• The Bulletin of The Korean Astronomical Society
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• v.38 no.2
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• pp.83.1-83.1
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• 2013

선형비점수차를 완벽하게 제거한 비축반사경 이론을 천체 관측용 분광기의 전단 광학계 등에 응용하면 색수차가 없는 기기 제작이 가능하다. 이러한 비축 반사경은 DTM(Diamond Turning Machine)을 이용하여 알루미늄으로 만들면 제작 시간이 단축된다. 그러나 DTM을 이용해 알루미늄과 같이 무른 금속을 가공할 경우 툴마크가 발생하게 된다. 툴마크는 회절현상을 발생시키며 이러한 회절현상은 알루미늄 반사경을 이용한 광학계 개발에 제약이 된다. 툴마크는 DTM 가공 이후 연마를 통해 제거할 수 있지만 알루미늄의 무른 특성으로 인해 연마 과정에서 반사경의 형상이 변할 가능성이 크다. 이러한 알루미늄 반사경의 형상 변화를 최소화하기 위한 방법으로는 알루미늄 반사경 표면에 무전해니켈도금을 하는 것이다. 하지만 도금 과정에서 반사경의 형상이 변할 가능성이 있기 때문에 두가지 방법을 사용하여 툴마크를 제거할 계획이다. 첫 번째 방법은 DTM 가공된 알루미늄 반사경을 5 um의 무전해니켈도금 이후 연마하여 툴마크를 제거하고 반사율 증가를 위해 그 위에 다시 알루미늄 코팅을 하는 방법니다. 두 번째 방법은 100 um의 무전해니켈도금 이후 DTM 가공을 하고 다시 연마를 통해 툴마크를 제거하는 방법이다. 이번 발표에서는 툴마크를 제거하기 위한 2가지 방법의 장단점을 확인하고 툴마크를 제거한 알루미늄 반사경을 제작하기 위한 과정을 설명하였다. 본 연구에서 개발한 비축 반사경은 서울대학교 창의연구단의 광학/적외선 카메라 CQUEAN의 차세대 모델에 적용할 계획이다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.5
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• pp.617-623
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• 2004

This paper describes a dynamic thermal model for a representative dual axis rotational Chemical-Mechanical Polishing (CMP) tool. The model is one-dimensional but configured in the two-dimensional space and consists of three sub-models (pad, wafer and slurry fluid), with the first and the second that are time-dependent heat conduction-convection models with linear stationary (wafer) and nonlinear moving (pad) boundary conditions, and the last one that is a heat transport-convection model (slurry fluid). The modeling approach is validated by comparing the simulation results with available experimental data.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• Journal of the KSME
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• v.30 no.1
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• pp.9-16
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• 1990

CIM기술은 기업체 지원형 및 국산화형 생산기술과 더불어 필수적이고 상호 보완적인 산업기술이 고 또한 첨단제품기술 및 원천과학기술과의 연계가 가능한 접속(interface) 기술이다. 동시에 이의 연구개발은 다분야 공동참여적인 (multi-disciplinary) 기술적 배경을 필요로 하며 산업계 연구 수 행과 종속적이고도 이원적인 연구 체제가 필요하다. CIM기술개발의 예로서 제품 설계에서부터 설계의 해석 및 평가, 금형 설계, 공장 설계, 가공, 사상 및 측정. 검사까지의 과정과 생산통제를 포함하는 제반 생산 행위를 컴퓨터를 이용하여 생산 정보를 통합 제어함으로써 합리적인 금형 생산을 위한 사출 금형의 모델 플랜트를 소개하였다. 이 모델 플랜트는 설계, 공정 설계/NC, 연마, 측정. 검사, 시스템 통제의 5개 스테이션으로 구성되며, 각 스테이션에서의 중단위 통합 모델이 테스트되었다. 향후, 스테이션 간의 정보 흐름이 완전히 통합되면 금형업체는 물론 많은 제조업체에서의 광범위한 CIM기술 활용이 기대된다.

• Tribology and Lubricants
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• v.20 no.5
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• pp.284-291
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• 2004

We present a three-dimensional average flow model considering elastic deformation of pad asperities for chemical mechanical planarization. To consider the contact deformation of pad asperities in the calculation of the flow factor, three-dimensional contact analysis of a semi-infinite solid based on the use of influence functions is conducted from computer generated three dimensional roughness data. The average Reynolds equation and the boundary condition of both force and momentum balance are used to investigate the effect of pad roughness and external pressure conditions on film thickness and wafer position angle.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.61-66
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• 2012

Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.

• Applied Chemistry for Engineering
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• v.8 no.5
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• pp.756-762
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• 1997

The experiment was carried out to fabricate alumina membrane which has a cylindrical pore structure by anodizing aluminium plate in sulfuric acid solution with the electrochemical technique. The aluminium plate for anodizing was prepared by the pretreatment process such as chemical, electro-polishing and thermal treatment. The pore size distribution and the film thickness of alumina membrane were investigated by the implementation of scanning electron microscope(SEM) and BET method. The results show that the oxide film has a geometrical structures like a Keller model and that the membrane has a uniform pore distribution. The pore size and the oxide film thickness are dependent on the anodizing process variables such as the electrolyte concentration, the reation temperature and the anodizing current density.

• Transactions of the Korean Society of Mechanical Engineers
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• v.11 no.3
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• pp.488-500
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• 1987

The improvement of surface roughness of machined cylindrical rods through the plastic polishing process was studied in this paper. The criterion and limits for the plastic polishing process due to the wave motion of the ridge were established with respect to process variables: ridge shape and size, semi-cone die angle as well as friction factor, by the application of the upper-bound approach. The surface roughness of the plastic polished products was measured, and compared with that of the original specimen. Also the depth of the surface deformation layer was tested, and compared those of the theoretical values. Qualitative agreement exists between the experimental plastic polishing loads and theoretical loads. The wave motion of the ridge was mostly occurred within the established limits. The surface roughness of specimens was sufficiently improved through the present process. Also the predicted depth of the surface deformation layer was in good agreement with experimental results.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.331-338
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• 2004

We present a three-dimensional average flow model considering elastic deformation of pad asperities for chemical mechanical planarization. To consider the contact deformation of pad asperities in the calculation of the flow factor, three-dimensional contact analysis of a semi-infinite solid based on the use of influence functions is conducted from computer generated three dimensional roughness data. The average Reynolds equation and the boundary condition of both force and momentum balance are used to investigate the effect of pad roughness and external pressure conditions on film thickness and wafer position angle.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.12
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• pp.2110-2117
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• 2003

A physics-based material removal model in various scales is described and a feature scale simulation for a chemical mechanical polishing (CMP) process is performed in this work. Three different scales are considered in this model, i.e., abrasive particle scale, asperity scale and wafer scale. The abrasive particle and the asperity scales are combined together and then homogenized to result in force balance conditions to be satisfied in the wafer scale using an extended Greenwood-Williamson and Whitehouse-Archard statistical model that takes into consideration the joint distribution of asperity heights and asperity tip radii. The final computation is made to evaluate the material removal rate in wafer scale and a computer simulation is performed for detailed surface profile variations on a representative feature. The results show the dependence of the material removal rate on the joint distribution, applied external pressure, relative velocity, and other operating conditions and design parameters.