• 제목/요약/키워드: 열접촉저항

검색결과 13건 처리시간 0.023초

사출금형의 열접촉 저항을 고려한 성형과정의 열-유동 연계해석 (Thermal-Fluid Coupled Analysis for Injection Molding Process by Considering Thermal Contact Resistance)

  • 손동휘;김경민;박근
    • 대한기계학회논문집A
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    • 제35권12호
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    • pp.1627-1633
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    • 2011
  • 사출금형은 일반적으로 다수개의 부품을 조립하여 제작되며, 특히 성형부(Core/Cavity)가 금형 형판 내부에 조립되는 구조를 갖는다. 이러한 구조로 인해 금형 조립부 경계면에서는 열접촉 저항이 발생하여 금형 내부의 열전달 특성에 영향을 미치게 된다. 최근 금형의 열접촉 저항이 성형부의 온도분포에 미치는 영향을 수치적으로 예측하기 위한 선행연구가 수행되었으며, 본 연구에서는 이에 기반하여 열-유동 연계해석을 적용함으로써 금형 내부의 열접촉 저항이 사출성형시 유동특성에 미치는 영향을 분석 하였다. 상기 해석결과와 실험결과와의 비교분석을 통해 금형의 열접촉 저항을 고려한 열-유동 연계해석이 기존의 해석방법과 비교할 때 사출성형 유동특성을 보다 향상된 신뢰성으로 예측할 수 있음을 확인하였다.

열접촉 저항의 이론적 해석

  • 김철주
    • 기계저널
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    • 제26권3호
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    • pp.200-203
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    • 1986
  • 본 해설에서는 이론적 해석의 접근방법을 통하여 열접촉 저항의 기본적인 구조를 이해하는데 목적을 두었으며, 여러형태의 이론적 모델중에서 비교적 단순한 Cetinkale & Fishenden 의 연구 결과를 이용하여 이 모델에 포함된 각 인자들을 실제표면에 대해 어떻게 적용하는가를 검토하 였다.

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탄소성접촉면의 나노스케일 열접촉저항 (Thermal contact resistance on elastoplastic nanosized contact spots)

  • 이상영;조현;장용훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2214-2219
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    • 2008
  • The thermal contact resistance(TCR) of nanosized contact spots has been investigated through a multiscale analysis which considers the resolution of surface topography. A numerical simulation is performed on the finite element model of rough surfaces. Especially, as the contact size decreases below the phonon mean free path, the size dependent thermal conductivity is considered to calculate the TCR. In our earlier model which follows an elastic material, the TCR increases without limits as the number of nanosized contact spots increases in the process of scale variation. However, the elastoplastic contact induces a finite limit of TCR as the scale varies. The results are explained through the plastic behavior of the two contacting models. Furthermore, the effect of air conduction in nanoscale is also investigated.

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주사탐침열파현미경을 이용한 1 차원 나노구조체의 정량적 열전도도 계측기법 (Quantitative Method to Measure Thermal Conductivity of One-Dimensional Nanostructures Based on Scanning Thermal Wave Microscopy)

  • 박경배;정재훈;황광석;정의한;권오명
    • 대한기계학회논문집B
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    • 제38권12호
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    • pp.957-962
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    • 2014
  • 본 연구에서는 나노스케일의 공간 해상도를 가지는 주사탐침열파현미경(scanning thermal wave microscopy, STWM)을 이용하여 1 차원 나노구조체의 열전도도를 정량적으로 계측하는 방법을 제시한다. 먼저, 1 차원 나노구조체의 열확산도를 계측하기 위한 STWM 의 원리를 설명한 후, 정량적인 열확산도 계측을 위한 이론적 해석 과정을 설명한다. STWM 을 이용한 본 계측기법은 열파가 이동한 거리에 따른 상대적인 위상지연만을 가지고 열확산도를 계측하여 열전도도를 구하기 때문에 탐침과 나노구조체 사이의 열접촉저항 및 나노구조체와 열원간의 열접촉저항의 영향을 받지 않으며, 나노구조체에 인가되는 정확한 열유속을 구할 필요가 없다. 따라서 기존의 측정 기법들에 비해 계측이 매우 단순하면서도 정량적인 계측이 가능하다.

원통결합부의 열특성 최적설계를 위한 예측 시뮬레이션 방법 (Simulation Method for Thermal appropriate Desing of Compound Cylinder using Bondgraph Modeling)

  • 민승환;박기환;이선규
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 춘계학술대회 논문집
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    • pp.635-640
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    • 1996
  • A thermo-elastic system in the production machine has highly nonlinear dynamic characteristics. In general, the finite element method is utilized for accurate analysis. However, it requires large computing time. Thus, thermo-elastic systems are usuallymodeled as electric and fluid system using lumped para,eter. In this paper. we propose the bondgraph model and transient simulation methodology of thermo-elastic system in consideration of various boundary and joint contact conditions. Consequently, the proposed method ensures a possibility of its on-line compensation about undesirable phenomena by using real time estimate process and electronic cooling device for thermal appropriate behavior. Thermo-elastic model consisting of bush and shaft including contact condition is presented.

