• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.454-455
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• 2007

송전용 자기 애자에 대하여 산물화염 특성과 송전선로의 환경 검토를 토대로 송전용 절연물에 대한 산불화염 열화특성을 1)내열충격 열화와 2) 열충격 싸이클 열화로 나누어 가속시킨 후 절연물의 성능을 시험 평가하였다. 또한 승전용 자기애자 (254mm, 36,000lbs)를 대상으로 실제 삼불열화 조건을 근간으로 기계적, 열적 환경을 고려한 자기애자의의 수축, 팽창 변위에 따른 계면의 응력거동을 열충격 및 내열충격 시험의 결과와 비교 분석하였다.

• Composites Research
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• v.27 no.3
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• pp.83-89
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• 2014

The purpose of this study is to improve the strength and thermal conductivity of polybutylene terephthalate (PBT) by embedding various additives. Specimens were prepared using PBT pellets embedded with glass fibers (GF) and boron nitride (BN) powders. The test results showed that tensile strength decreased, and thermal conductivity increased with increasing BN contents. with thermal shock cycles conducted, unfilled PBT showed a considerable decrease in failure strain and strength, whereas strength and thermal conductivity of glass fiber and BN particle-embedded PBT had little differeces. With increasing BN, the thermal conductivity of PBT composites was highly improved.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.217-217
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• 2003

W-Cu 합금은 우수한 전기적, 열적 특성으로 인하여 열소산재료(Heat sink)로 많이 응용되고 있다. 첨단 전자부품 이외에도 핵융합로의 Diverter가 그 예로서, 내부는 고강도와 고융점의 특성을 요구하는 반면, 외부는 높은 열전도성을 필요로 한다. 그래서 동일한 조성의 일반적인 W-Cu 합금보다 W과 Cu의 조성이 점차적으로 변화하는 경사기능재료(Functionally Graded Materials)가 냉각효율이 클 것으로 기대된다. 현재, W-Cu FGM에 대한 많은 연구가 진행되고 있지만, 그 조성이 연속적으로 변화하는 W-Cu FGM에 대한 연구는 전무한 실정이다 본 연구에서는 방전플라즈마 소결장치(Spark Plasma Sintering System)와 용침고정을 이용하여 연속적인 조성변화를 갖는 W-Cu FGM을 제조하고 그 특성에 관해 분석하고자 하였다. 소결체가 밀도 변화를 갖게 되도록 제작한 특수 경사기능 몰드에 W분말을 장입한 후, 15㎬의 압력하에서 SPS를 이용하여 W소결체를 제조하였다. 제조된 W소결체는 수평관상로에서 수소분위기 하에 Cu 용침을 실시하여 W-Cu FGM을 제조하였다 SEM을 이용한 각 위치별 조직관찰과 Image Analyzer를 이용한 W과 Cu의 면적비, 그리고 비커스경도계에 의한 경도 측정을 실시하였다. 또 열기계적 분석기를 이용하여 측정된 선팽창률로부터 열팽창계수를 구하였다. 80$0^{\circ}C$에서 ？칭하는 반복적인 싸이클을 통해 열충격시험을 실시하였고, Laser flash method로 열확산계수를 측정하였다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.35-40
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• 2010

In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.

• Composites Research
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• v.30 no.2
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• pp.84-93
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• 2017

This study investigates thermal and mechanical characterization of environmental barrier coating on the $SiC_f-SiC$ composites. The spherical environmental barrier coating (EBC) powders are prepared using a spray drying process for flowing easily during coating process. The powders consisting of mullite and 12 wt% of Ytterbium silicate are air plasma sprayed on the Si bondcoat on the LSI SiC fiber reinforced SiC composite substrate for protecting the composites from oxidation and water vapor reaction. We vary the process parameter of spray distance during air plasma spray of powders, 100, 120 and 140 mm. After that, we performed the thermal durability tests by thermal annealing test at $1100^{\circ}C$ for 100hr and thermal shock test from $1200^{\circ}C$ for 3000 cycles. As a result, the interface delamination of EBC never occur during thermal durability tests while stable cracks are prominent on the coating layer. The crack density and crack length depend on the spray distance during coating. The post indentation test indicates thermal tests influence on the indentation load-displacement mechanical behavior.

• Composites Research
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• v.32 no.3
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• pp.148-157
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• 2019

In this study, $C_f/SiC$, $SiC_f/SiC$ and $C_f-SiC_f/SiC$ ceramic composites reinforcing carbon fiber, SiC fiber and hybrid fiber were fabricated by hybrid TGCVI and PIP process. After the thermal shock cycle, 3-point bending and Oxy-Acetylene torch test, their mechanical behavior, oxidation and erosion resistance were evaluated. The $C_f/SiC$ composite showed a decrease in mechanical property along with increasing temperature, a pseudo-ductile fracture mode and a large quantity of erosion. The $SiC_f/SiC$ composite exhibited stronger mechanical property and lower erosion rate compared to the $C_f/SiC$, but brittle fracture mode. On the other hand, hybrid type of $C_f-SiC_f/SiC$ composite gave the best mechanical property, more ductile failure mode than the $SiC_f/SiC$, and lower erosion rate than the $C_f/SiC$. During the Oxy-Acetylene torch test, the $SiO_2$ formed by reaction of the SiC matrix with oxygen prevented further oxidation or erosion of the fibers for $C_f-SiC_f/SiC$ and $SiC_f/SiC$ composites particularly. In conclusion, if a hybrid composite with low porosity is prepared, this material is expected to have high applicability as a high temperature thermo-structural composite under high temperature oxidation atmosphere by improving low mechanical property due to the oxidation of $C_f/SiC$ and brittle fracture mode of $SiC_f/SiC$ composite.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.