• Journal of Bio-Environment Control
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• v.1 no.2
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• pp.187-191
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• 1992

온도의 계측에는 열팽창(Thermal expansion), 열전기(thermoelectricity), 전기저항(resistance)등의 원리를 이용하고 있다. (1) 열팽창식 온도계 물체의 열팽창 원리를 이용하는 온도계에는 두 금속의 열팽창 계수의 차이를 이용하는 바이멜탈 온도계, 액체의 팽창을 이용하는 유리 온도계, 기체 압력이 온도에 비례하는 것을 이용하는 압력식 온도계 등이 있으나, 이중에서 유리 온도계가 가장 널리 사용되고 있다.(중략)

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.184-184
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• 2013

본 연구에서는 금 합금 도금층의 접촉저항에 미치는 첨가 합금원소의 영향을 조사하였다. 또한 표면실장을 위한 솔더링 공정에서 도금층에 가해지는 열이력이 접촉저항 값에 미치는 영향을 조사하기 위해서, $260^{\circ}C$에서 thermal aging을 실시한 후, 접촉저항을 측정하였다. 합금원소의 종류에 따라서 thermal aging후의 접촉저항 값이 변하는 요인을 조사하기 위해서 XPS를 이용하여 표면분석을 실시하였다.

• Journal of the Korean Geotechnical Society
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• v.27 no.7
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• pp.17-33
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• 2011

Recently, the utilization of recycled aggregates for backfilling a power transmission pipeline trench has been considered due to the issues of eco-friendly construction and a lack of natural aggregate resource. It is important to identify the physical and thermal properties of domestic recycled aggregates that can be used as a backfill material. This paper evaluated thermal properties of concrete-based recycled aggregates with various particle size distributions. The thermal properties of the recycled aggregates and river sand provided by local vendors were measured using the transient hot wire method and the transient needle probe method after performing the standard compaction test. The needle probe method considerably overestimated the thermal resistivity of recycled aggregates especially at the dry of optimum water content because of experiencing disturbance while the needle probe is being inserted into the specimen. Similar to silica sand, the thermal resistivity of recycled aggregates decreased when the water content increased at a given dry density. Also, this paper evaluated some of the existing prediction models for the thermal resistivity of recycled aggregates with the experimental data, and developed a new prediction model for recycled aggregates. This study shows that recycled aggregates can be a promising backfill material substituting for natural aggregates when backfilling the power transmission pipeline trench.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.32 no.2
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• pp.103-108
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• 2019

Non-equilibrium molecular dynamics simulation on the thermal boundary resistance(TBR) of an aluminum(Al)/silicon(Si) interface was performed in the present study. The constant heat flux across the Si/Al interface was simulated by adding the kinetic energy in hot Si region and removing the same amount of the energy from the cold Al region. The TBR estimated from the sharp temperature drop at the interface was independent of heat flux and equal to $5.13{\pm}0.17K{\cdot}m^2/GW$ at 300K. The simulation result was experimentally confirmed by the time-domain thermoreflectance technique. A 90nm thick Al film was deposited on a Si(100) wafer using an e-beam evaporator and the TBR on the film/substrate interface was measured using the time-domain thermoreflectance technique based on a femtosecond laser system. A numerical solution of the transient heat conduction equation was obtained using the finite difference method to estimate the TBR value. Experimental results were compared to the prediction and discussions on the nanoscale thermal transport phenomena were made.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.171-176
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• 2000

The physical and electrical characteristics of MgO and Pt thin-films on it, deposited by reactive sputtering and rf magnetron sputtering, respectively, were analyzed with annealing temperature and time by four-point probe, SEM and XRD. Under annealing conditions of $1000^{\circ}C$ and 2 hr, MgO thin-film had the properties of improving Pt adhesion to $SiO_2$ and insulation without chemical reaction to Pt thin-film, and the sheet resistivity and the resistivity of Pt thin-film deposited on it were $0.1288\;{\Omega}/{\square}$ and $12.88\;{\mu}{\Omega}{\cdot}cm$, respectively. We made Pt resistance pattern on $SiO_2$/Si substrate by lift-off method and fabricated thin-film type Pt-RTD(resistance thermometer device) for micro thermal sensors by Pt-wire, Pt-paste and SOG(spin-on-glass). In the temperature range of $25{\sim}400^{\circ}C$, the TCR value of fabricated Pt-RTD with thickness of $1.0{\mu}m$ was $3927\;ppm/^{\circ}C$ close to the Pt bulk value. Resistance values were varied linearly within the range of measurement temperature.

