• Journal of Hydrogen and New Energy
• /
• v.21 no.5
• /
• pp.398-404
• /
• 2010

Process conditions for MEA fabrications have significant effects on properties and performance of the MEAs for PEMFCs. In this study, effects of additives on the surface properties of the MEA was investigated to improve homogeneity of the coated catalyst layer. Another parameter that affects on characteristics of the MEAs is hot-pressing condition. Hot pressing condition was optimized by using DOE (design of experiment) method.

• Korean Journal of Food Science and Technology
• /
• v.28 no.2
• /
• pp.324-329
• /
• 1996

In order to develop a novel dewatering process for soybean milk residue, hydraulic press with ohmic heating was built and its expression conditions were examined. The electric conductivity of raw soybean milk residue was 0.128 S/m and increased linearly with increasing temperature. Water content of the residue could be reduced to 74% with the conventional hydraulic press, but to less than 70% by applying ohmic heating to the hydraulic press. The most effective dewatering was achieved by applying alternative current with 5 kHz frequency at 60 V during expression. The solid content of the expressed liauid was markedly reduced from 10% to 3.3% by ohmic heating during expression. Temperature of the cake rose to above $95^{\circ}C$ during the dewatering due to ohmic heating.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.39 no.1
• /
• pp.97-107
• /
• 2015

An analytical model was developed to estimate the viscous and squeeze-film damping ratios of heat exchanger tubes subjected to a two-phase cross-flow. Damping information is required to analyze the flow-induced vibration problem for heat exchange tubes. In heat exchange tubes, the most important energy dissipation mechanisms are related to the dynamic interaction between structures such as the tube and support and the liquid. The present model was formulated considering the added mass coefficient, based on an approximate model by Sim (1997). An approximate analytical method was developed to estimate the hydrodynamic forces acting on an oscillating inner cylinder with a concentric annulus. The forces, including the damping force, were calculated using two models developed for relatively high and low oscillatory Reynolds numbers, respectively. The equivalent diameters for the tube bundles and tube support, and the penetration depth, are important parameters to calculate the viscous damping force acting on tube bundles and the squeeze-film damping forces on the tube support, respectively. To calculate the void fraction of a two-phase flow, a homogeneous model was used. To verify the present model, the analytical results were compared to the results given by existing theories. It was found that the present model was applicable to estimate the viscous damping ratio and squeeze-film damping ratio.

• Korean Journal of Food Science and Technology
• /
• v.28 no.4
• /
• pp.638-643
• /
• 1996

The efficiency of dewatering of soybean milk residue was improved by hydraulic pressing after pH adjustment to 4.5 with organic acids such as acetic and lactic acids. Water content of raw soybean milk residue was reduced from 80% to 72% by pressing after pH adjustment, while only to 78% by the conventional hydraulic press. The water content of the residue after pH adjustment was further reduced to 63% by hydraulic pressing with ohmic heating. The pH adjustment facilitated separation of cake from the filter cloth and reduced the solid content of the expressed liquid from 10 to 3%.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.63-67
• /
• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2008.11a
• /
• pp.47-48
• /
• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2013.05a
• /
• pp.525-526
• /
• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2008.06a
• /
• pp.933-934
• /
• 2008

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.1
• /
• pp.7-13
• /
• 2013

3D stacked IC is one of the promising candidates which can keep Moore's law valid for next decades. IC can be stacked through various bonding technologies and they were reviewed in this report, for example, wafer direct bonding and atomic diffusion bonding, etc. As an effort to reduce the high temperature and pressure which were required for high bonding strength in conventional Cu-Cu thermo-compression bonding, surface activated bonding, solid liquid inter-diffusion and direct bonding interface technologies are actively being developed.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.18 no.4
• /
• pp.109-116
• /
• 2019

The mechanical deformation of a battery separator causes internal short-circuiting of the cathode - anode, which directly affects the explosion/ignition of batteries. To increase the mechanical properties of the separator fabricated by electro-spinning, use of a thermal pressing method is inevitable. Therefore, this research aims to maximize the mechanical strength of a porous separator by finding the proper thermal press temperatures given to Electro-spun Polyacrylonitrile (PAN) nanofibers. The different thermal press temperatures $25^{\circ}C$, $50^{\circ}C$, $75^{\circ}C$, and $100^{\circ}C$ were applied to the electro-spun fiber at 30 MPa pressure for one hour. The higher the temperature, the higher the resultant tensile strength; however, a higher temperature also lowered the strain and porosity. Thus, the membrane thermal pressed at $50^{\circ}C$ showed the best mechanical properties and the second highest porosity. Using the data, $50^{\circ}C$ was judged as the best thermal pressing temperature in terms of performance.