• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.12
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• pp.1297-1303
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• 2015

The internal chromium plating of a long-axis tube is widely used in military and industrial application, with the thick hard plating formed using a mixed solution of Chromium acid and catalytic $H_2SO_4$. A large-caliber gun can endure a high explosive force as a result of the increased stiffness and wear resistance provided by this internal hard chromium surface. The internal chromium layer of a tube is prone to exfoliation caused by the high kinetic energy of the projectile and high pressure of the explosion. Therefore, we reviewed the plating process. Chromium plating comprises many steps, including the removal of Grease, water cleaning, electrolytic abrasion, etching, plating, water cleaning, and hydrogen brittleness removal. The exfoliated chromium plating layer is affected by the adhesion property of the plating. In particular, the Fe concentration of the electrolyte affects the adhesion property. The optimum Fe concentration for effectively suppressing the exfoliation of the plating layer was established by using a scanning electron microscope to determine the surface roughness, and the effectiveness was proved in an adhesion test, etc.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.120-124
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• 2004

본 연구는 Diluted Ceria 입자를 사용한 $SiO_2$(Oxide) CMP 현상에 대한 내용이다. Ceria Slurry의 경우 Silica Slurry와 비교하였을 때 Oxide Wafer 표면과 축합 화학반응을 일으키며 Chemistry Dominant한 CMP Mechanism을 따르고, Wafer Center Removal Rate(RR) Fast 의 특성을 가진다. Ceria Slurry의 문제점인 연마 불균일도를 해결하기 위해 Tribological System을 이용하였다. CMP Tribology는 Pad-Slurry 유막-Wafer의 System을 가지며 윤활막에 작용하는 마찰계수(COF)가 주요 인자이다. Tribology에 적용되는 Stribeck Curve를 통해 Slurry 윤활막의 두께(h) 정도를 예상할 수 있으며, 이 윤활막의 두께를 조절함으로써 Uniformity 향상이 가능하다. 이 Ceria Slurry CMP의 연마 불균일도를 향상시킬 수 있는 방법으로 pH 조절 및 점도 증가가 있다. Ceria 입자 CMP는 분산액의 pH 변화에 강한 작용을 받게 되며 PH5 근방에서 최적화된 Uniformity가 가능하다. 점도를 증가시키는 경우 유막 h가 증가하게 되어 Ceria Slurry의 유동이 균일 분포 상태에 가까워지며 Wafer Uniformity 향상이 가능하다.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.19-24
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• 2001

The lead frame, which is principal material used in semiconductor packaging, is required to be microscopic in leads and pitches to cope with miniaturization, thin film, large scale integrated. In addition, it is indispensable to eliminate residual stress and burrs occurring at manufacturing lead frames This thesis applied electrolytic abrasion in order to remove burrs and residual stress created during the stamp process. Electrolytic abrasion removed the burrs on the surface of lead frame. Removal of residual stress highly depends on the types of electrolyte solution. In case of perchloric system, electrolytic abrasion removed 23% of residual stress. Through removal of burrs and reducing residual stress, the reliability of lead frame was substantially improved.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.3
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• pp.319-324
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• 2013

In this study, an EP (electro-polishing)-MAP (magnetic abrasive polishing) hybrid process was developed as a precision finishing process. To evaluate the characteristics of this EP-MAP hybrid process, a series of experiments were carried out using various working gaps, current densities, and electrolyte concentrations. As a result, $NaNO_3$ was found to be very suitable as the electrolyte of the hybrid process because there was no electrochemical reaction with the CNT-Co composite. Moreover, an increase in the magnetic flux density affected the liquidity of the electrolyte and prevented it from flowing into the CNT-Co composite powder. For that reason, the lower liquidity of the electrolyte increased the thermal energy on the surface of the workpiece.

• The Journal of Korean Academy of Prosthodontics
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• v.50 no.2
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• pp.106-111
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• 2012

