기 어려웠다. ONOn 구조의 두께와 동일한 OSOn 박막을 사용한 구조에서는 전하 저장 특성은 뛰어나나 기억유지 특성이 나빴다. 이에 대한 향상 방안으로는 Tunneling 박막의 두께를 증가시키는 것과 OSOSOn 적층 구조 소자를 만드는 방법이 있다. Tunneling 박막의 두께를 증가시킨 소자는 기억유지 특성 향상되는 특성을 보였으며 OSOSOn 적층 구조 소자는 전하저장 및 기억유지 특성 향상을 보였다. 특히, OSOSOn 구조의 경우 2개의 터널링 barrier를 사용함으로써 전하 저장 사이트의 증가에 기여하며, 기억 유지 특성도 좋아졌다. 본 연구에서 소자는 NVM이 아닌 MIS 구조로만 제작되었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.259-259
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• 2016

반도체 산업 전반에 걸쳐 이루어지고 있는 연구는 소자를 더 작게 만들면서도 구동능력은 우수한 소자를 만들어내는 것이라고 할 수 있다. 따라서 소자의 미세화와 함께 트랜지스터의 구동능력의 향상을 위한 기술개발에 대한 필요성이 점차 커지고 있으며, 고유전(high-k)재료를 트랜지스터의 게이트 절연막으로 이용하는 방법이 개발되고 있다. High-k 재료를 트랜지스터의 게이트 절연막에 적용하면 낮은 전압으로 소자를 구동할 수 있어서 소비전력이 감소하고 소자의 미세화 측면에서도 매우 유리하다. 그러나, 초미세화된 소자를 제작하기 위하여 high-k 절연막의 두께를 줄이게 되면, 전기적 용량(capacitance)은 커지지만 에너지 밴드 오프셋(band-offset)이 기존의 실리콘 산화막(SiO2)보다 작고 또한 열공정에 의해 쉽게 결정화가 이루어지기 때문에 누설전류가 발생하여 소자의 열화를 초래할 수 있다. 따라서, 최근에는 이러한 문제를 해결하기 위하여 게이트 절연막 엔지니어링을 통해서 누설전류를 줄이면서 전기적 용량을 확보할 수 있는 연구가 주목받고 있다. 본 실험에서는 high-k 물질인 Ta2O5와 SiO2를 적층시켜서 누설전류를 줄이면서 동시에 높은 캐패시턴스를 달성할 수 있는 게이트 절연막 엔지니어링에 대한 연구를 진행하였다. 먼저 n-type Si 기판을 표준 RCA 세정한 다음, RF sputter를 사용하여 두께가 Ta2O5/SiO2 = 50/0, 50/5, 50/10, 25/10, 25/5 nm인 적층구조의 게이트 절연막을 형성하였다. 다음으로 Al 게이트 전극을 150 nm의 두께로 증착한 다음, 전기적 특성 개선을 위하여 furnace N2 분위기에서 $400^{\circ}C$로 30분간 후속 열처리를 진행하여 MOS capacitor 소자를 제작하였고, I-V 및 C-V 측정을 통하여 형성된 게이트 절연막의 전기적 특성을 평가하였다. 그 결과, Ta2O5/SiO2 = 50/0, 50/5, 50/10 nm인 게이트 절연막들은 누설전류는 낮지만, 큰 용량을 얻을 수 없었다. 한편, Ta2O5/SiO2 = 25/10, 25/5 nm의 조합에서는 충분한 용량을 확보할 수 있었다. 적층된 게이트 절연막의 유전상수는 25/5 nm, 25/10 nm 각각 8.3, 7.6으로 비슷하였지만, 문턱치 전압(VTH)은 각각 -0.64 V, -0.18 V로 25/10 nm가 0 V에 보다 근접한 값을 나타내었다. 한편, 누설전류는 25/10 nm가 25/5 nm보다 약 20 nA (@5 V) 낮은 것을 확인할 수 있었으며 절연파괴전압(breakdown voltage)도 증가한 것을 확인하였다. 결론적으로 Ta2O5/SiO2 적층 절연막의 두께가 25nm/10nm에서 최적의 특성을 얻을 수 있었으며, 본 실험과 같이 게이트 절연막 엔지니어링을 통하여 효과적으로 누설전류를 줄이고 게이트 용량을 증가시킴으로써 고집적화된 소자의 제작에 유용한 기술로 기대된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.317-318
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• 2008

Cu-Pc유기물 반도체를 얼 진공증착기술로 유리기판위에 40 nm 두께로 적층하였다. 상온에서 적층한 박막과 상온에서 적층한 후 $250^{\circ}C$ 이상의 온도로 후열 처리한 박막과 박막 적층 시 기판의 온도를 $250^{\circ}C$로 고정하여 적층한 박막들을 상호 비교 분석하였다. 적층된 Cu-Pc의 박막의 온도조건에 따라 X-ray diffraction(XRD)의 결정 특성이 $\alpha$-phase와 $\beta$-phase로 뚜렷이 구분되었으며， 자외선-가시광선 영역의 광 흡수도(UV-visible absorption spectra)와 field emission scanning electron microscopy(FE SEM)를 이용하여 결정성장 방향 및 표면 특성 변화를 비교조사하였다.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.25 no.4
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• pp.293-300
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• 2012

