• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.04a
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• pp.7-7
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• 2003

90년대 중반부터 이동통신제품과 인터넷의 대중화에 의한 노트북 PC등 휴대용 멀티미디어제품의 수요 급증은 전자 제품의 소형화 및 복합화를 유도하였으며, 이러한 제품의 추세에 대응하기 위하여 세라믹 부품은 벌크 단품에서 적층형으로 급속하게 바뀌고 있다. 이러한 정보기기의 좀 더 낳은 생산성과 효율을 얻기 위해 소형화, 경량화 및 고기능화의 요구에 대응되는 공정으로서 부품의 표면실장기술이 80년대에 실용화되었고, 이에 따른 칩 부품의 수요도 급격히 증가하고 있다. 대표적인 칩부품중의 하나인 MLCC(Multi Layer Ceramic Capacotor)는 전자제품의 소형경량화 및 대량생산과 더불어 필수적이 수소동자로써 지금까지 그 성장세는 휴대폰과 컴퓨터생산의 빠른 증가에 EK라 매년 약 15% 정도로 증가하고 있으며, 앞으로 그 수요는 더욱더 등가 할 것이다. EH한 고용량 영역까지 용량대를 확장함으로써, 탄탈 및 알루미늄 전해콘덴서의 영역까지도 확대 형성될 것으로 예상되고 있다. 본 강연에서는 MLCC의 제조기술 동향과 시장에 대한 전망에 대해 소개함으로써, 하루가 다르게 발전하고 있는 전자산업의 고용량화, 초소형화, 특수품, 복합화 등의 적층부품 전반의 현황 및 발전방향 파악하는데 조금이라도 도움이 되고자 한다.

• Proceedings of the KIEE Conference
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• 1999.11b
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• pp.446-449
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• 1999

본 연구에서는 기존의 자성 웨지의 제조공정을 대체하여 제조 공정이 단순하고, 그의 정밀성이 우수한 tape casting-lamination법에 의한 자성 웨지의 제조 공정의 적용 가능성에 대한 연구를 수행하였다. 철 분말과 에폭시 slurry는 우수한 tape casting 특성을 보여주었으며, 이렇게 얻어진 green tape과 유리 섬유를 적층하여 자성 웨지를 얻었다. 이러한 과정을 거쳐서 얻어진 제품의 품질 특성을 평가한 결과, 기존의 제조 공정으로 얻어진 제품에 비하여 품질의 균일성이 우수하며, 제조 공정을 혁신적으로 단축하는 것이 가능한 것을 보여주고 있다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.6
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• pp.250-255
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• 2018

The CoCrMo as-built alloys prepared by 3D-printing process are studied on tensile strength, wear resistance, crystal structure and microstructure after complex heat-treatment including HIP. In this study, HIP treatment for removing micropores, ambient heat-treatment for formation of metal carbides, and solution heat-treatment for homogenization of the created metal carbides were tried and characterized for applying to artificial joint. The complex heat-treatment effects of the CoCrMo as-built alloys prepared by 3D-printing process were owing to the densification during HIP, formation of metal carbides and homogenization of the created metal carbides. The effects of the complex heat-treatment were confirmed by XRD, FE-SEM and EDS.

• Composites Research
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• v.19 no.2
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• pp.20-27
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• 2006

The hybrid composite materials with non-woven tissue (NWT) was developed to improve the mechanical properties of conventional FRP composite materials. The hybrid prepreg with NWT consists of FRP prepreg and NWT prepreg. The NWT prepreg consists of NWT and polymer resin. The NWT has short fibers, discretely distributed with in-plane random orientation fibers. The purposes of this study of hybrid prepreg with NWT are (i) to increase the interlaminar properties(the fracture toughness and strength), (ii) to improve the mechanical properties and reliability, while maintaining a low cost, (iii) to introduce a tough and strong interlayer at critical positions to be required of strength in the laminate. To accomplish the above purposes, a production technique to decrease voids in NWT layers was proposed in this paper. The interlaminar failure characteristics of laminated composite materials was tremendously improved by hybrid concept with NWT.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• Composites Research
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• v.16 no.2
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• pp.33-40
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• 2003

In order to overcome one of the most pronounced shortcomings of conventional laminated composites, such as the low damage tolerance due to delamination, the thermoplastic materials and 3D (three-dimensional) preforms have been utilized in the manufacture of composite materials. From the newly developed process termed as the co-braiding, hybrid yarns of the thermoplastic fibers (PEEK) and reinforcing fibers (carbon) have been fabricated. In order to further enhance the delamination suppression, through thickness fibers have been introduced by way of 3D weaving technique in the fabrication of textile preforms. The preforms have been thermoformed to make composite materials. Complete impregnation of the PEEK into the carbon fiber bundles has been confirmed. For the comparison of mechanical performance of 3D woven composites, quasi-isotropic laminates using APC-2/AS4 tapes have been fabricated. Tensile and compressive properties of both the composites have been determined. Furthermore. the open hole, impact and CAI(Compression After Impact) tests were also carried out to assess the applicability of 3D woven textile reinforced thermoplastic composites in aerospace structures.

• Composites Research
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• v.34 no.4
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• pp.199-211
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• 2021

As an additive manufacturing achieves technological advances, it enables to manufacture complex structures with saving a cost and time. Therefore, metamaterials, which has geometric complexity, have gradually gathered attention due to the unprecedented properties: the unprecedented mechanical, thermal, electromagnetic, and optical properties. The metamaterials could exhibit a high potential in engineering applications, and thus it has been steadily investigated to design or/and develop novel metamaterials. Here, mechanical metamaterials, which had been reported, were reviewed to suggest the way to design and fabricate the metamaterials for industrial applications.

• Journal of Korea Foundry Society
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• v.44 no.2
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• pp.43-48
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• 2024

• Journal of the Korean Society of Propulsion Engineers
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• v.24 no.5
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• pp.91-102
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• 2020

Recently, a new space era has evolved in which commercial companies' led space development has begun. In this era, commercial companies actively participate in space development as the size of the small satellite market and small launch vehicle market is expanding. Through space development, developed countries are making efforts to reduce development, production, and operation costs to secure the competitiveness of small launch vehicles. In this study, the development trend of small launch vehicles and required technologies for space development were analyzed and summarized. Thus, research and development is urgently needed so that spin-on technologies, such as electric pumps and additive manufacturing, can be utilized for space development.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.329-329
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• 2010

적층 액츄에이터는 우수한 압전특성 및 그 재료가 가진 고유한 특성 때문에 최근 이동통신 단말기용 햅틱 소자 및 PC 와 그 주변기기로 수요가 폭발적으로 증대되고 있으며, 향후에도 CATV 네트워크와 무선통신기기를 비롯한 디지털 통신분야로 응용분야가 확대되리라 예상된다. 적층 액츄에이터에서 발생되는 에너지는 세라믹 그린시트 두께와 전극 면적에 비례하여 변위 및 응력이 증가하게 되므로 고적층형에 대한 필요성이 증대되고 있다. 이러한 고적층 액츄에이터의 경우 소성과정에 서 warpage 및 de-lamination 같은 결함이 발생하기 쉬우므로 그린시트의 균일성 및 전극과의 matching성 확보가 중요한 요소이다. 본 연구에서는 슬러리의 분산성과 시트 내 유기물 함량 최적화 실험을 진행하여 적층 액츄에이터용 그린시트를 최적화 한 후 공정 적용성 및 저온소성 전극인 Ag-Pd 전극과의 매칭성을 확보하고자 하였다. 이러한 후막공정 기술 개선을 통해 적층 액츄에이터를 제조하여 압전 특성을 측정하였다.