Purpose: The purpose of this study was to compare the effect of 3 chairside polishing methods and laboratory polishing methods on surface roughness and $C.$ $albicans$ adhesion of polyamide denture base. Materials and methods: Using contact profilometer, the surface of polyamide specimens ($25{\times}15{\times}2mm$) was studied after conventional polishing without finishing and after chiarside polishing with 2 chiarside polishing kits and chairside-pumice polishing following finishing with tungsten carbide bur. To evaluate the adhesion of $C.$ $albicans$, $C.$ $albicans$ suspension was overlayed on the test specimen. And the specimens were incubated for 2 hours. Imprint culture method was achieved and counted the colony on the agar plate. Polished polyamide were evaluated using a scanning electron microscope. The statistics were conducted using one-way ANOVA and in case of difference, Scheffe test and Tamhane's T2 test were used. Results: Surface roughness (Ra) of surfaces polished with 2 chairside polishing kits had higher than conventional polishing and pumice polishing. The highest roughness value was $0.32{\pm}0.10{\mu}m$, and the lowest was $0.02{\pm}0.00{\mu}m$. The adhesion of $C.$ $albicans$ on the specimens polished with chairside polishing group and pumice polishing group were increased than conventional polishing group ($P$<.01). Conclusion: Conventional laboratory polishing was found to produce the smoothest surface and the lowest adhesion of $C.$ $albicans$. Two groups polished with Chairside polishing kits were similar with respect to surface roughness. Surface of the specimen polished with pumice is significantly smoother than 2 chairside polishing groups, but the result of $C.$ $albicans$ adhesion is that group polished with pumice was similar with 2 chairside polishing groups ($P$>.01).

• The Journal of the Petrological Society of Korea
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• v.23 no.2
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• pp.139-144
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• 2014

A series of the planar cathodoluminescence (CL) and backscattered-electron (BSE) images of magmatic zircon from the Paleozoic Yeongdeok pluton in the southeastern Korean Peninsula were taken using a scanning electron microscope for a 3D reconstruction of internal zonation of zircon. Seven zircon crystals mounted in epoxy were serially polished with average $3{\mu}m$ thickness to their disappearance. Their 3D reconstruction of zonation was performed using the Volume Viewer function in the ImageJ software. The 3D oscillatory zoning pattern of zircon was apparently shown in all the analyzed crystals. This method can further be applied to zircon crystals of multiple growth histories as well as other geological materials.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.05a
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• pp.251-255
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• 1999

In last paper, it was suggested electrochemical polishing method using the point electrode tools. It was aimed that Machining rate in ECM using the point electrode method should be ultimately small and also high dimension accuracy and surface integrity should be fine. In this paper, the machining characteristics were investigated by using the several types of electrolyte.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.45-54
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• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2003.11a
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• pp.196-201
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• 2003

Decontamination means every method that can drop the level of the radioactivities from the materials contaminated with them to the allowable one. In this paper, one of the decontamination methods, the electro-decontamination was described with lots of experiments. Two test specimens contaminated with alpha ray and beta ray respectively were used to compare the decontamination factors between two rays and many experiments were performed in every electrolyte with SUS and Carbon steel test specimens. Sulphuric acid, phosphoric acid, nitric acid, citric acid and oxalic acid were used as the electrolyte. Decontamination Factors (DF) could be compared and analyzed with different electrolyte, current intensities and time.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.139-139
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• 2018

최근 자동차 산업을 중심으로 한 수송용 기기의 경량화 추세에 따라 대표적인 경량금속 소재인 알루미늄 합금에 대한 수요가 증가하고 있으며 이에 따라 알루미늄 합금 표면에 다양한 특성을 부여할 수 있는 표면개질 기술에 대한 필요성이 부각되고 있다. 알루미늄 합금의 대표적인 표면처리기술인 아노다이징과 유사한 원리로 표면에 세라믹 코팅층을 형성할 수 있는 기술인 플라즈마 전해 산화(Plasma electrolytic oxidation, PEO)가 주목을 받고 있다. PEO 코팅법은 전해액 내에 소재를 침지시키고 400 ~ 600V에 이르는 고전압을 인가시켜 마이크로 방전을 유도하여 표면에 치밀한 세라믹 층을 형성시키는 기술이다. 본 연구에서는 PEO법으로 표면 개질된 Al 합금 표면의 표면 조직 특성과 전기화학 특성을 평가하고, 코팅층 특성에 미치는 공정 변수의 영향을 분석하고자 하였다. PEO 처리를 위해 사용된 소재는 상용 Al 합금 판재(Al 5083-O)로서 $2cm{\times}2cm$로 절단하여, 에머리페이퍼로 1000번까지 연마하여 사용하였다. 시험을 위한 PEO 처리 시스템은 전해액 수조, 일정 온도 유지를 위한 열교환기와 칠러, 전원 발생을 위한 전원공급기(power supply)로 구성되었다. 전해액은 약 알칼리 수용액을 이용하였으며, 전원 공급기를 통해 시험편에 펄스 전류를 인가하였다. PEO 처리 후 시편에 대하여 SEM, EDS, XRD 등을 이용한 표면 특성 평가를 실시하였다. 또한 코팅층의 전기화학적 부식 특성 평가를 위해 해수용액에서 동전위분극실험을 실시하였다. 시험 결과, Al 합금의 PEO 처리 시 내식성은 개선되는 것으로 확인되었으며, 공정변수는 표면의 미세조직 및 전기화학적 특성에 큰 영향을 미치는 것으로 나타났다.