• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• Composites Research
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• v.18 no.4
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• pp.14-20
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• 2005

To determine the effect of chemical structure of aromatic amino curing agents on thermal and mechanical properties, standard epoxy resin DGEBF (diglycidylether of bisphenol F) was cured with diaminodiphenyl methane (DDM) and diaminodiphenyl sulphone (DDS) in a stoichiometrically equivalent ratio. From this work the effect of aromatic amino curing agents on the thermal and mechanical properties is significantly influenced by the chemical structure of curing agents. In contrast, the results show that the DGEBF/DDS system having the sulfone structure between the benzene rings had higher values in the thermal stability, density, shrinkage ($\%$), thermal expansion coefficient, tensile modulus and strength, flexural modulus and strength than the DGEBF/DDM system having methylene structure between the benzene rings, whereas the DGEBF/DDS system presented low values in maximum exothermic temperature, conversion of epoxide, and grass transition temperature. These results are caused by the relative effects of sulfone group having strong electronegativity and methylene group having (+) repulsive property. The result of fractography shows that the grain distribution of DGEBF/DDS system is more irregular than that of the DGEBF/DDM system.

• Polymer(Korea)
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• v.28 no.1
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• pp.35-40
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• 2004

The formation mechanism of void defect which deteriorate composite's property is various according to each composite process. In this paper, void formation and growth mechanism is analyzed by thermal analysis and GC/MS. We made a vacuum chamber for observing pressure effect. Thermal analysis has been done in various condition. Elements of volatiles during resin curing were turned out by GC/MS. The most of volatiles of polyester were composed of styrene (over 80%) and a small quantity of toluene. In case epoxy resin, butyl glycidyl ether was the main element of volatiles (over 90%). We concluded that the original sites of void growth existed in resin and they were eliminated by vacuum and heating process. And the growth of void was influenced by water, diluents, solvent, and reactants in resin.

• Journal of Conservation Science
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• v.27 no.3
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• pp.301-312
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• 2011

Epoxy resin has superior durability and adhesive strength and proper physical strength so that it is used to diversity materials for multi-purposes. However epoxy resin is hardly removed after hardening specially once it is applied to artefacts, it is difficult to remove them under re-conservation. This paper is an experimental study on removing epoxy resin applied to iron objects using Nd:YAG laser cleaning system. Tests conducted in this study investigated how increasing laser energy and pulses would give effect on samples. The samples were prepared in a way that epoxy resin, itself pure and one which was mixed with pigment and they were applied to iron coupons and corroded iron coupons respectively. As a result of experiment, pure epoxy resin applied to corroded iron coupons was ablated at high laser energy but epoxy resin applied to iron coupons and mixing with pigment were not ablated but discolored and bubbled due to laser-induced heat generation. Results of FT-IR showed no component alteration of shifted resins and no residues on the surfaces ablated by laser irradiation. From SEM-EDS for removed surfaces, the debris from epoxy resin and melting iron was observed. Therefore, this study demonstrated the possibilities and limitations for laser cleaning to remove epoxy resin from iron objects.

• The Korean Journal of Rheology
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• v.10 no.2
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• pp.92-97
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• 1998

열잠재성 경화제인 N-benzylpyrazinium hexafluoroantimonate (BPH)를 이용하여 함 량에 따른 DGEBA계 에폭시 수지의 경화반응에서의 유변학적 특서 및 반응속도를 연구하 였다. 경화시의 활성화 에너지를 Barrett 방법을 이용한 동적 DSC 측정방법으로 조사 하였 다. DSC 실험 결과 BPH의 함량이 증가할수록 활성화 에너지는 감소함을 알수 있었다. Rheomter를 이용하여 DGEBA/BPH 계의 유변학적 특성을 등온경화와 tdmdhsrud화 조건하 에서 살펴보았다. BPH의 함량이 증가함에 따라 겔화점 도달시간 빠르게 나타나는데 이는 낮아진 활성화 에너지에 기인한 것으로 사료된다. 두 번째 damping 피크를 이용하여 유리 화점을 측정하여 Time-Temperature-Transformation (T-T-T) cure diagram을 작성한 결 과 열잠재성 경화제의 특성인 일정온도 이상에서 활성이 나타남을 확인할수있었다.

