Development of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic Model (등가 이방성 점탄성 모델 기반 열 응력에 따른 휨 해석 기법 개발)
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- Journal of the Microelectronics and Packaging Society
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- v.29 no.3
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- pp.43-48
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- 2022