• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.1
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• pp.45-50
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• 2014

A vibration test coupon is prepared with nine plastic ball grid array packages on a printed circuit board using SnPb solders, and a random vibration test is conducted on the coupon. Life data from the test are analyzed, and it is shown that over the board, life data is location-dependent. For investigating this location dependency, a finite element model is developed and the equivalent stresses, which are defined based on the stress response functions at each node, are investigated. It is shown that one of the corner solder balls has the maximum equivalent stress at a package during the test. Finally, it is demonstrated that the maximum equivalent stress and durability life are inversely proportional.

• Journal of KSNVE
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• v.10 no.6
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• pp.971-976
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• 2000

High level random vibration environments induced while launching of spacecraft can damage sensitive electronic equipment, unless the equipment is properly packaged. Thus careful consideration on the launch environment, especially for high level random vibration, is required in the design stage of electronic equipment of spacecraft. This paper describes the development process of Solar Array Regulator for KOMPAT-2, which is designed and tested by Korean engineers. Both analytical and experimental techniques are introduced in this paper.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.342-345
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• 2004

We design a new actuator in order to achieve 3-axes motion for high performance optical device. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in terms of prices and manufacturing. To predict the features of actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis are used From comparing simulated data with experimental results, we verified the accuracy of the simulation and the superiority of the present actuator.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.2 s.95
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• pp.156-160
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• 2005

We design a new actuator of 3-axis motion for high performance optical devices. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in price and manufacturing. To predict the characteristics of the actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis were used. By comparing simulation data with experimental results, we verified the accuracy of the simulation and the superiority of the present.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.78-81
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• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.554-560
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• 2013

This study proposes an structure that fixes the shielding device to two parts of the board by its two arranged clips. Said structure evenly distributes its loading/unloading load of the board and maintains the flatness of soldering area of the board. The structure of this study comprises a base part fixed to a printed circuit board and a clip part fixing a side wall of a shield can to the board, wherein the clip part is constituted with two clips fixable to two part of the shield can. Also, the structure of this study comprises a dented groove in order to easily solder the base part of clips and the printed circuit board. A mechanism is established and a design parameter was determined by a structure analysis and a vibration mode analysis. A single purpose machine for the production of the product was developed, the final workpiece was produced and the measuring-data and the computered-data was compared and reviewed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.5
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• pp.2015-2022
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• 2012

This paper is about the analysis and design of avionics equipment's housing and PCB(Printed Circuit Board) such as air data computer. Avionics equipment's structural design as well as electrical properties is very critical and should be proved from design phase by analysis method. First, analyze the static load and vibration requirement for the installed equipment, and then proved it satisfy with its requirement using the computational structural analysis. Commercial tools were used for computation and the rib design of housing was verified and the placement of electrical component was proposed using the PCB's local displacement information.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.4
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• pp.319-327
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• 2020

In this study a methodology to evaluate fatigue life of the electronic parts for the fighter radar unit under random vibration loading is presented. To do this, one parameter for the 3-σ RMS quation of Steinberg fatigue model is modified to come up with a printed circuit board(PCB) with multiple electronic parts, while fundamental frequency and dynamic deflection of the PCB are calculated from a MATLAB based finite element computer code. For the RIFA structure selected in this study, the 3-σ RMS fatigue limit displacement is reduced to 0.741 times as much as the Steinberg model. This investigation allows to assess the life of multiple electronic parts mounted on the PCB with reinforced metal cover/body showing non-sinusoidal deflection patterns.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.