• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.12
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• pp.1875-1882
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• 2013

Micro-array technology contributes numerous achievements such as ordering of gene network and integration of genomic. This technology is well established as means for investigating patterns of gene expression. DNA micro-arrays utilize Affymetric chips where a large quantity of DNA sequences may be synthesized. There are two general type of conventional DNA array spotter: contact and piezoelectric. The contact technology used spotting pin technology to make contact with the glass slide surface. This may caused damage or scratches to the surface matrix where protein will be contaminated and may not bind specifically. Piezoelectric technology available at this present time on the other hand requires the analyzer to print the result that can only be done within the laboratory despite of mass production. Therefore, in this paper, high-throughput technology is developed for providing greater consistency in feature spot without touching the glass slide surface.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.7
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• pp.753-759
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• 2014

This paper introduces the reduction design technique of the resonance phenomenon of the inner PCB based on power integrity from the analysis about the inner power supply line generating RLC resonance. With the technique, the resonant frequency resulted from the structural characteristics of the PCB can be analyzed and allows to predict and the capacitor for resonance phenomenon reduction can be decided as a decoupling capacitor. From the simulation result, it was confirmed that the PCB's resonance phenomenon reduction design technique should have the reduction effect in the inner motherboard of the industrial controller. This research will be contributed to the improvement of the safety of a PDN (Power Delivery Network) structure in the layout design technique of the PCB.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.121.1-121.1
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• 2011

현재 상용화되고 있는 단결정 실리콘 태양전지는 알루미늄 페이스트를 이용하여 후면의 전 영역에 전계를 형성한다. 최근에는 고효율을 얻기 위하여 후면에 패시베이션 효과와 장파장에 대한 반사도를 증가 시키는 SiNx막을 증착 후, 국부적으로 전계를 형성하는 국부 후면 전극(Local back surface field)기술이 연구되고 있다. 본 연구에서는 전면만 텍스쳐 된 단결정 실리콘 웨이퍼를 이용하였다. Plasma Enhanced Chemical Vapor Deposition(PECVD)를 이용하여 전,후면에 SiNx를 증착 하였고 후면의 국부적인 전극 패턴 형성을 위하여 SiNx 식각용 페이스트를 사용한 스크린 프린팅 기술을 이용하였다. 스크린 프린팅을 이용하여 패턴이 형성된 후면에 알루미늄을 인쇄 한 후 Rapid Thermal Process(RTP)를 이용하여 소성 공정 조건을 변화시켰다. 소성 조건 동안 형성되는 후면 전계층은 peak 온도와 승온속도, 냉각 속도에 따라 형상이나 특성이 변화하기 때문에 소성 조건을 변화시키며 국부적 후면 전계 형성의 최적화에 관한 연구를 수행하였다. 패이스트를 이용하여 SiNx를 식각 후 광학 현미경(Optical Microscopy)을 사용하여 SiNx의 식각 유무를 살펴보았고, RTP로 형성된 국부 전계층의 형성 두께, 주변 부분의 형상을 살피기 위해 도핑 영역을 혼합수용액으로 식각하여 주사 전자 현미경(SEM)을 이용하여 관찰 하였다. 또한 후면의 특성을 살펴보기 위해 분광 광도계(UV/VIS/NIR Spectrophotometer)를 사용하여 후면 SiNx층의 유무에 따른 반사도를 비교, 측정 하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.151-159
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• 2015

In this study, we developed an automated contact-type thickness measurement machine that continuously and precisely measures the thickness of a PCB module product using multi-LVDT sensors. The system contains a measurement part to automatically measure the thickness in real time according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The sensors were calibrated before assembly in the measuring machine, and precision and accuracy performance tests were also performed to reduce uncertainty errors in the measurement machine. In the calibration test, the precision errors of the LVDT sensor were determined to be $1-3{\mu}m$ as 0.1% at the measuring range. A measurement error of 0.8 mm and 1.0 mm thickness test standards were found to be $1{\mu}m$ and $4{\mu}m$, and the standard deviations of two 1.0 mm products were measured as $14{\mu}m$ and $8{\mu}m$, respectively. In the measurement system analysis, the accuracies of test PCB standards were found to be $2{\mu}m$ and $3{\mu}m$, respectively. From the results of gage repeatability and reproducibility (R & R) crossed, we found that the machine is suitable for the measurement and process control in the mass production line as 7.92% of total gage R & R and in seven distinct categories. The maximum operating speed was limited at 13 pcs/min, showing a value good enough to measure.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.62-72
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• 2015

