• The Journal of Korean Academy of Prosthodontics
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• v.55 no.4
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• pp.394-402
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• 2017

Purpose: The purpose of this study is to evaluate the displacement of artificial tooth of monolithic complete denture manufactured by milling and 3D printing method in which the denture base and the artificial teeth are simultaneously made. Materials and methods: Twelve upper and lower complete dentures for each were made by milling and 3D printing method. Group Up and Group Lp are a group of upper and lower dentures made by printing, and Group Um and Group Lm are denture groups made by milling. Group Uc and Group Lc are is a group of finally designed upper and lower dentures respectively. Measurements were performed between both central incisors (AB, ab), both canines (CD, cd), both first molars (EF, ef), between an incisor and a first molar (AE, ae), and between incisor and lingual point (AG, ag) for each upper and lower denture. Results: AG and ag value between printed dentures and original ones as well as between milled dentures and original ones showed a statistically significant difference (One-way ANOVA, P<.05) in both lower and upper monolithic dentures. In the lower monolithic ones, ab, cd and ef value revealed a significant difference between Group Lp and Group Lm (One-way ANOVA, P<.05). Conclusion: Dentures made using milling or 3D printers revealed statistically significant difference compared with those of original data. However, it showed clinically very accurate reproducibility.

• Applied Chemistry for Engineering
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• v.24 no.3
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• pp.219-226
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• 2013

Organic semiconductor-based soft electronics has potential advantages for next-generation electronics and displays, which request mobile convenience, flexibility, light-weight, large area, etc. Organic field-effect transistors (OFET) are core elements for soft electronic applications, such as e-paper, e-book, smart card, RFID tag, photovoltaics, portable computer, sensor, memory, etc. An optimal multi-layered structure of organic semiconductor, insulator, and electrodes is required to achieve high-performance OFET. Since most organic semiconductors are self-assembled structures with weak van der Waals forces during film formation, their crystalline structures and orientation are significantly affected by environmental conditions, specifically, substrate properties of surface energy and roughness, changing the corresponding OFET. Organo-compatible insulators and surface treatments can induce the crystal structure and orientation of solution- or vacuum-processable organic semiconductors preferential to the charge-carrier transport in OFET.

• Korean Journal of Soil Science and Fertilizer
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• v.33 no.6
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• pp.377-383
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• 2000

The composition of primary minerals of sand fractions and secondary minerals of clay fractions were investigated on the polder soils developed from alluvio-marine deposits near to Sapgyo-lake, constructed a sea dike across river estuary located in the west coast. The effects of a topographical sequence on the physico-chemical properties and mineralogical characteristics were evaluated using XRD, DTA, and TG with the chemical composition of $H^+$ saturated clays. Soils located on the seashore side were more silt fraction, higher pH and exchangeable cations than the others. The dominant minerals of soil parent materials are in the order of quartz, feldspars, micas, chlorite and amphibole. According to the greater distance from the lake, the amount of 1:1 minerals increased, but 2:1 minerals decreased. The dominant clay minerals of polder soils are kaolinite, vermiculite and illite. Hydroxy interlayer minerals are abundant in the clay fractions derived from the soil parent materials which have relatively low soil pH.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.156-157
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• 2012

