• Journal of the Korean Society for Nondestructive Testing
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• v.20 no.6
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• pp.490-500
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• 2000

A new technique for the source location of acoustic emission (AE) in plates whose thichness are close to or thinner than the wavelength has been studied by introducing wavelet transform de-noising technique. The detected AE signals were pre-processed using wavelet transform to be decomposed into the low-frequency, high-amplitude flexural components and the high-frequency, low-amplitude extensional components. If the wavelet transform de-noising was employed, we could successfully filter out the extensional wave component, one of the critical errors of source location in plates by arrival time difference method. The accuracy of source location appeared to be significantly improved and independent of the setting of gain and threshold, plate thickness, sensor-to-sensor distance, and the relative position of source to sensors. Since the method utilizes the flexural component of relatively high amplitude, it could be applied to very large, thin-walled structures in practice.

• Journal of the Korean Academy of Esthetic Dentistry
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• v.27 no.2
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• pp.97-104
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• 2018

Mandibular anterior region has high implant survival rates and better accessibility compared with any other region. Even if there are possibilities for perforation on lingual cortical bone due to improper drilling and bleeding caused by lingual artery damage, mandibular anterior region is a safe region because less amount of major anatomical structures exist compared with other regions. However, because of narrow bucco-lingual width of alveolar ridge, it is challengeable to obtain esthetic implant prosthesis. Although patients are less sensitive subjectively, mandibular anterior region is as difficult as maxillary anterior region in that implant placement location plays a critical role on the prognosis of implant prosthesis. One-piece implant is a very useful option for mandibular anterior region. Considering the narrow roots and thin alveolar bone of mandible, it is clinically difficult for implant diameter to be greater than 3mm In this case, we could approach the esthetic restoration in mandibular anterior region with one-piece implant and immediate loading.

• Journal of Advanced Navigation Technology
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• v.23 no.5
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• pp.415-423
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• 2019

In this paper, a design method for a high-sensitivity microstrip patch sensor antenna (MPSA) loaded with a bent-slot was studied for the permittivity measurement. The bent-slot similar to a single-ring complementary split ring resonator was added along a radiating edge of the patch in order to enhance the sensitivity to the permittivity. The sensitivity of the proposed MPSA was compared with that of a conventional rectangular MPSA and a thin rectangular-slotted MPSA. Three MPSAs were designed and fabricated on a 0.76-mm-thick RF-35 substrate so that the input reflection coefficient would resonate at 2.5 GHz in the absence of the superstrate under test. When five different Taconic substrates with a relative permittivity ranging from 2.17 to 10.2 were used as the superstrate under test, experiment results show that the sensitivity of the proposed MPSA, which is measured by the shift in the resonant frequency of the input reflection coefficient, is 4.1 to 6.1 times higher than that of the conventional MPSA.

• Journal of Convergence for Information Technology
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• v.11 no.3
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• pp.167-173
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• 2021

There is an increasing interest in manufacturing various electronic devices on a bendable substrate. In this paper, we observed a surface morphology by annealing for 20 minutes at temperatures of 150 ℃, 350 ℃, and 550 ℃, respectively, with samples coated by chromium and aluminum. Data on surfaces are investigated using high-resolution SEM and AFM that can measure roughness up to nm. There is no difference from the sample without heat treatment up to 350 ℃, but the change of crystal grains can be observed at 550 ℃. In the future, for application to the flexible optoelectronic field, additional characteristics such as electrical conductivity and reflectivity will be analyzed and optical devices will be manufactured. In conclusion, we will explore the possibility of applying metal materials to flexible electronic devices.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.

• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.1
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• pp.130-140
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• 2007

Fiber-sheet and steel-plate strengthening methods have been mainly used for strengthening the RC structures. However, recently the application of these two methods have dramatically decreased due to premature debonding failure between concrete surface and fiber-sheet and heavy self-weight of steel-plate. This article presents experimental results of shear behavior in RC beams strengthened with GSP(Glass fiber-Steel composite Plate). The thin steel plate in GSP makes usage of the anchoring system possible, which could delay or prevent the premature debonding failure. Three reference beams and 60 strengthened beams with GSP were tested. The experimental results showed that strengthened beams with GSP considerably increased in shear capacity compared with the reference beams.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.5
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• pp.370-376
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• 2016

