• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.254-259
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• 2005

In this study, measurement of thermal conductivity of multilayer thin dielectric film has been conducted via differential 3$\omega$ method. Also, verification of differential 3$\omega$ method has been accomplished with various proposed criteria. The target film for measurement is 300 nm silicon dioxide and this thin film is covered with various thicknesses of upper protective layer. The upper protective layer is inserted between the target film and the heater line for purpose of electrical insulator or anti-oxidation barrier since the target film may be a good electrical conductor or a well-oxidizing material. However, the verification of differential 3$\omega$ method has not been conducted. Thus we have shown that the measurement of thermal conductivity of thin films with upper protective layer via differential 3$\omega$ method is verified to be reliable as long as the proposed preconditions are satisfied. Experimental results show that the experimental errors tend to increase with aspect ratio between upper protective layer thickness and width of the heater line due to heat spreading effect.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1370-1375
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• 2004

This article investigates the heat transfer characteristics in a RTA system for LCD manufacturing and suggests a way to evaluate the quality of a poly-Si film from the thin film optics analysis. The transient and one-dimensional conductive/radiative heat transfer equation considering wave interference effect is solved to predict surface temperatures of thin films. In dealing with radiative heat transfer, a one-dimensional two-flux method is used and the ray tracing method is also utilized to account for the wave interference effects. It is assumed that each interface is assumed diffusive but the spectral radiative properties are included. It is found that the selective heating region exists for various wavelengths and consequently may contribute to heat the poly-Si film. Using the formalism of the characteristic transmission matrix, the lumped structure reflectance, transmittance, and absorptance are calculated and they are compared with experimental data of the poly-Si film during the SPC process via the FE-RTA (Field-Enhanced RTA) technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.142-142
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• 2007

Micro thermoelectric generator has been attractive for the alternative power source to operate the wireless sensor node. In this paper, we designed the column-type micro thermoelectric device and their device characteristics were measured. n-type Bi2Te3 and p-type BiSbTe3 thermoelectric thin films were grown on (001) GaAs substrates by metal organic chemical vapour deposition (MOCVD) and they were pattemed. The height of thermoelectric film were controlled by the deposition time, temperature and MO-x gas pressure. Seebeck coefficient was measured at room temperature and hole concentration and electrical resistivity of thermoelectric film were also characterized.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.138-139
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• 2006

Metal organic chemical vapor deposition has been investigated for growth of $Sb_{2-x}Bi_xTe_3$ films on (001) GaAs substrates using diisopropyltelluride, triethylantimony and trimethylbismuth as metal organic sources. The thermoelectric properties were measured at room temperature and include Seebeck coefficient, electrical conductivity and Hall effect. In-plane carrier concentration and electrical Hall mobility were highly dependent on precursor's composition ratio and deposition temperature. The thermoelectric Power factor($={\alpha}^2{\sigma}$) was calculated from theses properties. The best Power factor was $2.6\;{\times}\;10^{-3}W/mK^2$, given by grown $Sb_{1.6}Bi_{0.4}Te_3$ at $450^{\circ}C$. These materials could potentially be incorporated into advanced thermoelectric unicouples for a variety of power generation applications.

• Transactions of the Society of Information Storage Systems
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• v.2 no.1
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• pp.85-90
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• 2006

In this study, measurement of thermal conductivity of multilayer thin dielectric film has been conducted via differential $3\omega$ method. Also, verification of differential $3\omega$ method has been accomplished with various proposed criteria. The target film for the measurement is 300 nm thick silicon dioxide which is covered with upper protective layer of various thicknesses. The upper protective layer is inserted between the target film and the heater line for purpose of electrical insulator or anti-oxidation barrier since the target film may be a good electrical conductor or a well-oxidizing material. Since the verification of differential $3\omega$ method has not been conducted yet, we have shown that the measurement of thermal conductivity of thin films with upper protective layer via differential $3\omega$ method is verified to be reliable as long as the proposed preconditions of the samples are satisfied. Experimental results show that the experimental errors tend to increase with aspect ratio between thickness of the upper protective layer and width of the heater line due to heat spreading effect.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.445-448
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• 2010

For an enhanced thermoelectric performance, one-dimensional heterostructure nanowires were created that consisted of aBi core and Te shell. The structure was fabricated by depositing Te in-situ onto a Bi nanowire grown by our unique OFF-ON (on-film formation of nanowires) method. After examining a cross-sectional TEM image, it was found that diffusive interface was formed between Bi and Te. Selected area electron diffraction revealed that the crystallinity of the Te shell was some what lower compared to the highly single-crystalline Bi core. The Bi-Te core/shell nanowires can be a smart structure that suppresses phonon transport by several scattering mechanisms, making the OFF-ON method the simplest way to realize that structure.

