• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.2
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• pp.14-25
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• 1999

The IEEE standard 1149.1, which was proposed to increase the observability and the controllability in I/O pins, makes it possible the board level testing. In the boundary-scan environments, many shift operations are required due to their serial nature. This increases the test application time and the test application costs. To reduce the test application time, the method based on the parallel opereational multiple scan paths was proposed, but this requires the additional I/O pins and the internal wires. Moreover, it is difficult to make the designs in conformity to the IEEE standard 1149.1 since the standard does not support the parallel operation of data shifts on the scan paths. In this paper, the multiple scan path access algorithm which controls two scan paths simultaneously with one test bus is proposed. Based on the new algorithm, the new algorithm, the new board level BIST architecture which has a relatively small area overhead is developed. The new BIST architecture can reduce the test application time since it can shift the test patterns and the test responses of two scan paths at a time. In addition, it can reduce the costs for the test pattern generation and the test response analysis.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.10
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• pp.291-298
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• 2020

The power generation of a PV system changes according to the weather variables, such as solar radiation and temperature. In particular, the output characteristics of photovoltaic systems, which are sensitive to changes in solar radiation, can be produced effectively and reliably in various weather conditions through MPPT (Maximum Power Point Tracking) control. This paper proposes a fuzzy-based MPPT control method to improve the efficiency and stability of the power production from a solar system. To verify the performance of the proposed method, under the same weather environment, the efficiency and stability of the newly proposed fuzzy logic were compared and evaluated empirically with P&O (Perturb and Observe), a representative algorithm of MPPT control. Furthermore, the circuits designed to improve the reliability and reliability of the hardware were manufactured from Printed Circuit Boards (PCB) to conduct experiments. Based on the results of the experiment during a certain period, the fuzzy-based MPPT proposed in this paper improved the efficiency by more than 4.4% compared to the MPPT based on the existing P&O algorithm and decreased the fluctuation width by more than 39.7% at the maximum power point.

• The Magazine of the IEIE
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• v.28 no.7
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• pp.49-55
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• 2001

1970년대에 개발된 마이크로 프로세서는 제어기기 분야 및 소형 컴퓨터에서 주로 사용되어 오다가 1980년대에 이르러 RISC(Reduced Instruction Set Computer) 구조의 도입으로 중대형 컴퓨터에 이르기까지 광범위하게 사용되고 있다. 또한 반도체 기술의 급격한 발전으로 슈퍼스칼라 구조가 마이크로 프로세서에서도 적용되고 있으며 동작 속도도 수백 MHz에 이르고 있다. 마이크로 프로세서는 프로그램을 수행하기 위해서 프로그램과 데이터를 메모리로부터 읽어 와야 한다. 그런데 메모리 용량은 빠른 속도로 증가하고 있지만 동작 속도는 마이크로 프로세서의 동작 속도에 크게 미치지 못하고 있다. 1980년에 DRAM의 접근 속도는 250nsec이었으나 1998년에 RDRAM의 동작속도는 300MHz로 70여배 빨라졌다. 그러나 마이크로프로세서는 1980년에 8086의 동작 속도가 8MHz이던 것이 1998년에는 팬티엄-2가 500MHz에 이르고 있다. 더욱이 팬티엄-2는 슈퍼스칼라 구조이므로 이를 감안하면 1GHz 이상에 이르러 120여 배 빨라진 것을 알 수 있다. 이와 같은 메모리 속도와 마이크로 프로세서 속도 차이에 더하여, 메모리와 마이크로 프로세서를 인쇄 회로 기판에서 연결하는데 따른 물리적 특성은 변화하지 않으므로 데이터 전송 폭을 넓히는 것에는 한계가 있다. 따라서 향후 컴퓨터 성능 발달을 제한하는 주요 요소 중 하나는 마이크로 프로세서와 메모리 사이의 데이터 전송 폭이다. 프로그램과 데이터가 메모리에 저장되는 본 뉴먼 방식의 컴퓨터에서 데이터 전송 폭을 줄이기 위해서는 코드 밀도(Code Density)가 높은 컴퓨터 구조를 연구하는 것이 필요하다. 한편 마이크로 프로세서는 실장 제어용으로 거의 모든 전자 제품 및 자동화 기기에서 채용하고 있다. 특히 냉장고, 에어콘, 전축, TV, 세탁기 등 가전기기와 Fax, 복사기, 프린터 등 사무용기기와 자동차, 선박, 자동화기계 등 사무 및 산업용 기기와 PDA(휴대용 정보 기기), NC(Network Computer) 등 정보 기기 그리고 각종 오락기, 노래 반주지 등 정보 기기 등에서 사용하는 실장 제어용 마이크로 프로세서 시장은 매년 10% 이상씩 성장하고 있으며, 21세기 산업을 주도하는 핵심 기술로 자리 매김하고 있다. 이러한 실장 제어용 기기는 마이크로 프로세서와 메모리 및 입출력 자이가 하나의 반도체에 집적되는 경우가 많다. 그런데 반도체 가격은 반도체 크기에 따라 결정되며, 가장 넓은 면적을 차지하는 것은 메모리이다. 따라서 반도체 가격을 낮추기 위해서는 메모리 크기를 줄여야 하며, 이를 위해서 또한 코드 밀도가 높은 컴퓨터 구조에 대한 연구가 필요하다. 최근에는 322비트 RISC 명령어를 16비트 명령어로 축약한 구조가 연구되었다. ARM-7TDMI는 ARM-7의 16비트 축약 명령어 구조이며, TR4101은 MIPS-R3000의 16비트 축약 명령어 구조이다. 이들 16비트 축약 명령어 RISC는 종래 RISC와의 호환성을 위하여 2가지 모드로 동작하므로 구조가 복잡하고, 16비트 명령어에서는 8개의 레지스타만을 접근할 수 있으므로 성능이 크게 떨어지는 단점을 가진다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.59-64
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• 2022

Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.

• Journal of the Korean Society of Marine Environment & Safety
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• v.28 no.spc
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• pp.23-29
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• 2022

To detect harmful chemical substances in seawater, we fabricated a prototype sensor and evaluated its performance. The prototype sensor consisted of a detector, housing, and driving circuit. We built the detector by printing an Indium-Tin-Oxide (ITO) nanoparticle film on a flexible substrate, and it had two detection parts for simultaneous detection of temperature and HNS concentration. The housing connected the detector and the driving circuit and was made of Teflon material to prevent chemical reactions that may affect sensor performance. The driving circuit supplied electric power, and display measured data using a bridge circuit and an Arduino board. We evaluated the sensor performances such as response (ΔR), the limit of detection (LOD), response time, and errors to confirm the specification.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.23-27
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• 2024

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.

• Journal of Korean Society of Environmental Engineers
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• v.29 no.9
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• pp.1013-1019
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• 2007

Electronic wastes have increased tremendously. However, any reliable treatment methodologies have rarely been established. Electronic wastes have posed serious disposal problem due to their physico-chemical stability. This paper investigated the application possibility of pyrolysis for the purpose of recycling the p-CCL(phenol based Copper Clad Laminate). Thermogravimetric analysis(TGA) was used to investigate the thermal decomposition pattern of p-CCL. We elucidated the characteristics of pyrolysis by-products at operating temperatures of 280, 350 and $600^{\circ}C$. GC/MS and FT-IR were used to characterize the liquid by-products along with general characterization methods such as Ultimate Analysis, Proximate Analysis and Heating Value, whereas general characterization methods were only introduced for the solid by-products. At a heating rate of $5^{\circ}C$/min, TGA curves exhibited three decomposition stages: (1) low-temperature decomposition region$(<280^{\circ}C)$, (2) medium temperature region$(280\sim350^{\circ}C)$ and (3) high-temperature region$(>350^{\circ}C)$. The major compounds of liquid by-products at low- and medium-temperatures were accounted for by water and phenol, whereas branched phenols and furans were major compounds at high-temperatures. As the temperature increases, volatile quantities decreased but the fixed carbon increased. High heating values of solid by-products($7,400\sim7,600$ kcal/kg) would suggest that the solid by-products could be applicable as fuel. In addition, high fixed carbon but low ash content of the solid by-products offered an implication that they are capable of being upgradable for adsorbent after applying appropriate activating process.

• Clean Technology
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• v.17 no.4
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• pp.306-313
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• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.