단일 셀에서 비휘발성 및 고속의 휘발성 메모리를 모두 구동할 수 있는 다기능 메모리는 모바일 기기 및 embedded 장치의 폭발적인 성장에 있어 그 중요성이 커지고 있다. 따라서 최근 이러한 fusion기술을 응용한 unified RAM (URAM)과 같은 다기능 메모리의 연구가 주목 받고 있다. 이러한 다목적 메모리는 주로 silicon on insulator (SOI)기반의 1T-DRAM과 SONOS기술 기반의 비휘발성 메모리의 조합으로 이루어진다. 하지만 이런 다기능 메모리는 주로 단결정기반의 SOI wafer 위에서 구현되기 때문에 값이 비싸고 사용범위도 제한되어 있다. 따라서 이러한 다기능메모리를 다결정 실리콘을 이용하여 제작한다면 기판에 자유롭게 메모리 적용이 가능하고 추후 3차원 적층형 소자의 구현도 가능하기 때문에 다결정실리콘 기반의 메모리 구현은 필수적이라고 할 수 있겠다. 본 연구에서는 다결정실리콘을 이용한 channel recessed구조의 다기능메모리를 제작하였으며 각 1T-DRAM 및 NVM동작에 따른 memory 특성을 살펴보았다. 실험에 사용된 기판은 상부 비정질실리콘 100 nm, 매몰산화층 200 nm의 SOI구조의 기판을 이용하였으며 고상결정화 방법을 이용하여 $600^{\circ}C$ 24시간 열처리를 통해 결정화 시켰다. N+ poly Si을 이용하여 source/drain을 제작하였으며 RIE시스템을 이용하여 recessed channel을 형성하였다. 상부 ONO게이트 절연막은 rf sputter를 이용하여 각각 5/10/5 nm 증착하였다. $950^{\circ}C$ N2/O2 분위기에서 30초간 급속열처리를 진행하여 source/drain을 활성화 하였다. 계면상태 개선을 위해 $450^{\circ}C$ 2% H2/N2 분위기에서 30분간 열처리를 진행하였다. 제작된 Poly Si MFM에서 2.3V, 350mV/dec의 문턱전압과 subthreshold swing을 확인할 수 있었다. Nonvolatile memory mode는 FN tunneling, high-speed 1T-DRAM mode에서는 impact ionization을 이용하여 쓰기/소거 작업을 실시하였다. NVM 모드의 경우 약 2V의 memory window를 확보할 수 있었으며 $85^{\circ}C$에서의 retention 측정시에도 10년 후 약 0.9V의 memory window를 확보할 수 있었다. 1T-DRAM 모드의 경우에는 약 $30{\mu}s$의 retention과 $5{\mu}A$의 sensing margin을 확보할 수 있었다. 차후 engineered tunnel barrier기술이나 엑시머레이저를 이용한 결정화 방법을 적용한다면 device의 특성향상을 기대할 수 있을 것이다. 본 논문에서는 다결정실리콘을 이용한 다기능메모리를 제작 및 메모리 특성을 평가하였다. 제작된 소자의 단일 셀 내에서 NVM동작과 1T-DRAM동작이 모두 가능한 것을 확인할 수 있었다. 다결정실리콘의 특성상 단결정 SOI기반의 다기능 메모리에 비해 낮은 특성을 보여주었으나 이는 결정화방법, high-k절연막 적용 및 engineered tunnel barrier를 적용함으로써 해결 가능하다고 생각된다. 또한 sputter를 이용하여 저온증착된 O/N/O layer에서의 P/E특성을 확인함으로써 glass위에서의 MFM구현의 가능성도 확인할 수 있었으며, 차후 system on panel (SOP)적용도 가능할 것이라고 생각된다.

• Journal of the Korean Society of Food Science and Nutrition
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• v.13 no.1
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• pp.15-21
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• 1984

In order to ascertain the practical possibility of home made retort pouches for production of retort pouch foods in factory, two kinds of retortable pouches, i. e. 3 ply film (polyester film/Al. foil/casting polypropylene) and 4 ply film(polyester film/Al. foil/nylon/casting poll·propylene) were developed in Korea, and then, their physical properties, such as physical strength, heat resistance during thermal processing and preservability of foods and sanitary safety, were tested and compared with the foreign made pouches. The results obtained were summarized as follows. a. The physical strength of home made retort pouches in processing model foods(soybean oil 5 %, acetic acid 2%, starch 5 % and water to 100 %) was equal to that of foreign made pouches at accelerated examination condition($38^{\circ}C$, 98 % RH). But the lamination strength of home made products was a little bit superior to that of foreign made products. b. Home made retort pouches(SAMA-4 ply and SAMA-3 ply pouch) packed with rice or curry was possible to bear the thermal processing at $135^{\circ}C$ and shelf-life was one year or more at ambient temperature($20^{\circ}C$). c. Sanitary safety test showed that these home made retort pouches were acceptable comparing to the regulation recommended by the Ministry of Health and Social Affairs.