• Polymer(Korea)
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• v.37 no.1
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• pp.121-126
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• 2013

UV-curable high refractive index di-functional epoxy acrylate, 4,4'-thiodibenzenethiol diglycidyl ether diacrylate, was synthesized from acrylic acid and 4,4'-thiodibenzenethiol diglycidyl ether that was obtained by reacting 4,4'-thiodibenzenethiol and epichlorohydrin using a direct method (Taffy process). Its chemical structure was identified by $^1H$ NMR and FTIR. After its dilution with a reactive diluent, 2-phenoxythiol ethyl acrylate as 5, 10, 15, 20, and 30 wt% content, the relationship between their viscosity and refractive index was investigated. Their degree of cure decreased with increasing the amount of reactive diluent, and the refractive index of UV-cured film increased with increasing the degree of cure.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.35 no.2
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• pp.465-470
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• 2015

The curing of epoxy asphalt mixture depends on the chemical reaction of epoxy resin and the curing agent. The curing level of epoxy asphalt mixture needs to be predicted in order to decide traffic opening time and to establish further construction plans. In this study, chemical analysis of the prediction model was executed to expand the applicability of the previous prediction model. Consequently, the curing level prediction model of epoxy asphalt concrete mixture was proposed using the concentration ratio and the acid value ratio. According to the results of outdoor curing experiments, the final prediction model showed that the correlation coefficient is greater than 0.971. Precise prediction results of different composition epoxy asphalt were obtained by reflecting the chemical composition ratios in the curing level prediction model.

• Applied Chemistry for Engineering
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• v.3 no.2
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• pp.318-326
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• 1992

Vinylester resin was synthesized by reacting epoxy resin with MAA(methacrylic acid) at a equivalent ratio of 1.1/1.0 in the presence of N,N dimethyl benzylamine. Low molecular weight epoxy(DER 331) was used together with higher molecular weight epoxy(DER 662, DER 664) and a novolac epoxy(DEN 439), and the amount of DER 331 was not over 50% of the total epoxy components. Viscosity, cure time and mechanical properties of the vinylester resin were profoundly influenced by the quantity of reacted MAA, and the structure and molecular weight of the epoxy resin. Tensile and flexural strength appeared to be the greatest when DER 331 fraction was 30~40%.

• Composites Research
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• v.15 no.2
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• pp.40-47
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• 2002

The di-functional epoxy resins, i.e., diglycidylether of bisphenol A(DGEBA) and diglycidylethere of bisphenol F(DGEBF) were initiated by cationic catalyst, i.e., benzylquinoxalinium hexafluoroantimonate(BQH) using electron-beam(EB) technique. And the effect of structure of DGEBA and DGEBF on thermal stabilities and cure behaviors was investigated. According to the experimental results, the decomposed activation energy based on Horowitz-Metzger method was higher in the case of DGEBA, but intergral procedural decomposition temperature(IPDT) of DGEBA was lower than DGEBF. This could be interpreted in terms of high crosslink density resulted from hydroxyl bond of DGEBF backbone. It was confirmed in increasing the hydroxyl band at $7000\;cm^{-1}$ and $5235\;cm^{-1}$ using near-infrared spectroscopy(NIRS).

• Clean Technology
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• v.21 no.1
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• pp.76-82
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• 2015

Volatile organic compounds (VOC) free adhesives have been interested by many scientists and engineers due to environmental regulations and the safety of industrial workers. In this work, a series of composites composed with bisphenol A epoxy resin used as solvent, dicyandiamide, and promoter were prepared to investigate the most appropriate molar ratio for steel-steel adhesion. The cured test specimen of each composite were measured with universal testing machine (UTM) to figure out mechanical properties such as tensile strength, Young’s modulus, and elongation. Furthermore, the lap shear strength of the specimen was tested with UTM while impact resistance was measured with Izod impact tester. The composite whose molar ratio of epoxy resin to curing agent is 1 : 0.9 (sample 3), showed better tensile strength, coefficient of elastic modulus, elongation, and impact strength than other composites did. The highest tanδ from dynamic mechanical analysis (DMA) was observed from sample 2 (epoxy resin: dicy = 1 : 0.7) while sample 3 showed slightly lower tanδ than that of 2. The morphology of the fracture surface of the cured composites from SEM showed that the number of subtle lines on the surface caused by impact increase as the contents of amine curing agent accrete. Furthermore, the viscosity change of sample 5 (epoxy resin: dicy = 1 : 1.3) was observed to confirm its storage stability.