• Journal of Power System Engineering
• /
• v.10 no.1
• /
• pp.46-51
• /
• 2006

Present study was investigated the effect of the particle of the counterface of unidirectional carbon fiber reinforced composite. The friction coefficient of composite and the specific wear rate different sliding velocity were measured for this materials. The friction track of counterface was observed by an optical microscope and scanning electron microscope. There were insignificant effects of the specific wear rate under lower Sic abrasive particle, however it showed high effect on $30{\mu}m$ abrasive particle size. There were significant effects of friction and wear behavior of the fiber direction under 0.3m/s sliding speed. Major failure mechanisms can be classified such as microfracture, plowing, microcutting, cutting and cracking.

• Journal of Dental Rehabilitation and Applied Science
• /
• v.39 no.4
• /
• pp.195-203
• /
• 2023

Purpose: This study aimed to evaluate the influence of surface sealants on the surface roughness of composite resins. Materials and Methods: The study used microfilled composite resin (Metafil CX, Sun Medical Co.) and hybrid composite resin (Aelite^TM LS posterior, Bisco). Sixty specimens (8 mm in diameter and 4 mm in height) of each composite resin type were prepared and divided into 3 groups. Each specimen was ground with 600, 1000, and 2000-grit sandpaper. The Surface roughness (Ra) values were measured using a surface roughness tester (SJ-301, Mytutoyo) before and after surface sealant application. Surface sealants, BisCover^TM LV (Bisco), Optiguard^® (Kerr), and Seal-n-Shine^TM (Pulpdent), were applied to the specimens, as instructed and observed by scanning electron microscope (JSM-7500, JEOL) and atomic force microscope (MultiMode IV, Veeco Instruments). Results: Specimens ground with 600-grit sandpaper coated with surface sealants exhibited significantly lower Ra values than the untreated group (P < 0.05). Specimens ground with 1000 and 2000-grit sandpaper showed statistically no difference. There was no significant difference in surface roughness among BisCover^TM LV, Optiguard^®, and Seal-n-Shine^TM. SEM and AFM revealed remarkably decreased microdefects on the surfaces of composite resins after surface sealant application. Conclusion: Surface sealants can influence surface roughness when applied on the rough surface of composite resins but not on highly polished composite resins.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.28 no.2A
• /
• pp.70-79
• /
• 2003

A theoretical presentation of evanescent coupling is offered with respect to the refractive indexes between a side polished optical fiber and an infinitely planar waveguide with a conductor cladding(PWGCC). The PWG is suspended at a constant distance from an unclad fiber core and attached with the perfect conductor(PEC) on one side. The behavior of the distributed coupler is examined using a coupled mode model, which takes account of the two dimensions of the waveguide configuration. The coupling and propagation of light were found to depend on both the relationship between the refractive index values of each structure and the configuration of the side polished fiber used in the PWGCC. The spreading of light in the unconfined direction of the PWGCC is described in terms of a simple geometrical interpretation of the synchromization condition that is in agreement with a previous investigation of the problem based on the coupled-mode theory(CMT). The power of the light propagation in the fiber decreased exponentially along the fiber axis as it was transferred to the PWGCC.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.19 no.3
• /
• pp.507-514
• /
• 2024

In the semiconductor manufacturing line, continuous efforts are being made to reduce the cost of products produced, and the demand for this is accelerating in the chemical mechanical polishing(CMP) process, and a representative example of these cost reduction items is the 5-Zone Ring. After about 150 hours of use in the CMP process, the thickness of the ring decreases to less than 1 mm and must be replaced with a new product. Therefore, in this study, bonding dispensers and press machines with a dispensing amount error of 10g±0.8% or less and a pressure uniformity of ±1.8% or less were developed to reduce semiconductor manufacturing costs by repeatedly regenerating worn parts of the retainer ring, and to minimize environmental pollution caused by industrial waste treatment.

