• Korean Chemical Engineering Research
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• v.50 no.5
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• pp.894-899
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• 2012

In recent years, recycling process has come to be necessary for separating metals, glass fibers and polymer from WPCBs (waste printed circuit boards) due to an increasing amount of electronic device waste. In this study, dimethylformamide (DMF) and attrition mill reactor were used to separate the component such as metals, glass fiber and epoxy resin from WPCBs. Separation of glass fiber from WPCBs was carried out under stirring rates 300~600 revolution per minute (rpm) for 1~2 h as the various agitator. The recycled glass fibers (RGF) were analyzed by thermogravimetric analyzer (TGA) for degree of separation of epoxy resin in the WPCBs. The degree of separation of epoxy resin of WPCBs increased in attrition mill agitator as a mechanochemical process for recycling WPCBs. The RGF separated in the WPCBs was applied as a reinforcement in the RGF/unsaturated polyester composites to reuse as a reinforcement.

• Journal of the Microelectronics and Packaging Society
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• v.3 no.2
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• pp.27-38
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• 1996

Lithium fluorhectorite 결정상을 함유한 glass ceramics 분말의 형성과 제조된 glass ceramics 분말을 이용한 저온 소결기판의 특성평가를 하였다. Li2O-MgO-MgF2-SiO2 계 유 리로 핵형성 및 결정 성장을 실시하여 lithium fluorhectorite 결정상을 지닌 glass ceramics 를 제조하였다. 유리시편의 핵형성 온도는 46$0^{\circ}C$였고 결정성장온도는 600, 640, 110$0^{\circ}C$에서 나타났다. $600^{\circ}C$에서의 결정상으 Li2.4LiSi4O10F2가 나타났다. Li2.4Mg8LiSi4와 Li2.8Mg0.6SiO4은 lithium fluorhectorite 결정상으로 되기 위한 중간상임을 확인할수 있었다. 64$0^{\circ}C$에서 열처리 후 110$0^{\circ}C$에서 재열처리하여 형성된 결정은 lithium fluorhectorite 와 tridymite가 최종 결정 상으로 나타났다. 이것은 수중에서 water swelling 현상에 의하여 분말화할 수 있었다, 기판 제조용 slurry를 제조하기 위해 glass ceramics 분말에 Al2O3분말을 0,25,50wt%로 혼합한것 과 glass ceramics 분말에 potashborosilica-te glass 분말을 15, 30, 45, 60 wt% 로 배합하 여 doctor blade 법으로 green sheet를 제조하였다. green sheet 는 950~150$0^{\circ}C$로소성하여 기판의 특성을 평가하였다. 겉보기 기공율은 3.06~19,14%이었고, 전기적 특성으로 유전상수 는 3~5(100KHz)를 나타내었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.861-864
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• 2005

A LCD glass plate is supported by multi-pin and golf-tee type support. In the FEM analysis, the support condition is treated as simply supported boundary .condition. In this study, the optimization on the location of multi-simply support is conducted. The size optimization method of ANSYS 8.0 is used as the optimization tool to search for the optimal support location of LCD glass plate. In the manufacturing process, the support condition is a fatal factor of quality control of LCD production. From the results of optimization, deflection decreases 51% compared with the original model.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.423-427
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• 2017

In this paper, an anchor design that improves bonding strength uniformity in the silicon-on-glass (SOG) process is presented. The SOG process is widely used in conjunction with electrode-patterned glass substrates as a standard fabrication process for forming high-aspect-ratio movable silicon microstructures in various types of sensors, including inertial and resonant sensors. In the proposed anchor design, a trench separates the silicon-bonded area and the electrode contact area to prevent irregular bonding caused by the protrusion of the electrode layer beyond the glass surface. This technique can be conveniently adopted to almost all devices fabricated by the SOG process without the necessity of additional processes.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.1-10
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion (i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) were healed by the UV laser beam transmitted through the glass substrate. The lather energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, and formed a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• Journal of the Korean Ceramic Society
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• v.39 no.7
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• pp.675-679
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• 2002

To produce a strengthened glass, single ion exchange properties such as three-point bend strength and residual stress were investigated in soda-lime-silicate substrate glass for display use. The present work showed that the maximum value of strength was 62.5${\times}$10$\sub$6/ kg/㎡ after, the two-step single ion exchange process at 470$^{\circ}C$ for 1 h and 450$^{\circ}C$ for 24 h. As the result of the fracture analysis after bending test, the residual stress on the fractured surface of the strengthened glass increased the flexibility by means of absorbing the elastic deformation energy in the glass. Also, the effects of absorbing the elastic deformation energy were analysed by curvature change, number of multiple crack branches and brittleness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.05a
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• pp.246-249
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• 2005

The TFT-LCD is extensively used from a small watch to a large TV display, and the demand is increasing rapidly. The size of R-LCD glass plate becomes more bigger, and the thickness become more thinner with high demands. As a result natural frequency of the TFT-LCD glass plate becomes more lower. The TFT-LCD glass plate will be moved by robot arm and may receive effect of vibration that occur at transfer. Natural frequency of the TFT-LCD glass plate is increased or decrease according to location that robot arm fixs glass plate. Purpose of a this study is finding support location that optimize the first natural frequency of TFT-LCD glass plate. The size optimization method of ANSYS 8.0 is used as the optimization tool search on the optimal support location of TFT-LCD glass plate. The considered number of support point is from 4 to 9.

• Journal of the Korean Ceramic Society
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• v.38 no.7
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• pp.628-633
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• 2001

전자 패키징에 적용 가능한 저융점 유리 중에서 납성분이 포함되어 있지 않는 Bi계 유리의 연구를 행하였다. 기판과의 일체화를 위한 유리의 응용으로, 소자와의 반응 억제와 열응력 완화를 위해 유리의 저융점화 및 열팽창계수를 제어하였다. 본 연구에서 제조된 Bi계 유리는 DTA와 TMA의 열분석을 통해 5$50^{\circ}C$ 부근에서 연화점이 있고, 열팽창계수는 7.52~12.09$\times$$10^{-6}$/$^{\circ}C$의 범위였으며, 비유전율은 9~13이었다. 본 연구의 납성분을 포함되어 있지 않는 유리조성은 우수한 내산성을 나타내었다.

• Korean Chemical Engineering Research
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• v.58 no.3
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• pp.474-479
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• 2020

The etching solution for slimming of glass substrates was manufactured and HF was used as the main ingredient of wet etching solutions. Various types of strong acids such as HCl, HNO₃, H₂SO₄, amino acids and carboxylic acids such as citric acid, and etched solutions, respectively, were used to measure the etching rates and changes in surface shape of the glass. Regardless of the type of strong acids, the etching rate of the glass increased linearly as the added amount increased, and the sludge removal effect of the glass surface was also shown. The etching solution containing HCl showed more efficient results than other strong acids in the etching rate and the effect of removing sludge. The addition of carboxylic acid did not significantly affect the variation of etching rate, but had the effect of removing sludge. However, if amino acids were added, changes in etching rate and sludge removal were not significant.