• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.244-247
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• 1995

Physical, electrical and optical properties of Aluminum(Al) thin films were investigated in order to establish the optimum sputtering parameters in mirror reflection films. Al. thin films deposited on corning glass substrate by DC magnetron sputtering were grown as a variation of the input power, operation pressure and deposition time. The properties of the Al thin films have been discussed by deposition rate, SEM, XRD, sheet resistivity, resistivity and reflectance. Al thin films were obtained at the deposition conditions as follows: operating pressure, 3 mtorr; DC input power desnsitiy, 3W/$\textrm{cm}^2$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.10
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• pp.108-113
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• 1994

The characteristics of the oxidation prevention layers for the copper metallization were investigated. The thin films such as Cr, TiN and Al were used as the oxidation prevention layers for copper. Ultra thin aluminum films were found to prevent the oxidation of copper up to the highest oxidation annealing temperature among the barrier layers examined in this study. It was found that oxygen did not diffuse into copper through aluminum films because of the aluminum oxide layer formed on the aluminum surface and the ultra thin aluminum film could be a good oxidation barrier layer for the copper metallization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.268-268
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• 2010

AC anodizing on aluminum foil was investigated by the variation of AC voltage and frequency. The voltage and frequency were applied in the range of approximately 40~200V, 0~400Hz. The porous alumina film was formed and the growth rate of oxide film is increased with frequency. The structural property was analyzed by SEM and XRD. SEM results show the approximate relation between frequency, voltage and growth rate. The AC voltage effect on the structural modulation of porous alumina indicates that AC anodizing is useful for the application to nanocapacitor material.

• Proceedings of the KIEE Conference
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• 1993.11a
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• pp.258-260
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• 1993

Aluminum thin films were deposited on glass substrate using DC Magnetron Sputtering. Deposition rate, specular reflectance, and resistivity were investigated as a function of the input power, pressure, substrate temperature, and deposition time. Reflectance was reduced with increasing power, also with prolonging deposition time. Topography of the surface, which influences the properties such as electromigration, was observed from scanning electron microscope (SEM) and there was a close relation between the topography and measured reflectance.

• Transactions of Materials Processing
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• v.10 no.2
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• pp.91-100
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• 2001

A sectional FEA program is developed lot analyzing forming processes of sandwich sheets, which are intensively used recently as a lightweight material of an automobile body. The aluminum sandwich sheet consists of two aluminum skins and a polyprophylen core in between. The aluminum sandwich sheet is dominantly effected by the bending effects in small radius of curvature, so that an appropriate description of bending effects is required to analyze the forming processes. For the evaluation of bending effects, the bending equivalent forces are calculated from the bending moment computed using the curvature of the tool and are added to the membrane stretch forces. To verify the validity of the developed program the sectional FEA results in stretch/draw forming Processes of a square cup and draw forming Processes of an outer hood panel were compared with the measurements.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.142-142
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• 1999

열역학적 평형하에서 금(Au)은 사파이어(Sapphire: 다결정 Al203)와 반응을 하지 않으므로 접합성이 약하나 사파이어표면을 Ar 이온으로 에칭한후 금박막을 증착하였을 때 후 열처리 없이도 대단히 강한 접합(>70MPa)이 얻어졌다. 접합기구를 규명하기 위해 고 해상도 Auger 전자광분광기로 금/사파이어 쌍의 입계에 Ai-Al-O 화합물이 1-2 원자층 범위내에서 형성되어 있고 7KeV의 Ar 이온에너지로 3분간 조사하을 때 사파이어표면에 환원으로 인한 금속알루미늄이 형성되어 있음이 발견되었다. 이 이온조사로 인한 환원은 선택적 에칭으로 인한 것으로 TRIM 계산결과와도 일치하는 것이다. 따라서 금박막과 이온조사된 사파이어 사이의 강한 접합은 이온조사로 인한 사파이어 표면에 충돌할 때의 운동 에너지가 구동력이 되어 Au-Al-O 화합물의 형성으로 결론될 수 있다.

• Journal of the Korean Ceramic Society
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• v.31 no.5
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• pp.485-490
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• 1994

The reactive ion etching characteristics of aluminum oxide films, prepared by PECVD, were investigated in the CCl4 plasma. The atomic chlorine concentration and the DC self bias were determined at various etching conditions, and their effects on the etch rate of aluminum oxide film were studied. The bombarding energy of incident particles was found to play the more important role in determining the etch rate of aluminum oxide rather than the atomic chlorine concentration. It is considered to be because the bombardment of ions or neutral atoms breaks the strong Al-O bonds of aluminum oxide to help activate the formation reaction of AlCl3 which is the volatile etch product.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.114-117
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• 2020

In this study, we performed the deposition of Al thin film using a DC magnetron sputtering method. To evaluate electrical and structural properties, the growth conditions were changed in terms of two functions, namely, sputtering power ranging from 41.6 to 216 W and film growth rate ranging from 5.35 to 26.39 nm/min. The growth rate and the microstructure were characterized by a scanning electron microscopy and X-ray diffraction analysis. The plane of crystalline growth showed that the preferential (111) direction and defects due to the grain boundary increased with DC power. The resistivity of the Al film over 50 nm showed a constant value by horizontal grain growth. Our results can be applicable for the preparation of nano-templates for anodic aluminum oxide.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.31 no.9
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• pp.74-81
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• 1982

One of the stable thin film transistor fabricated by cadmium suifide with the anodized aluminium oxide as gate material. The principle of the operation for the device is based on the control mechanism of injected majority carricrs to the wide band gap semiconductor, that is cadmium sulfide, by means of the function of the gate control. The fabricated device constructed by evaporating CdS layer in the form of microcrystalline on the oxided thin film characterized by ea, 80 as voltage amplification factor, 1/100 mho as transconductance, 8 kohm as dynamic output resistance, furthermore gain band width products is about 15 MHz.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.106-108
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• 1994

Electromigration(EM) tests were carried out on Al and Cu films in HV systems to study surface migration. The Al films were made on oxidized silicon wafers by thermal evaporation, in-situ annealed at 300$^{\circ}C$, patterned, and EM tested at 260$^{\circ}C$ and 4.5MA/$\textrm{cm}^2$. SEM observation with back scattered electron mode on the EM tested Al films disclosed that thinning took place under the native Al oxide. In the case of Cu films, tested using in-situ TEM, thinning was also observed at the early stage of void formation even though the thinned areas were much less than those of the Al films.