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탄성기반에서 과도 열탄성 접촉에 대한 열 접촉 저항의 영향 (Effect of Thermal Contact Resistance on Transient Thermoelastic Contact for an Elastic Foundation)

  • 장용훈;이승욱
    • 대한기계학회논문집A
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    • 제30권7호
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    • pp.833-840
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    • 2006
  • The paper presents a numerical solution to the problem of a hot rigid indenter sliding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed, regardless of the thermal contact resistance. However the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady state, the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient, the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger numbers of small contact areas are established, unlit eventually the accuracy of the algorithm is limited by the discretization used.

금속의 평면 접촉면에서 표면부식에 의한 열접촉 저항의 변화 (Variation of Thermal Contact Resistance for a Corroded Plane Interface of Metals)

  • 김철주;김원근
    • 설비공학논문집
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    • 제3권4호
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    • pp.256-262
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    • 1991
  • The corrosion effects on thermal contact resistance were experimentally studied for a given contact interface of a couple of metals. 2 cylindrically shaped test pieces, the one was carbon steel whose surface was machined by lathe and the other was stainless steel, ground, were come into contact under pressure, and then submerged to $HNO_3$ gas environment. While the corrosion process was going on, the thermal contact resistance was measured with time. The experiment was performed for 2 cases; 1) Highly compress the test pieces and then bring them to $HNO_3$ gas environment. 2) Anteriorly corrode the interface under low contact pressure and then increase the contact pressure. The results were as follows; In 1st. case of experiment, the thermal contact resistance seemed to be very stable, and showed low values with a tendancy of small decrease with time. But in 2nd. case the resistance was unstable and jumped to a value of 200-250% more then that expected for uncontaminated interface. More over it demonstrated some increase with time.

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전기 엎셋팅 가공시의 온도분포에 관한 연구 (A Study on the Temperature Distribution of Materials Due to Electric Upsetting Forming)

  • 왕지석;박태인
    • Journal of Advanced Marine Engineering and Technology
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    • 제18권3호
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    • pp.1-9
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    • 1994
  • The transient temperature distribution of materials during upsetting forming is very important for quality of upsetted workpiece and understanding the thermal characteristics of upsetting is essential for optimum control of the forming. In this paper it is shown that the governing equation of heat transfer for axi-symetric body can be derived from minimizing a functional, and from this theory, formulation of analysis by the finite element method is presented. It is also shown that the thermal contact resistance between two bodies can be represented by equivalent coefficient of heat conductivity. Some examples of calsulated transient temperature distributions by the computer program diveloped from the theory presented in this paper are given in graphic forms. It is proven that the results calculations are very plausible.

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전자소자의 평면 접촉계면에 대한 열전도성 향상에 관한 연구 (A Study on the Thermal Enhancement for a Plane Contact Interfaces of Electronic Systems)

  • 홍성은;이수영;김철주
    • 에너지공학
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    • 제8권2호
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    • pp.272-278
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    • 1999
  • 본 연구에서는 지름 30mm, 길이 45mm인 brass와 aluminium 원통 실린더의 접촉면이 ⅰ) 진공 상태에 있을 때 , ⅱ) silicone grease를 충전하였을 때 , ⅲ) silicone grease와 aluminium 분말 (#325) 혼합물을 충전하였을 때의 열접촉저항을 측정하였고, 그 결과를 Fouche 의 해석 모델과 비교하였다. 진공상태에서 비접촉면의 열접촉저항은 표면의 가공 상태에 따라 (2~100)$\times$$10^{-5}$($m^2$$^{\circ}C$/W)의 분포를 나타내었고 접촉 표면을 연마하였을 때에는 거친 표면에 비하여 약 30~50%의 열접촉저항저감을 나타내었다. 그러나, silicone grease를 충전했을 때에는 열접촉저항 값이 약 5~10정도 감소하는 경향을 나타내었다. Fouche 모델을 이용한 해석 결과는 silicone grease로 충전한 접촉면에 대해서 각 10~30%범위에서 아주 잘 일치하였다.

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Micro-Channel형 열교환기에 부착된 핀의 열접촉저항이 열전달 특성에 미치는 영향 (Effect of Thermal Contact Resistence on the Heat Transfer Characteristics of Air Flow around the Finned Micro-Channel Tube for MF Evaporator)

  • 박용석;성홍석;성동민;서정세
    • 한국기계가공학회지
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    • 제20권11호
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    • pp.121-126
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    • 2021
  • In this study, the effect of thermal contact resistance between pin-channel tubes on the heat transfer characteristics was analytically examined around the channel tubes with the pins attached to two consecutive arranged channel pipes. The numerical results showed that the heat transfer coefficient decreased geometrically as the thermal contact resistance increased, and the corresponding temperature change on the contact surface increased as the thermal contact resistance increased. The thinner the pin, the more pronounced the geometric drop in the heat transfer coefficient. It was confirmed that the higher the height of the pin, the higher was the heat transfer coefficient, however, the greater the size of the thermal contact resistance, the smaller was the heat transfer coefficient. It was found that the temperature change in the inner wall of the channel tube did not significantly affect the heat transfer characteristics owing to the thermal contact resistance. Furthermore, the velocity of air at the entrance of the channel tube was proportional to the heat transfer coefficient due to a decrease in the convective heat resistance corresponding to an increase in the flow rate.