• Polymer(Korea)
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• v.33 no.1
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• pp.39-44
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• 2009

Polymer substrates were fabricated by using poly (phenylene ether) as a base resin, N,N'-m-phenylenedimaleimide (PDMI) as a crosslinking agent and decabromodiphenylethane as a flame retardant. The effects of crosslinking agent and flame retardant on physical properties such as dielectric property of the substrate were investigated. Thermal curing feature of PDMI with or without an initiator was analyzed by DSC, and then, PPE-PDMI test compositions were designed based on this result. Composite sheets were cast by film coater, laminated under vacuum and pressure, and then, the changes of dielectric constant, dielectric loss, peel strength, solder heat resistance and inflammability according to increasing amount of PDMI and flame retardant were evaluated, Dielectric constant and dielectric loss showed increasing trend with increasing amount of PDMI and flame retardant, but solder heat resistance and inflammability were improved. Peel strength was obtained higher than 1 kN/m when PDMI above 10 wt% was added, but slightly decreased as the amount of flame retardant increased. From the measured gel contents, the reaction mechanism of PPE-PDMI system was deduced to the formation of network structure by crosslinking PDMI with PPE rather than the formation of semi-IPN structure. In conclusion, the polymer composite substrate materials with dielectric constant of 2.52$\sim$2.65 and dielectric loss below 0.002 at 1 GHz were obtained and they will be proper for high frequency applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.10
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• pp.319-330
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• 2016

Recently, 3D printing technology has been applied to make a concept model and working mockup of an industrial application. On the other hand, this technology has limited applications in industrial products due to the materials and reliability of the 3D printed product. In this study, the components of a full cord switch module are proposed as a case of a 3D printed component that can be used as a substitute for a short period. These are hub-driven and lever lockup components that have the structural characteristics of breaking down frequently in the emergency operating status. To ensure the structural strength for a substitute period, research of structure optimization was performed because 3D printing technology has a limitation in the materials used. After optimizing the structure variables of the hub-driven component, reasonable results can be drawn in that the safety factors of the left and right switching mode are 1.243 (${\Delta}153.67%$) and 3.156 (${\Delta}404.96%$). The lever lockup component has a structural weak point that can break down easily on the lockup-part because of a cantilever shape and bending moment. The rib structure was applied to decrease the deflection. In addition, optimization of the structural variables was performed, showing a safety factor of 7.52(${\Delta}26%$).

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.25-29
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• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.

• Korean Journal of Heritage: History & Science
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• v.57 no.3
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• pp.56-67
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• 2024

This study aims to characterize the material of the finishing materials used in the No.1 stone chamber tomb of the Baekje-era tumuli in Songjeri, Naju with mineralogical, chemical, and physical analyses. The finishing material is a mixture of white lumps and fragments, presumed to be shells, that remain on the surface and between the gaps of the stone walls inside the tomb. The analysis results revealed that the main constituent mineral of the finishing material is calcite. Infrared spectroscopy showed peaks due to calcium carbonate, and thermal reaction decarbonation in the 700~800℃ range, high calcium content, and loss on ignition were confirmed. Therefore, the main material of the finishing materials was determined to be lime, and since no aggregates such as sand or gravel were found, it was identified as lime paste. The shell fragments mixed into the lime paste appear dark blue or grayish-white in color, with no original shape remaining. The surface has a layered structure, and microscopic observations revealed prismatic layers with a columnar structure and nacreous layers with a consistent orientation, suggesting that the shells are from bivalve mollusks. Additionally, X-ray imaging of the shell fragments showed holes and tunnels caused by boring marine organisms both on the surface and inside, and radiocarbon dating results confirmed that the dating of the shells was consistent with the construction period of the tomb. It is concluded that the finishing material used in Tomb No. 1 in Songje-ri, Naju, was lime paste mixed with shell fragments, and the lime was made using the shells of bivalve mollusks as the raw material.

• Journal of the Korean Magnetics Society
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• v.12 no.5
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• pp.184-188
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• 2002

The Cu/Ni/Cu(002)/Si(100) films which have perpendicular magnetic anisotropy were deposited by e-beam evaporation methods. From the reflection high energy electron diffraction pattern, the films were confirmed to be grown epitaxially on silicon. After 2X lots ions/$\textrm{cm}^2$ C+ irradiation, magnetic easy-axis was changed from surface normal to in-plane as shown in the hysteresis loop of magneto-optical Kerr effects. It became manifest from analysis of X-ray reflectivity and grazing incident X-ray diffraction that even though interface between top Cu layer and Ni layer became rougher, the contrast of Cu and Ni's electron density became manifest after ion irradiation. In addition, the strain after deposition of the films was relaxed after ion irradiation. Strain relaxation related with change of magnetic properties and mechanism of intermixed layer's formation was explained by thermo-chemical driving force due to elastic and inelastic collision of ions.