• Journal of the Korean Society for Precision Engineering
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• v.9 no.2
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• pp.52-60
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• 1992

In this study on the development of the heat flux sensor, unlike the common heat-flux sensor with thermocouple, the heat-treated adhesive-tupe film nickel-gauge was used in measuring temperature. The proposed its Ni-gauge is bound to be compatible with platinum gauge(Pt-Gauge) in its linearity. It is also considered to be cheap in economical sense. In the evaluation of it's performance, the numerical analysis is essential to investigate charateristics of proper sensor and the adequate analsis is depended upon boundary conditions and actual conditions. There are many types of heat flux sensor in the market, and adhexive type flux sensor is most common. In the present investigation, this type of heat flux sensor had been chosen. The figure of the sensor under consideration is an open cavity type, which is calculated numerically by SIMPLER algorithm. The temperature distributions of the sensor predicted by numerical calculation for steady and unsteady states are able to give the chacteristics of the adhesive type heat flux sensor(1st heat flux sensor) according to the heat flux. It means that the outvoltage, the sensitivity, and the performances of responsibility could be evaluated as a result. Through this analysis improved heat flux sensor(2nd heat flux sensor) could be predicted with the reflection of proper operating temperature($150^{\circ}C$) of the Ni-gauge.

• Korean Journal of Materials Research
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• v.21 no.4
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• pp.192-195
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• 2011

The electro-deposition of compound semiconductors has been attracting more attention because of its ability to rapidly deposit nanostructured materials and thin films with controlled morphology, dimensions, and crystallinity in a costeffective manner (1). In particular, low band-gap $A_2B_3$-type chalcogenides, such as $Sb_2Te_3$ and $Bi_2Te_3$, have been extensively studied because of their potential applications in thermoelectric power generator and cooler and phase change memory. Thermoelectric $Sb_xTe_y$ films were potentiostatically electrodeposited in aqueous nitric acid electrolyte solutions containing different ratios of $TeO_2$ to $Sb_2O_3$. The stoichiometric $Sb_xTe_y$ films were obtained at an applied voltage of -0.15V vs. SCE using a solution consisting of 2.4 mM $TeO_2$, 0.8 mM $Sb_2O_3$, 33 mM tartaric acid, and 1M $HNO_3$. The stoichiometric $Sb_xTe_y$ films had the rhombohedral structure with a preferred orientation along the [015] direction. The films featured hole concentration and mobility of $5.8{\times}10^{18}/cm^3$ and $54.8\;cm^2/V{\cdot}s$, respectively. More negative applied potential yielded more Sb content in the deposited $Sb_xTe_y$ films. In addition, the hole concentration and mobility decreased with more negative deposition potential and finally showed insulating property, possibly due to more defect formation. The Seebeck coefficient of as-deposited $Sb_2Te_3$ thin film deposited at -0.15V vs. SCE at room temperature was approximately 118 ${\mu}V/K$ at room temperature, which is similar to bulk counterparts.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.425-425
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• 2008

Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3mW is obtained at the temperature difference of 45K. We provide a promising approach for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which can employ nanostructures for high thermoelectric properties.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.23 no.5
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• pp.567-576
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• 1999

An experimental study has been conducted to investigate the effects of the free stream turbulence intensity and Reynolds number on the heat transfer and flow characteristics In the linear turbine cascade. Profiles of the time-averaged velocity, turbulence intensity, and Reynolds stress were measured in the turbine cascade passage. The static pressure and heat transfer distributions on the blade suction and pressure surfaces were also measured. The experiments were made for the Reynolds number based on the chord length, Rec = $2.2{\times}10^4$ to $1.1{\times}10^5$ and the free stream turbulence intensity, $FSTI_1$ = 0.6% to 9.1 %. The uniform heat flux boundary condition on the blade surface was created using the gold film Intrex and the surface temperature was measured by liquid crystal, while hot wire probes were used for the flow measurements. The results show that the free stream turbulence promotes the boundary layer development and delays the flow separation point on the suction surface. It was found that the boundary layer flows on the suction surface for all Reynolds numbers tested with $FSTI_1$ = 0.6% are laminar. It was also found that the heat transfer coefficient on the blade surface increases as the free stream turbulence intensity increases and the flow separation point moves downstream with an increasing Reynolds number. The results of skin friction coefficients are in good agreement with the heat transfer results in that for $FSTI_1{\geq}2.6%$, the turbulent boundary layer separation occurs.