• Composites Research
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• v.35 no.6
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• pp.371-377
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• 2022

Triboelectric nanogenerator (TENG) devices have generated a lot of interest in recent decades. TENG technology, which is one of the technologies for harvesting mechanical energy among the energy wasted in the environment, is obtained by the dual effect of electrostatic induction and triboelectric charging. Recently, a multilayer thin film stacking method (or layer-by-layer (LbL) self-assembly technique) is being considered as a method to improve the performance of TENG and apply it to new fields. This LbL assembly technology can not only improve the performance of TENG and successfully overcome the thickness problem in applications, but also present an inexpensive, environmentally friendly process and be used for large-scale and mass production. In this review, recent studies in the accomplishment of LbL-based materials for TENG devices are reviewed, and the potential for energy harvesting devices reviewed so far is checked. The advantages of the TENG device fabricated by applying the LbL technology are discussed, and finally, the direction and perspective of this fabrication technology for the implementation of various ultra-thin TENGs are briefly presented.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.5
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• pp.103-110
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• 2020

Bio-inspired underwater robots have been studied to improve the dynamic performance of fins, such as swimming speed and efficiency, which is the most basic performance. Among them, bio-inspired soft robots with a compliant tail fin can have high degrees of freedom. On the other hand, to improve the driving efficiency of the compliant fins, the stiffness of the tail fin should be changed with the driving frequency. Therefore, a new type of variable stiffness mechanism has been developed and verified. This study, which was inspired by the anatomy of a real dolphin, assessed a process of designing and manufacturing a robotic dolphin with a variable stiffness mechanism. By mimicking the vertebrae of a dolphin, the variable stiffness driving part was manufactured using subtractive and additive manufacturing. A driving tendon was placed considering the location of the tendon in the actual dolphin, and the additional tendon was installed to change its stiffness. A robotic dolphin was designed and manufactured in a streamlined shape, and the swimming speed was measured by varying the stiffness. When the stiffness of the tail fin was varied at the same driving frequency, the swimming speed and thrust changed by approximately 1.24 and 1.5 times, respectively.

• Composites Research
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• v.15 no.6
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• pp.38-43
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• 2002

Rapid Prototyping(RP) technologies provide the ability to fabricate initial prototypes from various model materials. Stratasys' Fused Deposition Modeling(FDM) is a typical RP process that can fabricate prototypes out of plastic materials, and the parts made from FDM were often used as load-carrying elements. Because FDM deposits materials in about 300$\mu$m thin filament with designated orientation, parts made from FDM show anisotropic material properties. In this paper an analytic model was proposed to predict the tensile strength of FDM parts. Applying the Classical Lamination Theory, which was developed for laminated composite materials, a computer code was implemented. Tsai-Wu failure criterion was added to the code to predict the failure of the FDM parts. The tensile strengths predicted by the analytic model were compared with experimental data. The data and prediction agreed reasonably well to prove the validity of the model. In addition, a web-based advisory service(FDMAS) was developed to provide strength prediction and design rules for FDM parts.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.61-68
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• 2023

In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn₂ IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni₃Sn₄/FeSn₂/Ni₃Sn₄ was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni₃Sn₄/FeSn₂ interface and then propagated into FeSn₂. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200℃. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.10
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• pp.319-330
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• 2016

Recently, 3D printing technology has been applied to make a concept model and working mockup of an industrial application. On the other hand, this technology has limited applications in industrial products due to the materials and reliability of the 3D printed product. In this study, the components of a full cord switch module are proposed as a case of a 3D printed component that can be used as a substitute for a short period. These are hub-driven and lever lockup components that have the structural characteristics of breaking down frequently in the emergency operating status. To ensure the structural strength for a substitute period, research of structure optimization was performed because 3D printing technology has a limitation in the materials used. After optimizing the structure variables of the hub-driven component, reasonable results can be drawn in that the safety factors of the left and right switching mode are 1.243 (${\Delta}153.67%$) and 3.156 (${\Delta}404.96%$). The lever lockup component has a structural weak point that can break down easily on the lockup-part because of a cantilever shape and bending moment. The rib structure was applied to decrease the deflection. In addition, optimization of the structural variables was performed, showing a safety factor of 7.52(${\Delta}26%$).

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.8
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• pp.30-37
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• 2014

In this paper, the compact model for FinFET gate resistance is developed. Based on the FinFET geometry and material, the value of the gate resistance is extracted by Y-parameter analysis using 3D device simulator, Sentaurus. By dividing the gate resistance into horizontal and vertical components, the proposed gate resistance model captures the non-linear characteristics. The proposed compact model reflects the realistic gate structure which has two different materials (Tungsten, TiN) stacked. Using the proposed model, the number of fins for the minimum gate resistance can be proposed based on the variation of gate geometrical parameters. The proposed gate resistance model is implemented in BSIM-CMG. A ring-oscillator is designed, and its delay performance is compared with and without gate resistance.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.2 s.105
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• pp.178-183
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• 2006

The proposed triple-band compact chip antenna using coupled meander line and stacked meander structure for mobile RFID/PCS/WiBro. The proposed antenna is designed to operate at 900, 1,800, and 2,350 MHz, and is realized by parasitic coupled and stacked a meander line. Meander lines are using extend length of effective current path more than monopole and contribute miniaturization. The coupled meander line controls the excitations of the mobile RFID and PCS, stacked meander line controls the excitation of the WiBro. The fabricated antenna size is $10.98{\times}22.3{\times}0.98\;mm$. The resonance frequencies are 905 MHz, 1.77 GHz and 2.32 GHz. The impedance bandwidths are 24 MHz, 140 MHz and 92 MHz. The maximum gains of antenna are 0.34 dBi, 2.58 dBi and 0.4 dBi at resonance frequencies.

