• Particle and aerosol research
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• v.13 no.3
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• pp.111-118
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• 2017

Electrohydrodynamic (EHD) printing with the aid of strong electric fields can generate and pattern droplets that are smaller than droplets by other printing technologies. Conventional EHD printing has created two-dimensional (2D) patterns by moving its nozzle or a substrate in X and Y directions. In this study, we aimed to develop an EHD system that can create 2D patterns using a multielectrode array (MEA) without moving a nozzle or substrate. In particular, printing ink mixtures of biodegradable polymers and model dyes was patterned on a thin film made of another biodegradable polymer. Without movement of a nozzle and substrate, stable 2D patterning of minimum $6{\mu}m$ size over a range of about 1 mm away from the nozzle position was achieved by MEA control only. We also demonstrated the possibility of denser 2D pattering of the ink mixtures by moving a target substrate relative to MEA position.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.11
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• pp.975-982
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• 2010

In this study, the laser sintering of inkjet-printed silver lines was evaluated. Silver-nanoparticle ink and a drop-ondemand (DOD) inkjet printer were used for printing on glass and polyethylene terephthalate (PET) substrates with various thicknesses. To sinter the printed silver nanoparticles, the silver layer printed on the transparent substrates was irradiated by focused CW laser beams that were incident normal to the substrates; the irradiation was carried out for various beam intensities and for various irradiation times. The electrical conductivity of the laser-sintered silver patterns was measured and compared with the conductivity of silver patterns sintered by using an oven. The increase in the temperature caused by laser irradiation was also calculated on the basis of the laser beam intensity, irradiation time, surface reflectivity, and thermophysical property of the substrate in order to estimate the increase in the electrical conductivity caused by laser sintering.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.81-81
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• 2009

최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

• Korean Journal of Optics and Photonics
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• v.26 no.5
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• pp.261-264
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• 2015

In this paper we show that the photoresist-protective film of a printed circuit board (PCB) can be delaminated from the underlying photoresist layer by a single pulse of a nanosecond laser at 532 nm. After locally peeling the edge of the PCB with a laser beam of 9 mm size, Scotch tape was attached to the irradiated region to peel off the whole protective film. For a certain range of pulse energies the peeling probability was 100%, without leaving any damage. Since the use of a laser in initial delamination is noncontact and nondamaging, it may be more efficiently utilized in the PCB industry than the conventional knurling method based on mechanical pressing.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.71-77
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• 2011

Main parameters of the screen printing were determined and the printing parameters were optimized for 0402, 0603, and 1005 chips in this study. The solder pastes used in this study were Sn-3.0Ag-0.5Cu and Sn-0.7Cu. The process parameters were stencil thickness, squeegee angle, printing speed, stencil separating speed and gap between stencil and PCB. The printing pressure was fixed at 2 $kgf/cm^2$. From ANOVA results, the stencil thickness and the squeegee angle were determined to be main parameters for the printing efficiency. The printing efficiency was optimized with varying two main parameters, the stencil thickness and the squeegee angle. The printing efficiency increased as the squeegee angle was lowered under 45o for all chips. For the 0402 and the 0603 chips, the printing efficiency increased as the stencil thickness decreased. On the other hand, for the 1005 chip, the printing efficiency increased as the stencil thickness increased.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.6
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• pp.7-14
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• 2011

This paper is related to a roll-type micro-contact printing process. The proper parameters such as coating velocity, inking velocity, printing velocity and printing pressure as well as Ag contents of Ag ink were extracted to perform the fine patterning of Ag electrodes. Additionally we developed a process for PDMS with high uniform thickness. Finally, we obtained the Ag fine electrodes on $4.5cm\;{\times}\;4.5cm$ plastic substrate with the line width of 10 um, thickness less than 300 nm, surface roughness less than 40 nm, and the specific resistance of $2.08\;{\times}\;10^{-5}{\Omega}{\cdot}cm$.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.35-37
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• 2001

다층 인쇄 회로 기판에 Combline 구조를 가진 스트립 라인 또는 마이크로 스트립 라인 대역통과 필터를 구현하였다. 저 비용 구현과 이동성과 휴대성을 강조하기 위해 기존의 세라믹 대신 FR4 와 에폭시를 기반으로 하는 다층 회로 기판의 도체 층에 집적화하였다. Combline 각 끝단에 커패시터를 부하 함으로써 전기적 길이를 화장하였고 전체적인 크기를 감소시킴으로서 적당한 필터 특성을 얻을 수 있었다. 구현된 필터는 마이크로파 대역에서 사용 가능하며 특히 Bluetooth나 Wireless LAN 과 같은 ISM 대역을 사용하는 무선통신소자로서 사용 가능하다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.05a
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• pp.77-79
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• 2012

The paper deals with the approximate analysis of printed antenna like superconductor antenna. Analysis of antenna with polarization current in dielectric layer using Moment method. This approximation is very useful for printed antenna on dielectric plane with low dielectric constant. In this paper, we compared numerical results of this method with measurement results.