• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• 제36권8호
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• pp.26-34
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• 2007

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.176-176
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• 2012

본 연구는 GaN 기반의 전자소자의 표면 패시베이션 방법으로 열산화 공정을 이용한 알루미늄산화막 패시베이션 공정에 대하여 연구하였다. 결정질의 알루미늄산화물은 경도가 크고 화학적으로 안정적이기 때문에 외부 오염에 대한 소자 표면을 효과적으로 보호할 수 있으며, 열적안정성이 뛰어나 공정중 또는 공정 후의 고온 환경에서의 열 손상이 적은 장점을 가진다. 결정질 알루미늄산화막($Al_2O_3$)을 소자 표면에 형성하기 위해서 일반적으로 TMA (trimethlyaluminium)와 오존($O_3$)가스를 이용한 ALD 공정법이 사용되고 있으나 공정 비용이 비싸고 열산화막에 비해 전자 trapping이 많이 발생하여 전자이동도가 저하되는 단점이 있어, 본 연구에서는 열산화 공정을 이용하여 소자의 전기적 특성 저하를 발생시키지 않는 알루미늄산화막 패시베이션을 수행하였다. 실험에 사용된 기판은 AlGaN/GaN 이종접합 구조가 증착된 HEMT 제작용 기판을 사용하였으며 TLM 구조를 제작하여 소자의 채널 면저항 및 절연영역간 누설전류 특성을 확인하였다. TLM 구조가 제작된 샘플 위에 알루미늄을 100 ${\AA}$ 두께로 소자위에 증착하고 $O_2$ 분위기에서 약 $525{\sim}675^{\circ}C$ 온도로 3분간 열처리하여 알루미늄 산화막을 형성한 후 $950^{\circ}C$ 온도로 $N_2$ 분위기에서 30초간 안정화열처리 하여 안정한 알루미늄 산화막 패시베이션을 형성하였다. 알루미늄산화막 패시베이션 후 소자의 절연영역 사이의 누설전류는 패시베이션 전과 비슷한 크기를 나타냈고 패시베이션 후 채널의 면저항이 패시베이션 전에 비해 약 20% 감소한 것을 확인하였다. 또한 패시베이션된 소자와 패시베이션되지않은 소자에 대해 $900^{\circ}C$ 온도로 30초간 열처리한 결과 패시베이션 되지 않은 소자는 74%만큼 채널 면저항이 증가하였으며, 절연영역 누설전류가 다섯오더 크기로 증가한 반면 알루미늄산화막 패시베이션한 소자는 단지 13%의 채널 면저항의 증가를 나타내었고 절연영역 누설전류는 100배 감소한 값을 보여 알루미늄산화막 패시베이션이 소자의 열적 안정성을 향상시키는 것을 확인하였다.

• Journal of the Korean Geotechnical Society
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• 제29권10호
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• pp.49-56
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• 2013

The use of geothermal energy has been increased for economic and environmental friendly utilization. Ground thermal conductivity and borehole thermal resistance are very important parameters in the design of geothermal heat pump system. This paper presents an experimental study of heat exchange rate of U and W type ground heat exchangers (GHEs) measured by thermal performance tests (TPTs). U and W type GHEs were installed in a partially saturated dredged soil deposit, and TPTs were conducted to evaluate heat exchange rates under 100-hr continuous operation condition. The heat exchange rates were also calculated by analytical models to estimate borehole thermal resistances and were compared with experimental results. It comes out that multi-pole and equivalent diameter (EQD) models resulted in more accurate agreement than shape factor (SF) model which is currently more often used.