Corrosion on the surface of a structure can generate cracks or cause walls to thin. This can lead to fracturing, which can eventually lead to fatalities and property loss. In an effort to prevent this, laser imaging technology has been used over the last ten years to detect thin-plate structure, or relatively thin piping. The most common laser imaging was used to develop a new technology for inspecting and imaging a desired area in order to scan various structures for thin-plate structure and thin piping. However, this method builds images by measuring waves reflected from defects, and subsequently has a considerable time delay of a few milliseconds at each scanning point. In addition, the complexity of the system is high, due to additional required components, such as laser-focusing parts. This paper proposes a laser imaging method with an increased scanning speed, based on excitation and the measurement of standing waves in structures. The wavenumber of standing waves changes at sections with a geometrical discontinuity, such as thickness. Therefore, it is possible to detect defects in a structure by generating standing waves with a single frequency and scanning the waves at each point by with the laser scanning system. The proposed technique is demonstrated on a wall-thinned plate with a linear thickness variation.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.183-183
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• 2015

Indium tin oxide (ITO)는 넓은 밴드갭을 가지는 n-type의 축퇴 반도체로 태양전지, 스마트윈도우, 터치 센서, organic light emitting displays (OLEDs) 등에 널리 적용된다. 최근 touch screen panels (TSPs)의 높은 전기적 특성 및 고해상도 요구에 따라 고품질 ITO 박막개발의 수요도 증가하는 추세이다. 지금까지 ITO 박막의 물성 및 기계적 특성에 관한 많은 연구가 진행되어 왔지만 ITO 초박막 에서의 근본적인 물성 변화에 대한 연구는 미흡한 실정이므로, 이러한 연구는 필수적이라 할 수 있다. ITO 초박막은 광학적 특성은 우수하나, 낮은 결정성으로 인해 전기적 특성이 나쁘다는 단점을 가지며, 이러한 ITO 박막의 결정성은 초기 박막 성장과정에 많은 영향을 받는다. ITO 박막의 초기성장과정은 핵이 생성된 후(nucleation), 각각의 위치에서 성장하게 되고(growth), 합쳐지면서(coalescence) 연속적인 막을 형성 하는데(continuous), 이러한 초기 박막 성장 과정 중에 핵 생성 밀도를 증가시키고 박막이 연속적으로 되는 두께를 감소시킨다면, 더욱 더 고품질의 ITO 초박막을 얻을 수 있을 것이다. 따라서, 본 연구에서는 박막 초기 형성 과정 중 섬들이 합체되는 두께를 최소화시키기 위하여 EMF(electromagnetic field strength) 시스템을 이용하였다. EMF 시스템은 DC 캐소드에 전자석 코일을 장착하여 전자기장을 추가로 부가한 것으로, 이를 이용할 경우 스퍼터 원자가 중성상태로 기판에 도달하는 것이 아니라, 이온화되어 Vp-Vf의 차이로 가속되어 추가적인 에너지를 공급받음으로써 기판표면상에서 확산을 촉진시키므로 박막이 연속적으로 되는 임계 두께를 감소시킬 수 있는 것으로 기대된다. 실험은 실온에서 DC 마그네트론 스퍼터링법을 이용하였으며, 유리기판위에 4, 6, 8, 10, 12, 20 nm의 두께로 ITO 박막을 제작하였다. 스퍼터링 파워는 150 W (3.29 W/cm3), 작업 압력은 0.13 Pa, 기판과 타깃 사이의 거리는 70 mm였다. 각각의 두께에서 EMF 파워 0, 5, 10, 15, 20, 25, 30 W로 인가하여 박막을 제작한 후, EMF 파워에 따른 ITO 박막의 초기 성장 과정중 표면상태를 AFM (atomic force microscope) 이미지를 통하여 관찰하였다. 또한, 두께 약 8 nm에서와 20 nm일 때의 전기적 특성 및 광학적 특성을 관찰하였으며, 두 박막 모두 EMF 파워 15 W를 인가하였을 때 그 특성이 가장 향상되는 것을 확인하였다. 이러한 결과를 통하여 박막은 초기 성장이 중요하므로, 매우 얇은 두께에서 좋은 특성을 가진 박막을 제작하여야 박막의 두께를 증가시켰을 때도 좋은 특성의 막을 얻을 수 있음을 알 수 있었다. 또한, EMF 파워를 증가시킴에 따라 자장강도를 증가시키는 것과 같은 효과 즉, 플라즈마 임피던스가 감소하는 효과를 내어 증착 중 고 에너지 입자 (Ar0, O-)에 의한 박막손상이 감소한 것으로 판단된다. 따라서 적정 EMF 파워 15 W를 인가하였을때 가장 물성이 좋은 ITO 박막을 얻을 수 있었다. 즉, EMF 시스템을 이용하여 저온 공정에서 결함농도가 적은 고품질의 ITO 초박막을 제작할 수 있었다.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.601-606
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• 2000

