• Title/Summary/Keyword: 온도프로파일

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A study on the evaluation and improvement of ICC e far domestic CRT color monitors (국산 CRT모니터 ICC 프로파일의 평가 및 개선에 관한 연구)

  • 김홍석;박승옥;정연우;김성현
    • Korean Journal of Optics and Photonics
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    • v.12 no.6
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    • pp.452-459
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    • 2001
  • ICC profiles of output devices are necessary to solve the problem of color inconsistency between output devices. Therefore, output device manufacturers are offering ICC profiles that encode each model\`s color characteristics according to the specification decided in ICC (International Color Consortium). In this study, a program that can decode data of ICC profile was composed and evaluated the present condition of ICC profile files of domestic CRT monitor. As a result of comparing the ICC profiles of various model\ulcorner selling since 1999 from LG and Samsung companies, it was found that ICC profiles that are made at a similar time are the same regardless of model\`s specification and in some profiles, extraordinary data are saved. Accordingly, it can be said that current ICC profiles are made independently of the real monitor\`s color characteristics. This paper shows how color characteristics of a real monitor are affected by the control of brightness and color temperature, and proposes that the ICC profile has to be made from the data. measured in the optimum brightness state at each color temperature setting.

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Understanding of the effect of charge size to temperature profile in the Czochralski method (쵸크랄스키법에서 온도 프로파일에 대한 충진사이즈의 효과에 대한 이해)

  • Baik, Sungsun;Kwon, Sejin;Kim, Kwanghun
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.28 no.4
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    • pp.141-147
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    • 2018
  • Solar energy has attracted big attentions as one of clean and unlimited renewable energy. Solar energy is transformed to electrical energy by solar cells which are comprised of multi-silicon wafer or mono-silicon wafer. Monosilicon wafers are fabricated from the Czochralski method. In order to decrease fabrication cost, increasing a poly-silicon charge size in one quartz crucible has been developed very much. When we increase a charge size, the temperature control of a Czochralski equipment becomes more difficult due to a strong melt convection. In this study, we simulated a Czochralski equipment temperature at 20 inch and 24 inch in quartz crucible diameter and various charge sizes (90 kg, 120 kg, 150 kg, 200 kg, 250 kg). The simulated temperature profiles are compared with real temperature profiles and analyzed. It turns out that the simulated temperature profiles and real temperature profiles are in good agreement. We can use a simulated profile for the optimization of real temperature profile in the case of increasing charge sizes.

A Dual Integer Register File Structure for Temperature - Aware Microprocessors (온도 인지 마이크로프로세서를 위한 듀얼 레지스터 파일 구조)

  • Choi, Jin-Hang;Kong, Joon-Ho;Chung, Eui-Young;Chung, Sung-Woo
    • Journal of KIISE:Computer Systems and Theory
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    • v.35 no.12
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    • pp.540-551
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    • 2008
  • Today's microprocessor designs are not free from temperature as well as power consumption. As processor technology scales down, an on-chip circuitry increases power density, which incurs excessive temperature (hotspot) problem. To tackle thermal problems cost-effectively, Dynamic Thermal Management (DTM) has been suggested: DTM techniques have benefits of thermal reliability and cooling cost. However, they require trade-off between thermal control and performance loss. This paper proposes a dual integer register file structure to minimize the performance degradation due to DTM invocations. In on-chip thermal control, the most important functional unit is an integer register file. It is the hotspot unit because of frequent read and write data accesses. The proposed dual integer register file migrates read data accesses by adding an extra register file, thus reduces per-unit dynamic power dissipation. As a result, the proposed structure completely eliminates localized hotspots in the integer register file, resulting in much less performance degradation by average 13.35% (maximum 18%) improvement compared to the conventional DTM architecture.

