• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.4
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• pp.142-148
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• 2008

This study aims to find the optimal cutting conditions, which are obtained by grinding condition, and the grinding characteristics and condition of constant velocity joint were investigated with respect to wheel velocity, depth of cut, feed speed. Grinding machine has been widely used in manufacturing optical reflects of metal. Such as steel are easy to be machined because of their proper material. As a result I obtained the data of grinding conditions makes good surface roughness and the optimal condition of grinding and get the mesh condition. The purpose of this study is to find the optimum grinding wheel characteristics for cutting constant velocity joint.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.33-34
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.637-638
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• 2013

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.18-21
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• 2003

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.4
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• pp.100-110
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• 1995

This paper aims at reviewing the possibility of application over normal or abnormal, detection used by AE, and the characteristics of grinding processes. In this study, when WA-vitri-fied ' resinoid bond grinding wheels:36 kinds of grinding wheel and grinding depth were tuned at the surface grinding, the zone of AE signal generation is theoretically modelled and reviewed by grinding processes. The variation of grinding resistance( F$n^{9}$ $F_{t}$) and AE signal is detected in-process by the use of AE measuring system. The tests are carried out in accordance with grain size and grade of grinding wheels, and work-pieces-STD11 and STD61. According to the experiment's results, the following can be expected;as grinding time passes by, the relation of grinding depth and quantity of AE signal, observing on AE signal and grinding burn suggest the characteristics of grinding processes and evalution on the possibility of control of grinding machine, and monitoring abnormal conditions.e, and monitoring abnormal conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.870-873
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• 2000

This investigation reports the grinding characteristics of quartz. Grinding experiments were performed at various grinding conditions including wheel mesh, table speed and depth of cut. The grinding forces and specific grinding energies were measured to compare the grindability of quartz with those of structural ceramics such as A1$_2$O$_3$, SiC, Si$_3$N$_4$ and ZrO$_2$. Surface roughness was also measured with tracer and the ground surfaces were observed with SEM. The chip formation energy of quartz was about 6J/㎣, which is quite smaller than those of structural ceramics. Although plastic flows are occured in Si$_3$N$_4$ and ZrO$_2$, micro/macro cracks are occured in ground surface of quartz like in A1$_2$O$_3$ and SiC.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.10
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• pp.2514-2522
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• 1994

The mirror surface grinding of carbon fiber reinforced plastics(CFRP) was realized by using the metal bonded super-abrasive micro grain wheel with electrolytic in-process dressing(ELID). The maximum surface roughness $R_{max}$ of CFRP which was obtained with #6,000 wheel, was 0.65 $\mu{m}$, which was rougher surface finish compared to those of hard and brittle materials with the same mesh number wheel with ELID. The grinding performance was much dependent on the grinding direction and the best surface roughness was obtained at $90^{\circ}C$ grinding with fiber direction. The spark-out effect on the surface improvement was significant when smaller mesh number grinding wheels were used. From the surface observations of CFRP with scanning electron microscope(SEM) and Auger electron spectroscopy(AES), it was found that the mirror surface grinding of CFRP was generated by the homogenization due to carbonization of the ground surface and smearing of chips composed of the carbon fiber and carbonized epoxy resin into the ground surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.8-14
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• 2003

The characteristics of grinding and wear behavior of diamond wheel for grinding ceramic materials was investigated in this study. In case of $Si_3N_4$, the wear of wheel was large, the finding force was relatively stable and the fluctuation of surface roughness n small. On the other hand in case of $Al_2O_3$ and $ZrO_2$, the wear of wheel and surface roughness were decreasing, the grinding force was increasing. During grinding with vitrified bond wheel, $Si_3N_4$ shows renewal of cutting edge while $Al_2O_3$ and $ZrO_2$ show glazing phenomenon of cutting grains. We have found that it possible to observe the behavior of grinding wheel by grinding ratio, grinding resistance, surface roughness and cutting edge ratio. Through the grinding experiments, it was found that grinding life of diamond wheel is 20 times for $Si_3N_4$, and 40 times fir $Al_2O_3$ and $ZrO_2$.