• Composites Research
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• v.31 no.5
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• pp.276-281
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• 2018

In this paper, elastic behavior of woven fabric composites with various fiber yarn structure were predicted through a theoretical calculation model. A representative volume elements (RVE) that can represent the mechanical properties of the woven composites were selected and crimp angle of the weave yarn was defined by several sinusoidal functions. The effective material properties of the woven composite such as young's modulus, shear modulus and poisson's ratio was predicted by classical laminate theory (CLT). The fiber volume fractions were calculated according to the shape and pattern (plain, twill weave) of the fiber yarn, and the elastic behavior of each woven composite was obtained through a theoretical calculation model. Also, to verify the theoretical predictions, woven composite specimens of plain and twill weave were fabricated by vacuum assisted resin transfer molding (VARTM) process and then mechanical test was conducted. As a results, a good correlation between theoretical and experimental results for the elastic behavior of woven composites could be achieved.

• 한국신재생에너지학회:학술대회논문집
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• 2011.11a
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• pp.88.1-88.1
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• 2011

SOFC는 사용되는 셀의 디자인에 따라 튜브형, 평판형으로 구분되어진다. 평판형의 경우에는 전해질 지지형(ESC), Anode 지지형(ASC) 및 금속 지지형(MSC)로 크게 나눌 수 있다. SOFC 스택은 이와 같은 셀과 밀봉재, 집전체, 분리판의 구성요소를 여러 장으로 적층하여 이루어진다. SOFC 발전시스템은 SOFC 스택과 EBOP, MBOP로 구성되는데, SOFC 발전시스템의 상용화를 위해 선행되어야 할 것은 스택의 안정적 출력 및 신뢰성 확보이다. 즉, 셀, 밀봉재, 분리판 및 집전체로 대변되는 구성요소들이 스택에 장착되었을 때 그 기능을 최대한 발휘하면서도 점진적 또는 급격한 품질저하가 발생되지 말아야 한다. 특히, 밀봉재의 경우 SOFC에 사용되는 연료와 공기의 혼합(Cross-over)을 방지하는 중요한 기능을 담당하고 있으며 여러 장 적층된 분리판의 전기적 단락을 방지해야 한다. 또한 SOFC의 특성상 $700^{\circ}C$ 이상의 고온에서 다른 구성요소와 화학적 반응이 없어야하고 열싸이클(Thermal cycle)을 견딜 수 있도록 충분한 기계적 강도가 보장되어야 하는 등 요구되는 품질기준이 엄격하다. SOFC의 밀봉재는 접합형(Brazing), 압착형(Compressive), 용융-고정형(Glass-ceramic)이 대표적으로 적용되고 있다. 이 중에서 Brazing 물질과 방법은 현재 활발히 연구가 수행 중에 있지만 범용적으로 사용되고 있지는 않은 상태이고 Compressive 밀봉재와 Glass-ceramic 밀봉재가 대면적 SOFC 스택에 사용되어 적용 가능성을 평가받고 있다. 본 연구에서는 SOFC 구성요소의 국산화를 추진하는 지경부과제의 결과물 중 (주)써모텍에서 개발한 Glass-ceramic 밀봉재(RC1) 단품에 대한 특성평가와 실제 단전지 평가를 통해 SOFC 스택 적용 가능성을 평가하였다. 밀봉재 단품에 대한 특성평가는 용융특성, 상분석, 열팽창계수 등의 물리적, 화학적 평가 외에 가스 누설 정도를 평가하는 기밀도 평가와 SOFC의 작동 온도인 $700^{\circ}C$와 상온 분위기를 주기적으로 인가하는 Thermal cycle 특성을 평가하였다. 셀을 한 장 사용하는 단전지(Unit cell) 평가는 RIST에서 자체 제작한 $100{\times}100mm^2$ 평판형 ASC 셀을 사용하여 수행하였으며, 밀봉재는 Dispensing 공정을 통해 구성되었다.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.71-74
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• 2013

In this study, the effects of wafer warpage on the misalignment during wafer stacking process were investigated. The wafer with $45{\mu}m$ bow height warpage was purposely fabricated by depositing Cu thin film on a silicon wafer and the bonding misalignment after bonding was observed to range from $6{\mu}m$ to $15{\mu}m$. This misalignment could be explained by a combination of $5{\mu}m$ radial expansion and $10{\mu}m$ linear slip. The wafer warpage seemed to be responsible for the slip-induced misalignment instead of radial expansion misalignment.