• Journal of Korean Tunnelling and Underground Space Association
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• v.15 no.3
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• pp.301-310
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• 2013

Jet fans are installed in road tunnels in order to maintain critical velocity when fire occurs. Generally the number of jet fans against fire are calculated by considering critical velocity and flow resistance by wall friction, vehicle drag force, thermal buoyance force and natural wind. In domestic case, thermal buoyance force is not considered in estimating the number of jet fans. So, in this study, we investigated the pressure loss due to the thermal buoyance force induced by tunnel air temperature rise and the impact of thermal buoyance force on the number of jet fans by the numerical fire simulation for the tunnel length(500, 750, 1000, 1500, 2000, 3500m) and grade (-1.0, -1.5, -2.0%). Considering the thermal buoyance force, number of jet fans have to be increased. Especially in the case of 100MW of heat release rate, the pressure loss due to thermal buoyance force exceed the maximum pressure loss due to vehicle drag resistance, so it is analyzed that number of 2~11 jet fans are needed additionally than current design criteria. Thus, in case of estimating the number of jet fans, it must be considered of thermal buoyance force induced tunnel air temperature rise by fire.

• Journal of the Korean Society of Propulsion Engineers
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• v.8 no.4
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• pp.16-25
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• 2004

Theoretical analysis for predicting the heat transport limitation of a copper powder sintered wick heat pipe was performed. The heat pipe diameter was 8mm and water was used for working fluid. The particle diameter was classified by 5 different meshes, and each capillary pressures and heat transport limitations. thermal resistances were analyzed according to the operating temperatures, wick thicknesses and inclination angles, based on the effective capillary radius($r_c$), porosity($\varepsilon$), Permeability (K). The wick capillary limitation was increased according as the particle diameter and the wick thickness and the operating temperature were increased. As the porosity and the capillary radius were larger. then the heat transport limitation was higher. The thermal resistance was greatly increased according as the wick thickness was increased.

• Korean Journal of Optics and Photonics
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• v.25 no.4
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• pp.221-224
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• 2014

We present a method for manufacturing a TIM used for packaging a high-power LED. In this method a mixture of diamond powder and hydrogen peroxide is used as a filler epoxy. The thermal resistance of the TIM with hydrogen peroxide was improved by about 30% over the thermal resistance of the TIM without hydrogen peroxide. We demonstrate that as a result the heat generated from the chip is easily dissipated through the TIM.

• Proceedings of the KAIS Fall Conference
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• 2012.05b
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• pp.690-692
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• 2012

전도도가 우수한 알루미늄 및 알루미나 소재를 사용하여 LED 패키지를 제작하였다. 선택적 양극산화 공정을 적용하여 알루미늄 기판 상에 알루미나를 형성하고 이를 유전체로 사용하였다. 패키지 기판에 따른 열저항 및 광량 분석을 위해 알루미늄 기판과 알루미나 기판을 제작하여 성능 비교분석을 진행하였다. 알루미늄 기판이 알루미나 기판보다 우수한 열저항 및 발광효율 특성을 보여주었으며, 이러한 결과는 선택적 양극산화 공정을 사용한 알루미늄 기판이 고출력 LED 패키지용 기판으로 활용할 수 있음을 보여준다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.106-106
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• 2013

C/C Composite는 비교적 낮은 온도에서 산화되어 고유의 특성을 쉽게 잃어버리게 된다. 본 연구에서는 Plasma Spray 코팅방법을 사용하여 다층 코팅층을 형성 시킨 후 $1600^{\circ}C$의 온도에서 열충격 저항성을 평가하였다.