• Title/Summary/Keyword: 인쇄 전자 소자

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Comparison of sensitivity of gas sensors using sensing materials with mono and binary catalyst system (단원계 및 이원계 촉매 시스템의 감지 물질을 이용한 가스 센서의 감지 특성 비교)

  • Hong, Sung-Jei;Han, Jeong-In
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.67-70
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    • 2003
  • 단원계 및 이원계 촉매를 이용하여 나노 감지 소자를 합성하였고, 이를 이용하여 가연성 후막 가스 센서를 제작, 촉매 시스템에 따른 가스 감지 특성을 비교하였다. 단원계의 경우 Pd 및 Pt를 각각 3wt%로, 이원계의 경우 Pd:Pt 농도를 1:2~2:1wt%로 각각 제어하여 평균 입도가 15 nm 인 $SnO_2$ 나노 분말에 도핑, 감지물질을 합성하였다. 그 후 감지물질을 paste로 만들어 인쇄, 가스센서 제작 후 $450{\sim}600^{\circ}C$의 온도로 열처리하였다. 그 결과 이원계 촉매 시스템을 가진 가스 센서는 시효 시간에 따라 감도 값이 변하는 불안정한 현상을 나타내었다, 그러나 단원계 촉매의 경우 시효 시간이 지나도 감도 값이 안정된 현상을 나타내었다. 특히 3wt% pt를 도핑하여 $500^{\circ}C$에서 열처리한 경우 5시간 시효 후에도 감도 값의 변화 폭이 3.5% 이하의 매우 안정된 특성을 나타내었고 반응 시간도 20초 이하로 매우 빠른 응답 특성을 나타내었다.

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Thick Film Resistance Paste for Improving Reliability and TCR Properties of Embedded Resistor Board (내장형 저항 기판의 신뢰성과 TCR 개선을 위한 후막 저항 페이스트에 관한 연구)

  • Lee, S.M.;Yoo, M.J.;Park, S.D.;Kang, N.K.;Nam, S.
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.27-31
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    • 2008
  • Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

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The Study of Hole Injection Characteristics in Solution-Processed Copper (I) Thiocyanate (CuSCN) Film (용액 공정 처리된 구리(I) 티오시아네이트(CuSCN) 필름의 정공 주입 특성 연구)

  • Eun-Jeong Jang;Baeksang Sung;Sungmin Kwon;Yoonseuk Choi;Jonghee Lee;Jae-Hyun Lee
    • Applied Chemistry for Engineering
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    • v.35 no.1
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    • pp.61-65
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    • 2024
  • The effectiveness of CuSCN as a hole injection layer in large-area organic light-emitting diodes, organic solar cells, and thin-film transistors has been well demonstrated. Therefore, in this study, the surface, optical, and electrical analyses of CuSCN were carried out according to the solution process conditions in order to propose optimized film conditions. Various CuSCN solution concentrations were prepared to determine the film surface characteristics and to determine whether the film surface affects the electrical performance of the device. When the CuSCN solution concentration was low, the CuSCN film was not formed and coated in the form of islands, and when the solution concentration was increased, the CuSCN film was formed uniformly, which contributed to improving the conductivity of the device. In addition, a hole-only device was fabricated to demonstrate the role of CuSCN as a hole transport layer.

기획특집2_레이저 산업의 동향 - 신개념 레이저 기반 초정밀.초고속 가동시스템 개발동향

  • Seo, Jeong
    • The Optical Journal
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    • s.124
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    • pp.28-32
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    • 2009
  • 초정밀 초고속 레이저 가공공정 및 장비는 유연소재의 태양전지, 인쇄전자소자(printed electronics devices)의 초고속 절단공정, 고기능 다기능 모바일 기기용 고부가 PCB의 초정밀 초고속 레이저 드릴링 및 복합 유연 가공 등에 적용된다. 최근 레이저 가공기 연구개발 패러다임은 레이저 의존형 장비 개발에서 레이저 맞춤형 장비 개발로 변화되고 있다. 즉, 수입된 레이저 발진기 및 광학기기를 사용하여 레이저 공정 및 장비를 개발하는 방식에서 벗어나, 개발하고자 하는 공정 및 장비에 최적화된 레이저 발진기 개발을 병행하는 것이다. 이러한 상황에서 최근 지식경제부 산업원천기술개발사업으로 신개념 레이저 기반 초정밀 초고속 가공시스템 개발이 착수되었으며, 본 고에서는 이에 대한 전반적인 내용들 소개하고자 한다.

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A Study on the Characteristics of a Quantum Dots Light-Emitting Diodes Using a Mixed Layer of Quantum Dots and Hole Transport Materials (양자점과 정공 수송 물질의 혼합층을 사용한 양자점 전계발광 소자의 특성 연구)

  • Yoon, Changgi;Oh, Seongkeun;Kim, Jiwan
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.69-72
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    • 2021
  • Various studies for QLEDs using inkjet printing has been actively conducted. Multilayers in QLEDs need an orthogonal process inevitably using different solvents and it makes the inkjet printing process more difficult and expensive. Therefore, coating two layers in a single process can reduce the fabrication step, resulting in the process time. In this study, we fabricated QLEDs of standard structure using a mixture of emission layer and hole transport layer. The mixed layer was fabricated by dissolving TFB and QDs in chlorobenzene, and the maximum luminance of the device was 45,850 cd/m2. It shows the bright future of the electroluminescence devices applied with inkjet printing process.