In this study, the delamination analysis has been implemented to investigate the initiation and propagation of crack in composite laminates composed of orthotropic materials. A simple modeling was achieved by moving nodal technique without re-meshing work when crack propagation occurred. This paper aims at achieving two specific objectives. The first is to suggest a very simple modeling scheme compared with those applied to conventional h-FEM based models. To verify the performance of the proposed model, analysis of double cantilever beams with composite materials was implemented and then the results were compared with reference values in literatures. The second one is to investigate the behavior of interior delamination problems using the proposed model. To complete these objectives, the full-discrete-layer model based on Lobatto shape functions was considered and energy release rates were calculated using three-dimensional VCCT(virtual crack closure technique) based on linear elastic fracture mechanics.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.12
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• pp.614-621
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• 2019

A generalized laminated composite beam element is presented for the flexural and buckling analysis of laminated composite beams with double and single symmetric cross-sections. Based on shear-deformable beam theory, the present beam model accounts for transverse shear and warping deformations, as well as all coupling terms caused by material anisotropy. The plane stress and plane strain assumptions were used along with the cross-sectional stiffness coefficients obtained from the analytical technique for different cross-sections. Two types of one-dimensional beam elements with seven degrees-of-freedom per node, including warping deformation, i.e., three-node and four-node elements, are proposed to predict the flexural behavior of symmetric or anti-symmetric laminated beams. To alleviate the shear-locking problem, a reduced integration scheme was employed in this study. The buckling load of laminated composite beams under axial compression was then calculated using the derived geometric block stiffness. To demonstrate the accuracy and efficiency of the proposed beam elements, the results based on three-node beam element were compared with those of other researchers and ABAQUS finite elements. The effects of coupling and shear deformation, support conditions, load forms, span-to-height ratio, lamination architecture on the flexural response, and buckling load of composite beams were investigated. The convergence of two different beam elements was also performed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.9
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• pp.481-487
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• 2019

Additive manufacturing is a state-of-the-art manufacturing process technology in which three-dimensional structures are fabricated by laminating two-dimensional sections of a structure using various materials such as plastic, ceramics, and metals. The additive manufacturing technology has the advantage of high design freedom, while the surface property (roughness) of the finished product varies depending on the process conditions, which necessitates performing a post-process after the products are manufactured. In this study, the surface roughness of a structure made of polyamide 12, which was manufactured by SLS (Selective Laser Sintering) and MJF (Multi Jet Fusion) process was compared. The processing condition was classified by the building orientation of structure as 0, 45, and 90 degrees, which is the angle between the analytical surface and the horizontal plane of the fabrication platform. Structures with a hole of various diameters ranging from 1mm to 10mm were manufactured and the hole characteristics (ratio of hole depth to diameter) and results of the specimens were compared. As a result of the surface characteristics analysis, the surface roughness value of the specimens manufactured with a building orientation of $45^{\circ}$ was the highest in both technologies. In the case of the through-hole structure fabrication, the shape was maintained with 5mm and 10mm diameter holes regardless of the building orientation, although the hole forming was difficult for the smaller holes.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.102-110
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• 2023

This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.

• The Journal of the Acoustical Society of Korea
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• v.21 no.7
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• pp.600-605
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• 2002

In this paper, a Negative Impedance Converter (NIC) circuit was employed for the electro-mechanical characteristic control of a thickness mode piezoelectric vibrator. Two circular plane piezoelectric vibrators were bonded together and the NIC circuit was connected to one of the vibrators. The theoretical and experimental analysis of the characteristics shown that the quality factor and the electro-acoustic efficiency of the vibrator with the NIC circuit could be improved by 20 times and 2.5 times, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.11
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• pp.42-50
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• 2016

Overlay welding affects the chemical components and weld hardness by dilution of the lamination layer thickness, which determines the surface properties. This study experimentally investigates different numbers of layers for overlay welding monel materials, which are anti-corrosion materials. The Fe content, weldability of the base metal and monel materials, hardness, and surface flatness were examined. Each evaluation was carried out after overlay welding with three layers on the base material and pipe base material of the plate. The Fe content was evaluated by analyzing the constituents of each layer. The Fe content was satisfactory in the three layers. The weldability of the laminate specimens was evaluated by a bending test. The hardness and bead flatness of the laminate specimens were evaluated by micro Vickers and 3D measurements. The hardness was highest in the heat-affected zone with one layer, and it decreased with increasing lamination. In the case of bead flatness, there is a sharp difference in the deviation with increasing numbers of laminations, which should be considered carefully.