• Composites Research
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• v.33 no.1
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• pp.13-18
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• 2020

Recently, the fire rescue truck in problem proceed research it for the fast works action and for pass the small road. So we were research for weight reduction. In this study, the (NO. 5) fifth boom of the fire rescue truck have 288 mm(W) × 299 mm(D) × 3,691 mm(L) with a maximum load of 876 kg and the thickness of 3 mm of the Steel Boom. This changing of Steel (STRENX960) to CFRP was weave Carbon Fiber NCF (±45°, 2axis) and then it make the NCF Prepreg. This process was designed based on structural analysis, the effects of NCF Prepreg (±45°) on torsion were identified, and the optimal design was made with Stacking Pattern (b). Stack patterns were optimized for levels equal or higher than existing Steel Boom and CFRP Boom stacked in the UD direction, and finally, the lightening effect on weight of approximately 49.6% of the steel was identified.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.148-150
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• 2001

본 논문에서는 소결 후 20 ㎛ 정도의 두께를 갖는 ceramic green sheet를 이용하여 초소형(1005) 칩 인덕터를 제작하였다. 인덕터의 패턴을 최적화함에 있어서 HP사의 HFSS(High Frequency Structure Simulator)를 이용하였고 이 과정에서 인덕터의 전기적 특성, 등가회로등을 추출하였다. 칩 인덕터를 제작함에 있어서 모든 적층 공정을 최적화하였다. 실제 제작한 인덕터와 simulation 결과의 관계성을 도출하고 이를 통해 목표 용량을 tuning하였다. 이와 같은 과정을 통해 1-39 nH의 인덕턴스를 갖는 1005크기의 칩 인덕터를 개발하였고, 이를 선진사의 제품과 비교할 때 우수한 전기적 특성을 나타내었다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.6
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• pp.411-418
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• 2020

In this paper, approximation and optimization methods are proposed for the structural performance of the composite fan blade. Using these methods, we perform the optimal design of the stacking sequence to maximize stiffnesses without changing the mass and the geometric shape of the composite fan blade. In this study, the lamination parameters are introduced to reduce the design variables and space. From the characteristics of lamination parameters, we generate response surface model having a high fitness value. Considering the requirements of the optimal stacking sequence, the multi-objective optimization problem is formulated. We apply the two-step optimization method that combines gradient-based method and genetic algorithm for efficient search of an optimal solution. Finally, the finite element analysis results of the initial and the optimized model are compared to validate the approximation and optimization methods based on the lamination parameters.

• Composites Research
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• v.34 no.3
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• pp.174-179
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• 2021

Currently, fluid transfer steel pipes take a lot of time and expense to maintain all facilities due to new construction and painting or corrosion and aging. Therefore, this study was conducted for designing a CFRP pipe structure with high corrosion resistance and chemical resistance as a substitute for steel pipes. The helical/hoop pattern was cross-laminated to improve durability, and HNT was added to suppress the moisture absorption phenomenon of the epoxy. The HNT/CFRP pipe was manufactured by a filament winding process, and performed a mechanical property test, and a moisture absorption test in distilled water at 70℃. As a result, the highest bending strength was obtained when the hoop pattern was laminated with a thickness equivalent to 0.6% of the pipe. The 0.5 wt% HNT specimen had the highest moisture absorption resistance. Also, the delamination phenomenon at the interlayer interface was delayed, resulting in the lowest strength reduction rate.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.10
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• pp.985-995
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• 2003

In this paper, a study on optimization of three dimensional multi-layered metallic disk array structure(MDAS) excited by circular waveguides was performed to shape efficient flat-topped element patterns(FTEP) of ${\pm}$20$^{\circ}$ beam width. Each radiating element of the MDAS is composed of input, transition and radiation circular waveguides and finite metal disks stacked on radiation circular waveguide. It has an array structure of a hexagonal lattice appropriate for the conical beam scanning. The analytic algorithm for the MDAS was proposed and the code was also programmed using it. Optimal design parameters of the MDAS were determined through the optimal simulation process to obtain ${\pm}$20$^{\circ}$ FTEP. Also, bandwidth characteristics for FTEP and reflection coefficients of the MDAS were investigated and, as the results, it was shown that the MDAS could shape good FTEPs of ${\pm}$20$^{\circ}$ beam width in main planes at least within a 5.6 % frequency band.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1999.10a
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• pp.22-22
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• 1999

로켓의 노즐의 확대부와 같은 내열특성 증진이 필요한 곳에 주로 적용되어온 Involute 구조는 얇은 두께의 fabric 프리 프레그룰 일정한 패턴에 맞추어 재단한 후 적층하여 제작되어진다. 이렇게 제작된 노즐 확대부와 같은 구조물은 내삭마 및 구조 특성이 향상되고, 적층 및 성형 중 발생하는 링클과 보이드도 많이 예방할 수 있는 장점을 가진 것으로 알려져 있다. 이와 같은 장점 때문에 60년대부터 제작되어 노즐 확대부에 적용되어온 Involute 구조는 기하학적 복잡성으로 인해서 본질적으로 구조물의 비등방성 및 비균질성을 수반하게 되며, 이에 따른 열 및 구조해석의 어려움이 존재하게 된다. 70년대 Pagano에 의해서 그 기하학적복잡성이 수학적으로 규명되기 시작하여 80년대 가장 활발한 구조해석이 수행되어 노즐의 설계에 적용되었으며, 90년대 들어와서는 비선형 해석 및 최적설계 기법을 도입한 Involute 구조물의 기하학적 형상 및 구조적 최적화가 진행되고 있다. 하지만 국내에서는 아직까지 Involute 구조의 구조해석이 생소한 분야로서, 앞에서 언급한 일련의 진행 과정과 특징 등을 요약 및 정리할 필요가 있다 따라서, 본 발표는 비등방성 및 비균질성의 Involute 구조물에 대한 구조해석 기법들을 파악하고 그 적용 방법을 생각해 보고자 한다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.853-858
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• 2010

DRAM package substrate has been demonstrated using a thick alumina layer produced by aluminum anodization process. To apply a transmission-based design methodology, 2 dimensional electromagnetic simulation is performed. The design parameters including signal line width/spacing and alumina's thickness are optimized based on the simulation analysis and are verified with the fabrication and the measurement of the test patterns on the anodic alumina substrate. DDR2 DRAM package is chosen as a design vehicle. Aluminum anodization technique has been applied successfully to fabricate new DRAM package substrate.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.37-41
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• 2012

The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.12
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• pp.776-781
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• 2017

In this study, we investigated the effect of electrode pattern design on the thermal shock resistance and temperature uniformity of a ceramic heater. A cordierite substrate with a low thermal expansion coefficient was fabricated by tape casting, and a tungsten electrode was printed and used as a heating element. The temperature distribution of the ceramic heater was calculated by a finite-element method (FEM) by considering various electrode patterns, and the tensile stress distribution due to the thermal stress was calculated. In the electrode pattern with a single-line width, the central part of the ceramic heater was heated to the maximum temperature, and the position of the ceramic heater having a double-line width was changed to the maximum temperature, depending on the position of the minimum line width pattern. The highest tensile stress was found along the edges of the ceramic heater. The temperature gradient at the edge determined the tensile stress intensity. The smallest tensile stress was observed for electrode pattern D, which was expected to be advantageous in resisting thermal shock failures in ceramic heaters.