Surface treatment of silver-paste electrode by atmospheric-pressure plasma-jet (대기압 플라즈마 제트를 이용한 실버페이스트 전극의 표면처리)

  • Sheik Abdur Rahman;Shenawar Ali Khan;Yunsook Yang;Woo Young Kim
    • Journal of the Korean Applied Science and Technology
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    • v.40 no.1
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    • pp.71-80
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    • 2023
  • Silver paste is a valuable electrode material for electronic device applications because it is easy to handle with relatively low heat treatment. This study treated the electrode surface using an atmospheric-pressure plasma jet on the silver-paste electrode. This plasma jet was generated in an argon atmosphere using a high voltage of 5.5 to 6.5 kV with an operating frequency of 11.5 kHz. Plasma-jet may be more beneficial to the printing process by performing it at atmospheric pressure. The electrode surface becomes hydrophilic quickly and contact angle variation is observed on the electrode surface as a function of plasma treatment time, applied voltage, and gas flow rate. Also, there was no deviation in the contact angle after the plasma treatment in the large-area sample, that means a uniform result could be obtained regardless of the substrate size. The outcomes of this study are expected to be very useful in forming a stacked structure in the manufacture of large-area electronic devices and future applications.

Analysis of Key Parameters for the Printing Process Optimization of a Fluid Dispensing Systems (유체 디스펜싱 시스템의 프린팅 프로세스 최적화를 위한 주요 파라미터 분석)

  • Hoseung Kang;Haechang Jeong;Soonho Hong;Nam Kyung Yoon;Sunyoung Sohn
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.4
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    • pp.382-393
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    • 2024
  • The Microplotter system with a fluid dispensing method, sprays fluid based on ultrasonic pumping through piezoelectric devices. This technique can possible for various materials with a wide range of viscosities to be printed in microscale. In this paper, we introduces dispenser printing technology as well as aim to understand and apply various processes using the equipment. In addition, we will explain how to optimize the equipment by adjusting parameters such as spray intensity, tip height during printing, and patterning speed. By utilizing Microplotter's advantage of being compatible with a wide range of fluids, including metal nanoparticles, carbon nanotubes, DNA, and proteins, it is expected to be used in various fields such as printed electronics, biotechnology, and chemical engineering.

A Printing Process for Source/Drain Electrodes of OTFT Array by using Surface Energy Difference of PVP (Poly 4-vinylphenol) Gate Dielectric (PVP(Poly 4-vinylphenol) 게이트 유전체의 표면에너지 차이를 이용한 유기박막트랜지스터 어레이의 소스/드레인 전극 인쇄공정)

  • Choi, Jae-Cheol;Song, Chung-Kun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.3
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    • pp.7-11
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    • 2011
  • In this paper, we proposed a simple and high-yield printing process for source and drain electrodes of organic thin film transistor (OTFT). The surface energy of PVP (poly 4-vinylphenol) gate dielectric was decreased from 56 $mJ/m^2$ to 45 $mJ/m^2$ by adding fluoride of 3000ppm into it. Meanwhile the surface energy of source and drain (S/D) electrodes area on the PVP was increased to 87 $mJ/m^2$ by treating the areas, which was patterned by photolithography, with oxygen plasma, maximizing the surface energy difference from the other areas. A conductive polymer, G-PEDOT:PSS, was deposited on the S/D electrode areas by brushing painting process. With such a simple process we could obtain a high yield of above 90 % in $16{\times}16$ arrays of OTFTs. The performance of OTFTs with the fluoride-added PVP was similar to that of OTFTs with the ordinary PVP without fluoride, generating the mobility of 0.1 $cm^2/V.sec$, which was sufficient enough to drive electrophoretic display (EPD) sheet. The EPD panel employing the OTFT-backpane successfully demonstrated to display some patterns on it.

Effects of Temperature/Humidity Treatment Conditions on the Peel Strength between Screen-printed Ag and Polyimide Films (고온/고습 조건이 스크린 프린팅 Ag와 Polyimide의 필 강도에 미치는 영향)

  • Lee, Hyeonchul;Bae, Byeong-Hyun;Son, Kirak;Kim, Gahui;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.2
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    • pp.43-48
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    • 2022
  • Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

Fabrication of Organic Thin Film Transistors using Printed Electrodes (프린팅 방법으로 형성된 전극을 이용한 유기 박막 트랜지스터의 제작 및 특성 분석)

  • Kim, Jung-Min;Seo, Il;Kim, Young-Sang
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1336_1337
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    • 2009
  • 본 논문에서는 유기 박막 트랜지스터의 전극을 잉크젯 프린팅과 스크린 프린팅 방법을 이용하여 유기 박막 트랜지스터를 제작하였다. 전극으로 PEDOT:PSS와 Ag 잉크를 사용하였고, 게이트 절연막으로 polymethyl methacrylate (PMMA)와 poly(4-vinylphenol) (PVP)를 사용하였다. 유기물 활성층으로 pentacene을 진공 증착하였다. 잉크젯 프린팅 방법을 이용하여 제작한 유기 박막 트랜지스터는 전계이동도 (${\mu}_{FET}$) $0.068\;cm^2$/Vs, 문턱전압 ($V_{th}$) -15 V, 전류 점멸비 ($I_{on}/I_{off}$ current ratio) >$10^4$의 전기적 특성을 보였고, 스크린 인쇄 방법을 이용하여 제작한 유기 박막 트랜지스터는 전계이동도 (${\mu}_{FET}$) $0.016\;cm^2$/Vs, 문턱전압 ($V_{th}$) 6 V, 전류 점멸비 ($I_{on}/I_{off}$ current ratio) >$10^4$의 전기적 특성을 보였다. 이를 통하여 프린팅 방법을 이용한 유기 박막 트랜지스터 단일 소자 및 유기 전자 회로 제작의 가능성을 확인 하였다.

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