• Ceramist
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• v.8 no.3
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• pp.44-47
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• 2005

• Ceramist
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• v.8 no.3
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• pp.20-24
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• 2005

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.4
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• pp.619-625
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• 1998

The effect of softening point and glass amount of glass frit on the sintering behavior of low temperature cofirable glass/ceramic composites was studied and according to these results, glass/ceramic composites with high sintered density was fabricated. The density of composites was increased as the glass amount was increased. In case of using the glass with low softening point, the deformation of specimen was occurred though the ratio of the glass amount in the specimen was low. But, in case of using the glass with high softening point, the sintered density of composites was increased in accordance with glass amount. With the specimen of high softening point, the deformation was not happened. Therefore, it was found that the densification was progressed continuously in high glass amount. From the study on the effect of softening point of glass on sintering behavior, the suitable softening point and glass amount for fabrication of glass/ceramic composites can be anticipated. When glass frit with softening point of $790^{\circ}C$ was chosen according to this result, low temperature cofirable glass/ceramic composites with high density (97%) at $900^{\circ}C$ was fabricated.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.25-35
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• 1999

LTCC (Low Temperature Cofired Ceramic) or LTCC-M (Low Temperature Cofired ceramic on Metal) technology is one of MCM-C (Multichip Module on Ceramic) technologies and becomes to be widely used in consumer, RF and automotive electronics. As green sheets for LTCC are cofired below $1000^{\circ}C$ in comparison with those for HTCC (High Temperature Cofired Ceramic), high conductivity metal traces such as gold, silver and copper can be used. The dimensional stability in LTCC-M technology enables embedded passives to be integrated inside modules, which enhances the electrical performance and increases the reliability of the modules. Coefficient of thermal expansion and dielectric constant can be controlled by changing composition and heating profile for cofiring. In this technical review, LTCC and LTCC-M technologies are introduced and advantages of those technologies are explained.

• Journal of the Korean Ceramic Society
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• v.12 no.2
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• pp.3-9
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• 1975

The continuous grading method of pyrophyllite particles was adopted to prepare the refractories for ladle. The optimum conditions of fabrication adjusting the binders, the amount of water, the forming pressure and the firing temperature were investigated. The various properties, such as strength, density, porosity, thermal shock, corrosion resistance to slag were measured and compared with properties of ladle bricks presently used at local steel plants. The specimen studied in the present investigation showed a rather superior properties to theconventional product available locally.

• Ceramist
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• v.6 no.1
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• pp.21-25
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• 2003

• Korean Journal of Materials Research
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• v.6 no.12
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• pp.1179-1185
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• 1996

고온용 세라믹 쉘 몰드를 용융 알루미나와 콜로이달 실리카를 사용하여 제조한 후, 세라믹 쉘 몰드의 강도에 영향을 주는 요인을 분석하였다. 세라믹 쉘 몰드의 강도는 바인더의 실리카 입자의 크기가 작을수록 크며 또한 실리카 농도에 비례하여 증가함을 보이며 저온에서의 강도 발현은 콜로이달 실리카의 필름 형성에 의한 입자들의 결합임을 알 수 있었다. 세라믹 쉘 몰드의 소성 강도는 부착 스타코의 크기가 작을수록 크며 소성 온도에 비례하여 증가함을 보였다. 고온에서의 강도 발현은 알루미나 입자와 콜로이달 실리카 바인더의 결합뿐만 아니라 알루미나 입자사이의 결합도 영향을 줌을 알 수 있었다. 쉘 몰드의 결정상은 130$0^{\circ}C$이하에서 소성한 경우 $\alpha$-알루미나만 존재함을 보여 실리카는 비정질로 계속 남아 있음을 알 수 있고 140$0^{\circ}C$ 이상에서 소성한 경우 뮬라이트가 생성됨을 보였다.

• Proceedings of the Korean Ceranic Society Conference
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• 2000.10a
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• pp.75.2-75
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• 2000

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.226.1-226
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• 2003

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.301-301
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• 2008

최근의 세라믹 공정기술은 고집적화 추세에 따라 그린시트의 두께가 얇아지면서 다층화되고 있으므로 fine patterning, Via Hole 크기의 최소화, Via Hole 간의 층간 연결을 위한 그린시트 층간 정밀도가 더욱 중요해지고 있다. 따라서 세라믹의 소성후 수축율 제어는 고집적 세라믹 기판 모듈 제작을 위한 핵심공정기술로 기술 개발에 대한 필요성이 증대되고 있다. 온 연구에서는 일축가압 이용한 PAS법 (Pressure Assisted Constrained Sintering)과 Al2O3를 희생층으로 이용한 Constrained법을 혼합하여 저온 동시소성 세라믹 기판의 x-y축 방향의 수축율을 zero로 제어하고자하였다. Al2O3/LTCC/Al2O3인 샌드위치 구조로 세라믹 시트를 적층하여 Load에 따른 소성수축율 및 LTCC 두께에 따른 Edge Curvature의 Radius를 측정하였다. 그 결과 소성온도 $900^{\circ}C$에서 Constrian Layer $500{\mu}m$, Load 0.92kg/cm3일때 LTCC의 두께가 $400{\mu}m$에서 $2500{\mu}m$로 증가함에 따라 Edge Curvature Radius가 $430{\mu}m$에서 $2200{\mu}m$로 증가하는 것을 확인하였다. 이때 소결 밀도는 2.95g/$cm^3$로 우수한 특성을 나타내었다.