Nickel mono-silicide(NiSi) shows no increase of resistivity as the line width decreases below 0.15$\mu\textrm{m}$. Furthermore, thin silicide can be made easily and restrain the redistribution of dopants, because NiSi in created through the reaction of one nickel atom and one silicon atom. Therefore, we investigated the deposition condition of Ni films, heat treatment condition and basic properties of NiSi films which are expected to be employed for sub-0.15$\mu\textrm{m}$ class devices. The nickel silicide film was deposited on the Si wafer by using a dc-magnetron sputter, then annealed at the temperature range of $150~1000^{\circ}C$. Surface roughness of each specimen was measured by using a SPM (scanning probe microscope). Microstructure and qualitative composition analysis were executed by a TEM-EDS(transmission electron microscope-energy dispersive x-ray spectroscope). Electrical properties of the materials at each annealing temperature were measured by a four-point probe. As the results of our study, we may conclude that; 1. SPM can be employed as a non-destructive process to monitor NiSi/NiSi$_2$ transformation. 2. For annealing temperature over $800^{\circ}C$, oxygen pressure $Po_2$ should be kept below $1.5{\times}10^{-11}torr$ to avoid oxidation of residual Ni. 3. NiSi to $NiSi_2$ transformation temperature in our study was $700^{\circ}C$ from the four-point probe measurement.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.1 s.116
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• pp.62-75
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• 2007

This paper describes a shaped-beam antenna for increasing the antenna gain of a radiating element. The proposed antenna structure is composed of an exciting element and a multi-layered disk array structure(MDAS). The stack micro-strip patch elements were used as the exciter for effectively radiating the electromagnetic power to the MDAS over the broadband, and finite metallic disk array elements - which give the role of a director for shaping the antenna beam with the high gain - were finitely and periodically layered onto it. The efficient power coupling between the exciter and the MDAS should be carried out in such a way that the proposed antenna has a high gain characteristic. The design parameters of the exciter and the MDAS should be optimized together to meet the required specifications to meet the required specifications. In this study, a shaped-beam antenna with high gain was optimally designed under the operating conditions with a linear polarization and the frequency band of $9.6{\sim}10.4\;GHz$. Two methods constructed using thin dielectric film and dielectric foam materials respectively were also proposed in order to implement the MBAS of the antenna. In particular, through the computer simulation process, the electrical performance variations of the antenna with the MDAS realized by the thin dielectric film materials were shown according to the number of disk array elements in the stack layer. Two kinds of antenna breadboard with the MDAS realized with the thin dielectric film and dielectric foam materials were fabricated, but experimentation was conducted only on the antenna breadboard(Type 1) with the MDAS realized with the thin dielectric film materials according to the number of disk array elements in the stack layer in order to compare it with the electrical performance variations obtained during the simulation. The measured antenna gain performance was found to be in good agreement with the simulated one, and showed the periodicity of the antenna gain variations according to the stack layer number of the disk array elements. The electrical performance of the Type 1 antenna was measured at the center frequency of 10 GHz. As the disk away elements became the ten stacks, a maximum antenna gain of 15.65 dBi was obtained, and the measured return loss was not less than 11.4 dB within the operating band. Therefore, a 5 dB gain improvement of the Type 1 antenna can be obtained by the MDAS that is excited by the stack microstrip patch elements. As the disk array elements became the twelve stacks, the antenna gain of the Type 1 was measured to be 1.35 dB more than the antenna gain of the Type 2 by the outer dielectric ring effect, and the 3 dB beam widths measured from the two antenna breadboards were about $28^{\circ}$ and $36^{\circ}$ respectively.