Measurement System of the Transverse Temperature Profile of Hot Rolled Strip (열간압연공정에서의 스트립 폭방향온도 모니터링시스템 개발)

  • Lee, Sung-Jin
    • Proceedings of the KSME Conference
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    • 2001.06c
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    • pp.197-201
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    • 2001
  • Output and cost efficiency in the production of hot-rolled strip depend to a large content on the uniformity of geometric and mechanical properties over the length and width of the rolled end product. To ensure the homogeneous temperatures required for this during the rolling process a system to measure and evaluate the transverse temperature profile was developed and implemented in production. The systems used consist of temperature scanners and computers for measurement and data evaluation. The systems have been installed in Kwangyang hot strip mills, in the cases at the exit of the finishing train and at the entry of the coiler. They are used in production to determine the effect of the finishing train and the cooling zone on the technological properties of the hot rolled strip.

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A Study on the Lunar Ground Temperature Profile for Investigation of Possible Condition of the Ice Layer Existence in Sub-surface of the Moon (달 지하 얼음 층 존재 가능조건 검토를 위한 달 지반 온도 프로파일 산정 연구)

  • Go, Gyu-Hyun;Lee, Jangguen;Shin, Hyu-Soung
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.39 no.6
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    • pp.801-809
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    • 2019
  • NASA's lunar polar exploration mission in 2009 confirmed the presence of ice-layer in the permanently shadowed regions (PSR) of the moon. Since then, studies have been actively conducted to evaluate the ground characteristics for exploring the ice-layer in the polar regions of the Moon. In this study, transient heat transfer analysis for the lunar ground was conducted to predict the ground's temperature that varies with the time and location. As a result of the numerical analysis, it was confirmed that the temperature under the lunar ground converged to below the ice sublimation reference temperature (≒112 K) at above 86° latitude. This model enabled us to identify the regions where there is a high possibility of ice being buried. Besides, we found that the ice-layer in the shallow region, where the temperature deviation is significant, makes ground temperature distribution heterogeneous. Lastly, this study suggested the maximum allowable frictional heat of a drill bit that can preserve the phase of buried ice.

A study on boron and phosphrous doping profile by RTA using 1MeV high energy ion implantaiton (1MeV 고에너지로 붕소(boron)와 인(phosphorus)을 이온주입 시급속 열처리에 따른 도핑 프로파일)

  • 강희원;전현성;노병규;조소행;김종규;김종순;오환술
    • Proceedings of the IEEK Conference
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    • 1998.06a
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    • pp.331-334
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    • 1998
  • p형 실리콘 기판위에 100.angs.의 초기 산화막을 성장시킨 후 붕소(B)와 인(P)을 1MeV 이온주입 에너지로 4.dec. tilting하여 붕소의 도즈량은 1*10/녀ㅔ 13/[cm/sup -2/]까지, 인은 1*10/sup 13/[cm/sup -2]로부터 1*10/sup 14/[cm/sup -2/] 까지 변화시키며 이온 주입하였다. 이온주입 후 RTA 로서 열처리 하였으며, 열처리 시간은 10초에서 40초까지,열처리 온도를 1000.deg.C에서 1100.deg.C까지 변화하였다. 이후 기파낸의 불순물의 프로파일 및 미세 결함의 분포를 분석하기 위하여, SIMS, SRP, XTEM 분석을 실시하였고, 이를 monte-carlo 모ㅓ델로서 시뮬레이션하여 비교하였다. SIMS 분석 결과 열처리 온도와 시간이 증가할수록 접합깊이가 증가하였고, 프로파일이 넓어짐을 볼수 있다. SRP 측정에서 붕소는 주해거리 (Rp)값은 1.8.mu.m~1.9.mu.m, 인의 경우는 1.1.mu.m~1.2.mu.m의 주행거리 (Rp) 값이 나타났다. XTEM 분석결과 붕소의 경우 열처리에 전후에도 결함을 볼수 없었고, 인의 경우 열처리 이후에 실리콘 결정내부에 있던 산소(O)와 인(P)우너자의 pinning효과에 의해 전위다이폴을 형성하여 표면근처로 성장함을 볼수 있었다.

