• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.35 no.4
• /
• pp.401-407
• /
• 2011

The conventional method of magnetic abrasive polishing is not suitable for non-magnetic materials because such polishing is basically possible when magnetic force exists and the magnetic force in non-magnetic materials is very low. The installation of an electromagnet under the working area of a non-magnetic material, which is called second-generation magnetic abrasive polishing in this study, can enhance the magnetic force. Experimental evaluation and optimization of process parameters for polishing magnesium alloy steel was performed by adopting the design of experiments and the response surface method. The results indicated that the intensity of the magnetic force and spindle speed are significant parameters that affect the improvement of surface roughness. A prediction model for the surface roughness of the magnesium alloy steel is developed using the second-order response surface method.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.36 no.3
• /
• pp.259-264
• /
• 2012

Automatic magnetic abrasive polishing (MAP), which can be applied after machining of a mold on a machine tool without unloading, is very effective for finishing a free-form surface such as a complicated injection mold. This study aimed to improve the efficiency of MAP of a non-ferrous mold surface. The magnetic array table and control of the electromagnet polarity were applied in the MAP of a free-form surface. In this study, first, the magnetic flux density on the mold surface was simulated to determine the optimal conditions for the polarity array. Then, the MAP efficiency for polishing a non-ferrous mold surface was estimated in terms of the change in the radius of curvature and the magnetic flux density. The most improved surface roughness was observed not only in the upward tool path but also in the working area of larger magnetic flux density.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.35 no.12
• /
• pp.1641-1646
• /
• 2011

The second-generation magnetic abrasive polishing is one of the nontraditional machining technologies newly developed. Because of the flexibility effect in magnetic abrasive polishing, the precise and mirror like surface can be obtained during this process. In this study, magnetic abrasive polishing process was applied in small grooved surface. As a result, it was seen that the flexible magnetic abrasive tool was effective to remove burrs on the edge of the groove. However, the efficiency of magnetic abrasive polishing at the slot was very low according to increasing depth and width of slot. So, correlation between geometric parameters, such as the depth and width, and surface roughness was evaluated and the minimum width for suitable polishing was found by experimental results.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.05a
• /
• pp.33.2-33.2
• /
• 2011

CMP (Chemical-Mechanical Planarization) 공정이란 화학적 반응과 기계적 힘을 동시에 이용하여 표면을 평탄화하는 공정으로, 반도체 산업에서 회로의 고집적화와 다층구조를 형성하기 위해 CMP 공정이 도입되었으며 반도체 패턴의 미세화와 다층화에 따라 CMP 공정의 중요성은 더욱 강조되고 있다. CMP 공정은 압력, 속도 등의 공정조건과, 화학적 반응을 유도하는 슬러리, 기계적 힘을 위한 패드 등에 의해 복합적으로 영향을 받는다. CMP 공정에서, 폴리우레탄 패드는 많은 기공들을 포함한 그루브(groove)를 형성하고 있어 웨이퍼와 직접적으로 접촉을 하며 공정 중 유입된 슬러리가 효과적으로 연마를 할 수 있도록 도와주는 역할을 한다. 하지만, 공정이 진행 될수록 그루브는 손상이 되어 제 역할을 하지 못하게 된다. 패드 컨디셔닝이란 컨디셔너가 CMP 공정 중에 지속적으로 패드 표면을 연마하여 패드의 손상된 부분을 제거하고 새로운 표면을 노출시켜 패드의 상태를 일정하게 유지시키는 것을 말한다. 한편, 금속박막의 CMP 공정에 사용되는 슬러리는 금속박막과 산화반응을 하기 위하여 산화제를 포함하는데, 산화제는 금속 컨디셔너 표면을 산화시켜 부식을 야기한다. 컨디셔너의 표면부식은 반도체 수율에 직접적인 영향을 줄 수 있는 scratch 등을 발생시킬 뿐만 아니라, 컨디셔너의 수명도 저하시키게 되므로 이를 방지하기 위한 노력이 매우 중요하다. 본 연구에서는 컨디셔너 표면에 연마 잔여물 흡착을 억제하고, 슬러리와 컨디셔너 표면 간에 일어나는 표면부식을 방지하기 위하여 소수성 자기조립 단분자막(SAM: Self-assembled monolayer)을 증착하여 특성을 평가하였다. SAM은 2가지 전구체(FOTS, Dodecanethiol를 사용하여 Vapor SAM 방법으로 증착하였고, 접촉각 측정을 통하여 단분자막의 증착 여부를 평가하였다. 또한 표면부식 특성은 Potentiodynamic polarization와 Electrochemical Impedance Spectroscopy (EIS) 등의 전기화학 분석법을 사용하여 평가되었다. SAM 표면은 정접촉각 측정기(Phoenix 300, SEO)를 사용하여 $90^{\circ}$ 이상의 소수성 접촉각으로써 증착여부를 확인하였다. 또한, 표면에너지 감소로 인하여 슬러리 내의 연마입자 및 연마잔여물 흡착이 감소하는 것을 확인 하였다. Potentiodynamic polarization과 EIS의 결과 분석으로부터 SAM이 증착된 표면의 부식전위와 부식전류밀도가 감소하며, 임피던스 값이 증가하는 것을 확인하였다. 본 연구에서는 컨디셔너 표면에 SAM을 증착 하였고, CMP 공정 중 발생하는 오염물의 흡착을 감소시킴으로써 CMP 연마 효율을 증가하는 동시에 컨디셔너 금속표면의 부식을 방지함으로써 내구성이 증가될 수 있음을 확인 하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.565-568
• /
• 2003