• Journal of Korean Ophthalmic Optics Society
• /
• v.19 no.1
• /
• pp.31-42
• /
• 2014

Purpose: The present study was conducted to investigate the effect of the physical properties of RGP lens induced by lens polishing on the actual wearer's subjective comfort, the tear film break-up time and the blinking rate as a follow-up study that revealed the relationship between the lens physical properties during lens manufacturing and lens wearer's factors. Methods: RGP lenses made from the three different polishing conditions (25, 50 and 100 seconds) were applied on 28 eyes of 17 subjects, aged 20 to 29 years, without any known disease and surgical history in the eyes. While the subjects were asked to wear the RGP lenses longer than a week, the questionnaire for the comfortability was administered everyday. Subjective and objective tear break-up time and blinking rate of the wearers were further measured. Results: The wearer's subjective comfortability showed some difference in the type of discomfort and satisfaction score according to the polishing status when wearing RGP lenses made from different polishing conditions longer than a week, and a bigger difference in satisfaction score induced by polishing condition was especially shown in experienced RGP lens wearer rather than un-experienced wearer. In the case of RGP lens wearer compared with the ones without the wearing experience, as the wearing time increased subjective and objective tear break-up time were increased and the blinking rate was decreased. However, subjective and objective tear break-up time were tended to decrease with even longer wearing time when wearing the RGP lens made from the polishment for 100 seconds. Conclusions: These results confirmed that the optimization of physical properties of the lens may not give the same effect on the wearer's subjective and objective symptoms and other factors when actual wearing. From the results, it can suggest that the success rate of RGP lens wear may be changed by physiological factors such as the stabilization of wearer's tear film, comfortability and lens wearing experience when wearing RGP lens based on 'The manufacturing standard for soft contact lens/hard contact lens' provided by Korea Food and Drug Administration.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.5
• /
• pp.358-363
• /
• 2010

The polishing pad is important element for polishing characteristic such as material removal rate(MRR) and within wafer non-uniformity(WIWNU) in the chemical mechanical planarization(CMP). The result of the viscoelasticity measurement shows that 1st elastic modulus is increased and 2nd elastic modulus is decreased when the top pad is thickened. The finite element analysis(FEA) was conducted to predict characteristic of polishing behavior according to the pad thickness. The result of polishing experiment was similar with the FEA, and it shows that the 1st elastic modulus affects instantaneous deformation of pad related to MRR. And the 2nd elastic modulus has an effect on WIWNU due to the viscoelasticity deformation of pad.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.10
• /
• pp.839-845
• /
• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• Journal of Korea Society of Industrial Information Systems
• /
• v.17 no.1
• /
• pp.1-9
• /
• 2012

This paper explained about the sludge recycling system which retrieved the silicon and abrasive from solar cell wafer slicing. The basic process of the recycling system was multiple centrifuge and secondary processes of ultra sonic agitation, addition of alcohol-water solution and heating sludge was added for raising separation efficiency. The recycling rate was about 96% and 94% for 2N, 4N silicon respectively. The SiC abrasive recycling rate was about 80%. To retrieve the high purity of 4N silicon, the heat process in vacuum furnace was added to remove remaining impurity components.

• Journal of Ocean Engineering and Technology
• /
• v.22 no.6
• /
• pp.35-40
• /
• 2008

The effect of counterpart roughness on abrasive wear characteristics of side plate materials of FRP ship, which were composed of glass fiber and unsaturated polyester resin composites, were investigated at ambient temperature by pin-an-disc friction test. The friction coefficient, wear rate and cumulative wear volume of these materials against SiC abrasive paper were determined experimentally. The wear rate of these materials decreased rapidly with sliding distance and then maintained a constant value. It was increased as counterpart roughness was rougher in a wear test. The cumulative wear volume tended to increase nonlinearly with sliding distance and depended on applied load and sliding speed for these composites. It could be verified by SEM photograph of fracture surface that major failure mechanisms were overlapping layers, microcutting, deformation of resin, delamination, and cracking.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.7
• /
• pp.568-574
• /
• 2000

We have been optimized tungsten(W) plug CMP(chemical mechanical polishing) characteristics using two different kinds of component of slurry and two different kinds of pad which have different hardness. The comparison of oxide film roughness on around W plug after polishing has been carried out. And W plug recess for consumable sets and dishing effect at dense area according to the rate of over-polishing has been investigated. Also the analysis of residue on surface after cleaning have been performed. As a experimental result we have concluded that the consumable set of slurry A and hard pad was good for W plug CMP process. After decreasing the rate of chemical reaction of silica slurry and adding two step buffering we could reduce the expanding of W plug void however we are still recognizing to need a more development for those kinds of CMP consumables.