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A Study on User Profile Management Method for User Preference based Home Network Service (사용자 선호도 기반 홈네트워크 서비스를 위한 사용자 프로파일 관리 기법)

  • Lee, Eun-Seo;Jang, Jong-Hyun;Han, Dong-Won
    • Proceedings of the Korea Information Processing Society Conference
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    • 2009.11a
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    • pp.305-306
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    • 2009
  • 본 논문에서는 홈네트워크 서비스 환경에서의 사용자 맞춤형 디바이스 제어 솔루션을 제공하기 위해 디바이스 제어와 관련된 사용자 선호도 스키마를 정의하고, 이를 기반으로 한 프로파일 관리 기법을 제시하였다. 나이, 성별, 직업 등과 같은 사용자 개인정보에 대한 스키마와 향기, 온도, 조명, 바람 등에 대한 선호도 스키마를 포함하는 가전 디바이스 제어와 관련된 다양한 요소들에 대한 스키마를 XML로 정의하였으며, 사용자의 인터랙션이나 프로파일 정보 입력을 통해 사용자 선호도 정보를 획득하여, 단방향의 수동적인 단일 디바이스 제어가 아닌 여러 개의 디바이스를 최적으로 제어할 수 있는 사용자 맞춤형 홈서비스 환경을 제시하였다.

Adaptive Color Correction Method to Monitor in Color Laser Printer (모니터에 적응적인 칼라 레이저 프린터의 색 변환 방법)

  • Jang, In-Su;Son, Chang-Hwan;Kim, Kyung-Man;Ha, Yeong-Ho
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.47 no.4
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    • pp.63-68
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    • 2010
  • The Color Management System in recent printers adopts ICC profiles for both monitors and printers. However, the ICC profile doesn't contain the characteristics of reproduced color on each monitor, because the color on each monitor is changed by user adjustment such as color temperature, brightness, and contrast adjustment. It is also depended on the backlight type and lifetime. As a result, unwanted color is reproduced on the printed paper, not like that on the monitor. To overcome the color difference between monitors and printers, it is needed to control the information of ICC profile. That is, first, the ICC profile is generated by the measurement of monitors having user set, then, through the CMS, the color on monitors can be produced on printed paper. However, it is difficult to apply the above system for normal users due to absence of measuring equipment and time consuming process. Therefore, this paper proposes a novel color matching technique based on the estimation of condition for each monitor having user set. The estimation is performed by a simple comparison visual test using a test image on printed paper and monitor. Then, the condition of monitor is applied to the ICC profile. As a result, the new ICC profile contains the color difference between user monitor and printer. The experimental results show the printed images using our proposed method have almost similar color with those on monitors.

PID controller design for profile of the RTP system (RTP시스템의 프로파일작성을 위한 PID제어기 설계)

  • Hong, Sung-Hee;Choi, Soo-Young;Park, Ki-Heon
    • Proceedings of the KIEE Conference
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    • 2000.07d
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    • pp.2548-2550
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    • 2000
  • RTP(Rapid Thermal Processing)은 IC제조 공정과 관련된 열처리 과정에 사용되는 단일 웨이퍼프로세스 기술이다. 반도체 웨이퍼를 고속 열처리할 때 웨이퍼별로 작은 반응실에서 가열, 가공, 냉각된다. 현재 사용되는 반도체 열처리장비는 고온로(furnace)에의해 대부분 이루어지지만, 시간이 많이 걸려서 주문형반도체 생산과 같은 다양한 종류의 웨이퍼를 소량 생산하는데는 부적절하다. 이에 매우 적은 시간이 소요되는 RTP장비가 많이 연구되고 있다. 그러나 RTP는 예기치 못한 몇 가지의 문제점을 일으킨다. 그중 하나는 웨이퍼 표면에 분포된 온도의 불 균일성이다. 이러한 불 균일성은 웨이퍼의 표면에 심각한 왜곡(distortion)을 일으켜 좋지 못한 결과를 가져오게 한다. 이번 논문의 목적은 RTP시스템을 수학적으로 모델링하고, 이를 이용하여 멀티 램프 시스템의 입력값을 조절하여 이미 배치된 램프에 대한 최적의 온도 균일도에 알맞은 각 램프입력을 구하여 램프 입력 프로파일을 만들고 또한 이를 이용하여 외란에 대한 PID 제어기 설계를 목표로 한다.

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