• Title/Summary/Keyword: 인도핑

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Effect of Posphorus Dopants in the Thermal Oxidation of Tungsten Polycide Films (텅스텐 폴리사이드막의 열산화에서 인 불순물 효과)

  • 정회환;정관수
    • Journal of the Korean Vacuum Society
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    • v.4 no.3
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    • pp.293-300
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    • 1995
  • p-doped poly-Si/SiO2/Si 기판위에 저압 화학증착법(LPCVD)으로 증착한 텅스텐 실리사이드(WS2.7)막을$ 850^{\circ}C$에서 20분 동안 N2 분위기에서 열처리한 후에 건식 분위기에서 열산화하였다. 다결정 실리콘의 인도핑(doping)레벨에 따른 텅스텐 폴리사이드(WSi2.5/poly-Si)막의 산화 성장률과 텅스텐 폴리사이드막의 산화 메카니즘에 대하여 연구하였다. 텅스텐 폴리사이드막의 산화 성장률은 다결정 실리콘의 인(p) 도핑 레벨이 증가함에 따라 증가하였다. 텅스텐 폴리사이드막의 산화는 텅스텐 실리사이드층의 과잉(excess)Si가 초기 산화과정 동안 소모된 후에 다결정 실리콘층의 Si가 소모되었다. 산화막과 산화막을 식각(etching)한 후에 텅스텐 실리사이드막의 표면 거칠기는 다결정 실리?의 인 농도가 적을수록 평탄하였다.

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Enhancement and Quenching Effects of Photoluminescence in Si Nanocrystals Embedded in Silicon Dioxide by Phosphorus Doping (인의 도핑으로 인한 실리콘산화물 속 실리콘나노입자의 광-발광현상 증진 및 억제)

  • Kim Joonkon;Woo H. J.;Choi H. W.;Kim G. D.;Hong W.
    • Journal of the Korean Vacuum Society
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    • v.14 no.2
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    • pp.78-83
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    • 2005
  • Nanometric crystalline silicon (no-Si) embedded in dielectric medium has been paid attention as an efficient light emitting center for more than a decade. In nc-Si, excitonic electron-hole pairs are considered to attribute to radiative recombination. However the surface defects surrounding no-Si is one of non-radiative decay paths competing with the radiative band edge transition, ultimately which makes the emission efficiency of no-Si very poor. In order to passivate those defects - dangling bonds in the $Si:SiO_2$ interface, hydrogen is usually utilized. The luminescence yield from no-Si is dramatically enhanced by defect termination. However due to relatively high mobility of hydrogen in a matrix, hydrogen-terminated no-Si may no longer sustain the enhancement effect on subsequent thermal processes. Therefore instead of easily reversible hydrogen, phosphorus was introduced by ion implantation, expecting to have the same enhancement effect and to be more resistive against succeeding thermal treatments. Samples were Prepared by 400 keV Si implantation with doses of $1\times10^{17}\;Si/cm^2$ and by multi-energy Phosphorus implantation to make relatively uniform phosphorus concentration in the region where implanted Si ions are distributed. Crystalline silicon was precipitated by annealing at $1,100^{\circ}C$ for 2 hours in Ar environment and subsequent annealing were performed for an hour in Ar at a few temperature stages up to $1,000^{\circ}C$ to show improved thermal resistance. Experimental data such as enhancement effect of PL yield, decay time, peak shift for the phosphorus implanted nc-Si are shown, and the possible mechanisms are discussed as well.