In this paper we deal with behavior of the magnetic abrasive using Ba-Ferrite on polishing characteristics in a new internal finishing of STS304 pipe applying magnetic abrasive polishing. The magnetic abrasive using Ba-Ferrite grain WA was used to resin bond fabricated at low temperature. And Ba-Ferrite of magnetic abrasive powder was crused into 200 mesh. The previous research made an experiment in the static and the dynamic state on the movement of magnetic abrasive grain. In this paper. We investigated into the changes of the movement of magnetic abrasive grain. In reference to this result. we have made the experiment which is set under the condition of the magnetic flux density. polishing velocity according to the form of magnetic brush.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.11a
• /
• pp.141-142
• /
• 2010

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.10 s.175
• /
• pp.39-48
• /
• 2005

As the industrial development is accelerated, a new machining process and system are keenly required to achieve super precision surface finish. Especially to get ground surface finish fer complicated and narrow inner shape of molds, it is impossible with the existing methods so that a new method is being required to be developed. A new material, called Magic(MAGnetic Intelligent Compounds), is finally made and it is called Magic machining that uses this material. There is a way to make a material as follows, the mixture of magnetic particles, bonding material and particles of abrasive grain should be melt down by proper heat, and then this mixture put in a mold and cool down in magnetic field which has a uniform direction. This new polishing method is spotlighted as an excellent solution to the existing problems. However it hasn't reported any study about the influence of the machining conditions of polishing velocity, amplitude and polishing pressure to the surface roughness yet. This study would examine closely the influence of polishing conditions of the Magic polishing tool to the surface finish to decide the optimum polishing condition and to standardize the Magic polishing work.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.1
• /
• pp.61-66
• /
• 2012

Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.

• Journal of dental hygiene science
• /
• v.18 no.6
• /
• pp.357-366
• /
• 2018

The purpose of this study was to evaluate the validity of dental hygienist job according to judgment standard of medical practice in medical law. In this study, we conducted a self-administered questionnaire survey to evaluate the validity of dental hygienist job for 12 professors of dental college in Gangneung-Wonju National University from November 10 to 20, 2017. We investigated whether the dental hygienist job conforms to the three criteria of medical practice such as disease prevention and treatment, patient care, and health hazard. The response rates were scored and classified into four categories according to the final score. As a result of this study, dental hygienist job are classified into four categories according to judgment standard of medical practice. The higher the level of the category, the higher the degree of difficulty, and the higher the level of expertise and skills required. More than 50% of respondents answered that measuring the gingival pocket, bleeding on probing, professional tooth cleaning, oral health education, counseling after dental treatment are all three criteria for medical treatment. And these were classified into Level 4 group which requires the difficulty and expertise in the final score 4.3. It is necessary to develop and utilize standardized guidelines on the level of knowledge, education, and qualification standards required for dental practice in order to effectively allocate work among the dental personnel while ensuring the health rights of patients in the dental clinic field in Korea. In addition, there is a need to evaluate the various aspects of cost effectiveness, dental health service productivity, and health promotion contribution to dental hygienist jobs, And based on this evidence, it is necessary to continue to expand and adjust the dental hygienist job and to reorganize the dental workforce system.