• Journal of the Korean Wood Science and Technology
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• v.41 no.6
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• pp.515-527
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• 2013

Building energy simulations which are mainly used in Korea have evaluated the building energy performance with the different thermal conductivity of construction materials. In order to evaluate the energy consumption accurately, the difference in thermal conductivity of the wood used in stud for wooden structure was confirmed from the each simulation. In addition, the thermal transmission of building members and the thermal bridge at the conjunction of building members according to thermal conductivity from each simulation programs were researched. The thermal conductivity of pine that has the largest variation among the energy simulations was applied to the thermal properties of studs in wooden structure. The maximum error between the maximum and minimum thermal transmission of roof, wall, and floor slab was $0.023W/m^2{\cdot}K$. Plus, that thermal bridge at Rafter junction on the roof, roof-wall joint, and floor slab-wall joint was $0.025W/m{\cdot}K$. The heat transfer image for changes in temperature and the heat exchange were analyzed by HEAT2 program. The distorted temperature lines were found around the insufficient insulated connection parts. It was predicted that the temperature at the distorted parts in the analyzed image was lower than that of the other portion of the other structures.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2182-2187
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• 2007

The relative contributions of phonon and electron to the thermal conductivity of silicon film with varying doping density are evaluated from the modified electron-phonon interaction model, which is applicable to the micro/nanoscale simulation of energy transport between energy carriers. The thermal conductivities of intrinsic silicon layer thicknesses from 20 nm to 500 nm are calculated and extended to the variation in n-type doping densities from 1.0 ${\times}$ $10^{18}$ to 5.0 ${\times}$ $10^{20}$ $cm^{-3}$, which agree well with the experimental data and theoretical model. From simulation results, the phonon and electron contributions to thermal conductivity are extracted. The electron contribution in the silicon is found to be not negligible above $10^{19}$ $cm^{-3}$, which can be classified as semimetal or metal by the value of its electrical resistivity at room temperature. The thermal conductivity due to electron is about 57.2% of the total thermal conductivity at doping concentration 5.0 ${\times}$ $10^{20}$ $cm^{-3}$ and silicon film thickness 100 nm.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.5
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• pp.341-346
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• 2017

Knowing the mean free paths (MFPs) of thermal phonons is an essential step in performing heat transfer analysis for nanomaterials, and in determining the optimum design for tailoring the heat transfer characteristics of nanomaterials. In this study, we present a method that can be used to calculate accurately the phonon MFP spectra of nanostructures based on simple phonon kinetic theory. Here, the kinetic theory may be employed by extracting only the diffusive-transport part of the phonon spectrum (i.e., the MFPs are less than a thermal length). By considering phonon dispersion and polarization effects, the phonon MFP distributions of silicon at room temperature are calculated from phonon transport properties and the spectral MFP. Our results are validated by comparison with those of the first principle and MFP spectroscopy data.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.92-97
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• 2011

Nowdays the most critical problem is global warming and the most important reason is the high emition of carbondioxide. 23% of the use of carbondioxide is used in building and decreasing the use of it is very important. One of the biggest factor that can decrease the use of energy is developing the heat conducting ratio of the materials we use in building. Heat conducting ratio is the important factor in the use of reducing energy comsumation. In this research, there are methods about how to measure the heat conducting ratio, and the existing the representing measuring method which is Heat Flow Meter HFM 436, Laser Flash Analysis and find out about the TCi of the new method C-Therm and compare the results.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1558-1563
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• 2004

This work applies the nonequilibrium molecular dynamics simulation method to study a Lennard-Jones liquid thin film suspended in the vapor and calculates the thermal conductivity by linear response function. As a preliminary test, the thermal conductivity of pure argon fluid are calculated by nonequilibrium molecular dynamics simulation. It is found that the thermal conductivity decrease with decreasing the density. When both argon liquid and vapor phase are present, the effects of the system temperature on the thermal conductivity are investigated. It can be seen that the thermal conductivity of liquid-vapor interface is constant with increasing the temperature

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.3
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• pp.77-86
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• 2002