Interest in three-dimensional (3D) printing processes has grown significantly, and several types have been developed. These 3D printing processes are classified as Selective Laser Sintering (SLS), Stereo-Lithography Apparatus (SLA), and Fused Deposition Modeling (FDM). SLS can be applied to many materials, but because it uses a laser-based material removal process, it is expensive. SLA enables fast and precise manufacturing, but available materials are limited. FDM printing's benefits are its reasonable price and easy accessibility. However, metal printing using FDM can involve technical problems, such as suitable component supply or the thermal expansion of the heating part. Thus, FDM printing primarily uses materials with low melting points, such as acrylonitrile butadiene styrene (ABS) or polylactic acid (PLA) resin. In this study, an FDM process for enabling metal printing is suggested. Particularly, the nozzle and heatsink for this process are focused for stable printing. To design the nozzle and heatsink, multi-physical phenomena, including thermal expansion and heat transfer, had to be considered. Therefore, COMSOL Multiphysics, an FEM analysis program, was used to analyze the maximum temperature, thermal expansion, and principal stress. Finally, its performance was confirmed through an experiment.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.27-31
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• 2008

Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2000.11a
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• pp.54-54
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• 2000

종이의 생산성을 향상 시키기 위한 방법에는 초지기의 광폭화오} 생산 속도의 증가 가 있다. 현재 초지기는 10m까지 생산 폭이 확대 되었고, 생산 속도에 있어서는 최 신 설비의 경우 2,OOOm/min로 설계 되고 있다. 따라서 생산 폭과 속도의 증가는 이 전의 소폭과 저속의 생산 셜비에서와 동일한 원료 배합과 생산 관리로는 최적의 생 산 효율을 달성하는데 문제점이 있다. 그러므로 현재 각국의 신규 제지 설비에 적 용되 고 있는 twin wire system역 시 생 산 속도의 증가를 극복하고 기 존의 fourdrinier s system 이 지니고 있는 문제점을 극복하기 위해 도입되었다. 두 가지의 생산 설비에서 제조된 종이의 가장 큰 차이점은 미세 입자들의 분포와 종이의 구조적 특성에 있다. 특히 fourdrinier system에서 미세 입자들의 분포는 횡단 면을 기준으로 볼 때 표면에서 와이어 면으로 진행됨에 따라 급격히 감소된다는 것 을 알 수 있다. 이러한 사실은 주지하는 바와 같이 초지 형성부에서 효과적인 탈수 를 달성하기 위해 부착되어 있는 여러가지 탈수 장치들의 영향으로 와이어 방향으 로만 급격한 탈수가 일어나기 때문이다. 그러나 twin wire system 2.! gap former어$\mid$ 있 어서 미세 섬유와 충전제가 횡단면상에서 분포하는 형태는 "U"자 형태로 상면과 하 면에서 가장 높은 미세분의 분포를 나타내고 줄간층에는 상대적으로 낮은 미세분이 분포하고 있을을 알수 있다. 따라서 종이의 중간층 미세분 분포의 감소는 섬유간 표면적의 감소를 의미하고 이로 인하여 결합력이 약해진다는 것을 알 수 있다. 특 히 도공 원지로 사용되었을 경우 heat off-set 인쇄시 블리스터와 같은 문제점을 일 으키기도 한다. 앞서 언급한 바와 같이 종이의 제조 설비에 따라 제조되는 종이의 구조적 특성이 변하게 되므로 동일한 도공 공정에 적용 되었을 경우 이들로부터 제 조된 도공지의 특성에도 영향을 미칠것으로 예측된다. 따라서 본 연구에서는 두 가지 초지기의 형태에서 제조된 원지가 도공 작업성과 도공지의 특성에 미치는 영향에 대해 고찰코자 하였다.대해 고찰코자 하였다.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.1-5
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• 2000

Co-fired resistors for high frequency MCM-C (Multi Chip Module-Cofired) were fabricated and measured their RF properties from DC to 6 GHz. LTCC (Low Temperature Co-fired Ceramics) substrates with 8 layers were used as the substrates. Resisters and electrodes were printed on the 7th layer and connected to the top layer by via holes. Deviation from DC resistance of the resistors was resulted from the resister pastes, resistor size, and via length. From the experimental results, the suitable equivalent circuit model was adopted with resistor, transmission line, capacitor, and inductor. The characteristic impedance $Z_{o}$ of the transmission line from the equivalent circuit can explain the RF behavior of the buried resistor according to the structural variation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.70-78
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• 2009

This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.5
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• pp.562-571
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• 2008

In this paper, we propose a novel structure of a spiral antenna with a CP characteristic for RFID reader in UHF band. Since the proposed antenna can be built by printing on a FR-4 substrate, it is appropriate for low-cost mass-production. The antenna is designed to operate in UHF band of $860{\sim}960$ MHz. The CP bandwidth is Increased enough to cover an overall UHF RFID band by using a spiral structure for the antenna arm. The matching bandwidth is broadened by using a quarter-wave transformer between the fred and the antenna body. The proposed antenna has advantages of its easy gain and pattern control with a small antenna size. The measured antenna performance shows the matching bandwidth of 13%, the CP bandwidth of 23%, and the gain of 6.5 dBi. This verifies that the proposed antenna is appropriate for RFID antennas in UHF band.