• 대한기계학회논문집A
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• 제38권1호
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• pp.45-50
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• 2014

인쇄회로기판 위에 9개의 PBGA (Plastic Ball Grid Array) 패키지를 SnPb 솔더로 실장하여 진동시편을 제작하고 랜덤진동시험을 수행하였다. 진동에 대한 각 패키지 솔더의 내구수명을 분석한 결과, 패키지의 인쇄회로기판 배치 위치에 따라 솔더의 내구수명이 결정됨을 보였다. 이 위치에 따른 내구수명 의존성을 규명하기 위하여 유한요소모델을 작성하고, 모델의 모든 요소에 대해서 응력응답함수로부터 정의되는 등가응력을 분석하였다. 분석결과로부터 랜덤진동시험에서 패키지를 연결하는 솔더 중 코너에 위치한 솔더에서 최대 등가응력이 발생함을 보였다. 마지막으로, 각 패키지별 코너 솔더의 최대 등가응력값을 파괴등가응력으로 정의하고 파괴등가응력과 각 패키지의 내구수명간에 직접적인 연관관계가 있음을 제시하였다.

• 소음진동
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• 제10권6호
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• pp.971-976
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• 2000

High level random vibration environments induced while launching of spacecraft can damage sensitive electronic equipment, unless the equipment is properly packaged. Thus careful consideration on the launch environment, especially for high level random vibration, is required in the design stage of electronic equipment of spacecraft. This paper describes the development process of Solar Array Regulator for KOMPAT-2, which is designed and tested by Korean engineers. Both analytical and experimental techniques are introduced in this paper.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2004년도 춘계학술대회논문집
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• pp.342-345
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• 2004

We design a new actuator in order to achieve 3-axes motion for high performance optical device. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in terms of prices and manufacturing. To predict the features of actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis are used From comparing simulated data with experimental results, we verified the accuracy of the simulation and the superiority of the present actuator.

• 한국소음진동공학회논문집
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• 제15권2호
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• pp.156-160
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• 2005

We design a new actuator of 3-axis motion for high performance optical devices. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in price and manufacturing. To predict the characteristics of the actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis were used. By comparing simulation data with experimental results, we verified the accuracy of the simulation and the superiority of the present.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2002년도 춘계학술대회논문집
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• pp.78-81
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• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• 한국산학기술학회논문지
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• 제14권2호
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• pp.554-560
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• 2013

본 연구에서는 양쪽 대칭으로 지지할 수 있는 쉴드캔 클립을 제안하며, 그 특징은 장착과 탈착의 하중을 일정하게 하고 납땜 부위의 평판도를 유지 할 수 있도록 개발하였다. 또한 인쇄회로기판에 부착 고정되는 베이스부 및 쉴드캔의 측벽을 집게 형태로 집을 수 있도록 하는 클립부로 구성되며, 클립부 중앙을 절단하여 2군데를 지지 할 수 있게 이루어진다. 또한 넓어진 베이스부와 인쇄회로기판 사이에 납땜이 잘될 수 있도록 오목한 홈을 만들었다. 연구절차는 우선 메커니즘을 설정하고 구조해석 및 진동모드 해석을 수행하여 설계변수를 확정한 후, 제품을 설계하였다. 제조를 위한 전용기를 개발한 후 시제품을 제작하여 성능 평가 후 해석값과 비교 분석하였다.

• 한국산학기술학회논문지
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• 제13권5호
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• pp.2015-2022
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• 2012

본 논문은 항공전자장비의 구조해석을 통한 하우징과 인쇄회로기판의 해석과 설계에 관한 것으로 대기자료 컴퓨터 개발 사례를 통한 연구결과이다. 항공기에 장착되는 전자장비는 전기적인 특성 외에도 운용환경에 따른 구조 설계가 매우 중요하고 설계 단계에서부터 해석을 통한 입증이 되어야 한다. 본 연구에서는 장착되는 항공 장비의 응력과 진동 요구도를 분석하여 해석 결과를 통하여 설계에 적용하고 요구도에 대해서 입증하는 방법에 대한 것이다. 구조 해석은 상용 소프트웨어를 사용하였으며 하우징의 내부 리브 설계에 대한 적합성을 확인하고 인쇄회로 기판의 변위를 계산하여 전자 부품 배치에 활용하는 방법에 대해서 제시하였다.

• 한국정밀공학회지
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• 제21권8호
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• 한국군사과학기술학회지
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• 제23권4호
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• pp.319-327
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• 2020

In this study a methodology to evaluate fatigue life of the electronic parts for the fighter radar unit under random vibration loading is presented. To do this, one parameter for the 3-σ RMS quation of Steinberg fatigue model is modified to come up with a printed circuit board(PCB) with multiple electronic parts, while fundamental frequency and dynamic deflection of the PCB are calculated from a MATLAB based finite element computer code. For the RIFA structure selected in this study, the 3-σ RMS fatigue limit displacement is reduced to 0.741 times as much as the Steinberg model. This investigation allows to assess the life of multiple electronic parts mounted on the PCB with reinforced metal cover/body showing non-sinusoidal deflection patterns.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2009년도 추계학술대회 논문집
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.