위성은 일단 한 번 발사하고 나면 운용궤도상에서 수리 및 회수가 거의 불가능하기 때문에 위성에 들어가는 모든 개발 부품들은 완벽한 설계, 충분한 해석, 고 작업도의 제작, 그리고 다양한 시험이 반드시 수반되어야 한다. 위성시스템에서 전자 소자의 신뢰성에 영향을 주는 인자는 다양하다. 과도한 열은 전자소자의 실패를 유발해서 결과적으로는 전체 위성의 실패를 유도할 수 있다. 이 논문에서는 다목적 실용위성 2호의 고전력 소산 전장품의 열부하 완화를 위한 방안을 경우별로 연구 비교하였다. 고전력 소산 전장품의 열부하를 완화하기 위해서는 하우징 두께의 증가가 필요하며, 전력조절기의 다이오드나 트랜지스터처럼 전력소산이 큰 소자에 대해서는 장착위치를 변경하거나 장착 부분의 열전도율을 증가시키는 방법이 필요하다. 또한 전력조절기처럼 장착면이 좁은 경우에는 복사의 영향이 크며, 이러한 전장품의 열부하를 완화하기 위해서는 주위 벽면의 온도를 낮추거나 하우징 표면 방사율을 증가시키는 방법이 효과적임이 알 수 있다.

• Journal of the Korean Wood Science and Technology
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• v.39 no.3
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• pp.269-280
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• 2011

Today, global warming is one of main problems all over the world. The cause of the global warming is carbon dioxide outbreak by the rapidly increasing energy use. Therefore, it is necessary to save energy in each industrious field. It was investigated that the half of total energy consumption over the world was used for construction and building. Therefore, the saving of the building energy plays a significant role in decreasing total energy consumption. With the considerable increase in building energy consumption, a green building rating system and certification are required to reduce building energy consumption and $CO_2$ emissions. Of various elements reducing building energy, the thermal conductivity of materials affects the energy consumption as a basic element, which is directly related with reducing energy consumption. In particular, as the thermal conductivity of finishing materials is an important factor to decide heating energy efficiency of floor heating system, the investigation and development are necessary.

• Journal of the Korean Recycled Construction Resources Institute
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• v.7 no.4
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• pp.431-437
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• 2019

The purpose of this study is to develop an organic-inorganic hybrid insulation materials which has an economic feasibility of organic level and excellent adiabatic performance and fire stability by impregnating organic materials with inorganic binder solutions. The organic base was commercial polyurethane sponge, and the inorganic binder slurry was prepared by mixing water and additives into recycled gypsum byproducts. As a result of evaluation of the developed materials, it was confirmed that it not only has excellent insulation performance of a thermal conductivity of 0.051 W/mK or less but also it is a semi-non-combustible materials specified in the Ministry of Land, Infrastructure and Transport Notice No. 2015-744. The developed materials can also be controlled for thermal conductivity and flame retardance according to density control during manufacturing process, and thus it can be applied to various insulation materials.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.04a
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• pp.113-116
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• 2011

A total of 9 coating specimens were fabricated through 3 different processes to evaluate the availability and performance of a nickel/chrome coating for the protection of the inner wall of a thrust chamber operating on a condition of high temperature and pressure. Thickness and thermal conductivity of the specimens were measured and thermal shock test was conducted.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.2
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• pp.111-117
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• 2016

The primary concern of this research is to examine the phonon mean free path (MFP) spectrum contribution to heat conduction. The size effect of materials is determined by phonon MFP, and the size effect appears when the phonon MFP is similar to or less than the characteristic length of materials. Therefore, knowledge of the phonon MFP is essential to increase or decrease the heat conduction of a material for engineering applications, such as micro/nanosystems. In this study, frequency dependence of the phonon transport is considered using the Boltzmann transport equation based on a full phonon dispersion model. Additionally, the phonon MFP spectrums of in-plane and out-of-plane heat transport are investigated by varying the film thickness of the silicon layer from 41 nm to 177 nm. This will increase the understanding of anisotropic heat conduction in a SOI (Silicon-on-Insulator) transistor.