• Journal of Advanced Marine Engineering and Technology
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• 제35권8호
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• pp.1016-1021
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• 2011

The enhancement for cooling performance of heat sink is surely necessary to guarantee the performance of electronic products. So in this paper, the cooling performances of the aluminum heat sink with pulsating heat pipe(PHP) were investigated experimentally and numerically. The pulsating heat pipe was used as a heat spreader. Working fluid of PHP was R-22. Heat inputs were 30W, 60W, 80W and 100W, respectively. Heat sink was tested for forced convection conditions with air velocity of 1 ~ 4m/s. And CFD simulations were conducted for two different heat sinks. The results showed that the cooling performance of heat sink with pulsating heat pipe was higher than that of conventional heat sink. Therefore, the pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• Journal of the Microelectronics and Packaging Society
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• 제13권2호
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Journal of the Microelectronics and Packaging Society
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• 제17권3호
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of the Korean Geophysical Society
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• 제2권3호
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• pp.225-233
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• 1999

Electrical resistivity of a rock-sample is dependant on not only formation factor of rock itself but also many parameters such as fluid type, measuring device, temperature, water saturation, electrical contact between electrode and core section, induced polarization, and frequency of electric source. In this study, we attempt to verify various affecting factors in core resistivity measurements and to find a better environment for core resistivity measurement. Particularly great attention has been paid to understanding the effects of temperature, water saturation, contact condition between sample and electrodes, and frequency of electric source. Precise measurement of resistivity can be achieved by utilizing silver paste for better contacts, taping samples for constant moisture contents, and using time-series resistivity data.

• Proceedings of the Korean Nuclear Society Conference
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• 한국원자력학회 1997년도 춘계학술발표회논문집(1)
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• pp.350-355
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• 1997

PWR 사용후핵연료 집합체를 운반하기 위한 대형용기는 다층구조로 구성되며, 충과 층사이의 접합부에서의 열전달이 발생한다. 이러한 열전달은 고체간의 열전달과 접합부에서의 공극안 기체를 통한 열전달로 구분되며, 후자에 의한 영향을 크게 받는다. 따라서, 2개의 chamber로 구성된 고온열시험장치에 대형용기의 section모델을 넣고 각각의 chamber에 다른 열용량을 유입한 시험을 수행하고 동일조건하의 열해석을 수행하여 열저항계수를 산출하였다.

• Proceedings of the KAIS Fall Conference
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• 한국산학기술학회 2003년도 춘계학술발표논문집
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• pp.119-121
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• 2003

마이크로 가스센서를 개발하기 위하여 가장 핵심적인 부품인 마이크로 핫플레이트에 대한 열전달을 해석하였다. 상용 열유동 해석 전용 프로그램인 FUENT를 이용하여 발열부와 주위의 실리콘 기판의 온도분포를 구하였다. 발열부에서는 전기저항에 의해서 일정한 양의 열이 균일하게 발생한다고 가정하고 그 열이 실리콘 기판의 끝을 통하여 빠져나간다고 가정하여 정상상태의 온도분포를 구하였다. 해석한 온도분포를 이용하여 균일한 온도분포를 얻을 수 있도록 발열선의 배치를 변화시켜가며 마이크로 핫플레이트의 설계를 완성하였다.

• Journal of Advanced Marine Engineering and Technology
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• 제39권6호
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• pp.586-591
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• 2015

This study discusses numerically-explored thermal performances of hybrid fin heat sinks (HF HSs) for lightweight thermal management of LED modules under natural convection. A hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS) are proposed as HF HSs. A 3-D CFD analysis has been carefully conducted to obtain reliable numerical results. The 3-D CFD study investigates the effects of both fin spacing and an internal channel diameter on performances of the HHF HS and the SHF HS. The study results show that the mass-based thermal resistance of the HHF HS is 20~32% smaller compared with the pin fin heat sink (PF HS). The results also show that the mass-based thermal resistance of the HHF HS decreases with the increase of the channel diameter. These results are mainly due to coupled effects of the mass reduction and heat pumping through an internal channel. Considerably superior mass-based thermal performances of the HHF HS to the conventional PF HS suggest the feasible application for the lightweight thermal management of the LED modules under natural convection.